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    CURABLE HOT-MELT SILICONE COMPOSITION, CURED MATERIAL THEREOF, AND LAMINATE CONTAINING CURABLE HOT-MELT SILICONE COMPOSITION OR CURED MATERIAL THEREOF
    1.
    发明申请
    CURABLE HOT-MELT SILICONE COMPOSITION, CURED MATERIAL THEREOF, AND LAMINATE CONTAINING CURABLE HOT-MELT SILICONE COMPOSITION OR CURED MATERIAL THEREOF 有权

    公开(公告)号：US20230137947A1

    公开(公告)日：2023-05-04

    申请号：US17788121

    申请日：2020-12-28

    申请人： DOW TORAY CO., LTD.

    发明人： Ryosuke YAMAZAKI ,  Kouichi OZAKI ,  Toru IMAIZUMI

    IPC分类号： C08L83/04 ,  C08J5/18 ,  C09J183/04 ,  C09J7/10 ,  C09J7/35 ,  C09J7/40 ,  B32B25/20

    摘要： A curable hot-melt silicone composition that is less susceptible to curing inhibition and with excellent storage stability, and a sheet or film containing the same, is provided. The composition comprises: (A) a solid organopolysiloxane resin containing a specific ratio of (A1) an organopolysiloxane resin having a curing reactive functional group that contains a carbon-carbon double bond and containing 20 mol % or more of a Q unit, and (A2) an organopolysiloxane resin not having a curing reactive functional group that contains a carbon-carbon double bond and containing 20 mol % or more of a Q unit; (B) a chain organopolysiloxane having a curing reactive functional group that contains at least two carbon-carbon double bonds; (C) an organohydrogenpolysiloxane resin having a mass loss ratio relative to pre-exposure of 10% or less after exposure to 100° C. for 1 hour under atmospheric pressure; and (D) a hydrosilylation reaction catalyst. The composition generally has hot-melt properties.

    ADHESIVE TAPE AND ELECTRONIC DEVICE
    3.
    发明申请
    ADHESIVE TAPE AND ELECTRONIC DEVICE 有权

    公开(公告)号：US20230022110A1

    公开(公告)日：2023-01-26

    申请号：US17808791

    申请日：2022-06-24

    申请人： DIC Corporation

    发明人： Yoshimi Furukawa ,  Yuuya Kitade ,  Yuusuke Takahashi ,  Takeshi Iwasaki

    IPC分类号： C09J7/26 ,  C09J7/50 ,  C09J183/04 ,  C09J11/06

    摘要： Provided is an adhesive tape that has satisfactory conformability to a high step of an adherend while maintaining high impact resistance, and has removable performance that enables easy peeling when articles, such as electronic devices, are disassembled. The adhesive tape has an adhesive layer on one side or both sides of a foam base directly or with another layer interposed therebetween. The foam base has a tensile strength of 650 N/cm2 or more in a flow direction, a compressive strength at 25% of 1000 kPa or less, and a density of 0.35 g/cm3 to 0.90 g/cm3.

    Curable organopolysiloxane composition and a protectant or adhesive composition of electric/electronic parts
    4.
    发明授权
    Curable organopolysiloxane composition and a protectant or adhesive composition of electric/electronic parts 有权

    公开(公告)号：US11555118B2

    公开(公告)日：2023-01-17

    申请号：US16607020

    申请日：2017-08-24

    申请人： DOW TORAY CO., LTD.

    发明人： Toyohiko Fujisawa ,  Masayuki Onishi

    IPC分类号： C08L83/04 ,  C09D183/04 ,  C09J183/04 ,  H01L23/29 ,  H05K5/06

    摘要： Provided is a curable organopolysiloxane composition which has a particularly excellent effect of improving initial adhesiveness in small amounts and a thin layer with respect to various base materials, in addition to being able to achieve particularly excellent adhesive durability and high adhesive strength after curing. The curable organopolysiloxane composition comprises: (A) an organopolysiloxane having at least two alkenyl groups per one molecule; (B) a trialcoxysilyl containing siloxane having one silicon atom-bonded hydrogen atom and at least one trialcoxysilyl group per one molecule; (C) a chain or cyclic organopolysiloxane having at least two silicon atom-bonded hydrogen atoms per one molecule; (D) a chain organopolysiloxane having at least three silicon atom-bonded hydrogen atoms per one molecule; (E) a catalyst for a hydrosilylation reaction; (F) a catalyst for a condensation reaction; and (G) an adhesion promoter.