Method of forming a three-dimensional sculpture
    1.
    发明申请
    Method of forming a three-dimensional sculpture 审中-公开
    形成三维雕塑的方法

    公开(公告)号:US20040183234A1

    公开(公告)日:2004-09-23

    申请号:US10392703

    申请日:2003-03-20

    发明人: Ovidiu Colea

    摘要: A method of forming a three-dimensional sculpture comprises the steps of providing a mold having a lining and a casting cavity, applying a powder to the mold lining, pouring a casting material into the casting cavity and curing the casting material to form a casting object, said powder being transferred to said casting object during curing of said casting material, and removing said casting object from said casting cavity to form a powder-laden three-dimensional sculpture.

    摘要翻译: 一种形成三维雕塑的方法包括以下步骤:提供具有衬里和铸造腔的模具,向模具衬里施加粉末,将铸造材料浇铸到铸造腔中并固化铸造材料以形成铸造物体 所述粉末在所述铸造材料的固化期间被转移到所述铸件上,并且从所述铸造腔中移除所述铸件以形成粉末状的三维雕塑。

    Method for rapid forming of a ceramic green part
    2.
    发明申请
    Method for rapid forming of a ceramic green part 审中-公开
    陶瓷绿色部件的快速成型方法

    公开(公告)号:US20040075197A1

    公开(公告)日:2004-04-22

    申请号:US10274138

    申请日:2002-10-21

    发明人: Hwa-Hsing Tang

    CPC分类号: B28B1/001 B29C64/165

    摘要: This invention provides a process for rapid forming of a ceramic green part. It is based upon an effect, that nano-scaled oxide colloid can be gelled by drying. Slurry can be obtained by mixing the oxide colloid with ceramic powder and dissolved agent. After paving a slurry film on a platform, a focused high-energy beam scans over the surface of said slurry film; the irradiated portion will be dried and build a two-dimensional (2-D) pattern. In addition, another slurry film is paved on the finished 2-D pattern layer. The high-energy beam scans once more on slurry film locally; another 2-D pattern is built. This built pattern can be connected with the pattern beneath it. After multiple repetitions of this procedure a three-dimensional (3-D) part can be formed. Because gelling is an irreversible reaction, the gelled portion of slurry won't be dissolved in water. Therefore, the non-gelled slurry can be separated from the gelled ceramic green part by flushing.

    摘要翻译: 本发明提供一种快速成型陶瓷绿色部件的方法。 它是基于一种效果,纳米级氧化物胶体可通过干燥而凝胶化。 可以通过将氧化物胶体与陶瓷粉末和溶解剂混合来获得浆料。 在平台上铺设浆料膜之后,聚焦的高能束扫描在所述浆料膜的表面上; 照射部分将被干燥并构成二维(2-D)图案。 另外,在完成的2-D图案层上铺设另一浆料膜。 高能束在局部浆料膜上再一次扫描; 另外建立了2-D模式。 这种内置图案可以与其下方的图案相连。 在多次重复该过程之后,可以形成三维(3-D)部分。 因为胶凝是不可逆的反应,所以浆料的胶凝部分不会溶解在水中。 因此,可以通过冲洗将非胶凝浆料与凝胶状陶瓷绿色部分分离。

    Conductive seal as well as a method and apparatus for its production
    3.
    发明申请
    Conductive seal as well as a method and apparatus for its production 失效
    导电密封以及其生产的方法和装置

    公开(公告)号:US20040012158A1

    公开(公告)日:2004-01-22

    申请号:US10419804

    申请日:2003-04-22

    发明人: Alexander Neuhaus

    IPC分类号: F16J015/53 H05B006/00

    摘要: A conductive seal that is formed on a first sealing surface by extruding an elastically curing material intermixed with conductive particles is in addition intermixed with magnetic particles. After applying the material to the first sealing surface, its cross section profile is expanded to an adjustable level towards a second sealing surface and/or sealing rims are molded to it by a magnetic force from an electromagnetic plate. The magnetic and conductive particles are preferably concentrated in the marginal sections, particularly due to magnetic forces that act on the sealing roving in the extrusion process.

    摘要翻译: 通过挤出与导电颗粒混合的弹性固化材料形成在第一密封表面上的导电密封件另外与磁性颗粒混合。 在将材料施加到第一密封表面之后,其横截面轮廓被扩展到朝向第二密封表面的可调节水平,和/或通过来自电磁板的磁力将密封轮缘模制到其上。 磁性和导电颗粒优选地集中在边缘部分中,特别是由于在挤出过程中作用在密封粗纱上的磁力。

    Method for encapsulating an electrical component and surface wave component thus encapsulated
    9.
    发明申请
    Method for encapsulating an electrical component and surface wave component thus encapsulated 有权
    用于封装由此封装的电气部件和表面波部件的方法

    公开(公告)号:US20040239449A1

    公开(公告)日:2004-12-02

    申请号:US10491056

    申请日:2004-03-29

    IPC分类号: H05B006/00 H03H009/54

    摘要: An encapsulation method for sensitive composition is provided in which a film, in particular a plastic film, is laminated over the entire surface of an arrangement having a component mounted on a carrier in a flip chip construction. For additional sealing and mechanical stabilization, a plastic compound in liquid form is subsequently applied and hardened so as to surround the chip. Optionally, before the application of the plastic compound, the film can be removed in the area of structuring lines in such a way that the plastic compound can come into contact both with the carrier and with the chip surface.

    摘要翻译: 提供了一种用于敏感组合物的封装方法,其中在具有以倒装芯片结构安装在载体上的部件的布置的整个表面上层压膜,特别是塑料膜。 为了进一步的密封和机械稳定化,随后施加液体形式的塑料化合物并硬化以包围芯片。 任选地,在施加塑料化合物之前,可以在构造线的区域中去除膜,使得塑料化合物可以与载体和芯片表面接触。