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    Composite electronic component
    1.
    发明授权
    Composite electronic component 有权

    公开(公告)号：US10658737B2

    公开(公告)日：2020-05-19

    申请号：US16103123

    申请日：2018-08-14

    申请人： TDK CORPORATION

    发明人： Yuta Ashida ,  Yasuyuki Hara ,  Toshiki Tate

    IPC分类号： H01Q9/04 ,  H01Q1/36 ,  H01P1/20 ,  H01P3/18 ,  H01Q1/48 ,  H01P1/203 ,  H01P5/107 ,  H01Q21/06 ,  H01Q1/52

    摘要： A composite electronic component includes a multilayer stack, a filter, and an antenna. The filter is located within the multilayer stack and interposed between a first ground conductor layer and a second ground conductor layer. The antenna includes a radiation element. The radiation element is located on a side of the second ground conductor layer opposite from the first ground conductor layer. When viewed in a direction parallel to the stacking direction of the multilayer stack, the radiation element entirely lies inside the perimeter of the second ground conductor layer. The multilayer stack includes a plurality of connection conductor sections arranged around the filter and connecting the first ground conductor layer and the second ground conductor layer.

    Microwave transmission line
    3.
    发明申请
    Microwave transmission line 有权
    微波传输线

    公开(公告)号：US20050156691A1

    公开(公告)日：2005-07-21

    申请号：US11033803

    申请日：2005-01-13

    申请人： Tsutomu Takenaka

    发明人： Tsutomu Takenaka

    IPC分类号： H01L23/522 ,  H01L21/768 ,  H01L21/822 ,  H01L27/04 ,  H01P3/00 ,  H01P3/02 ,  H01P3/08 ,  H01P3/18

    CPC分类号： H01P3/003 ,  H01P3/081

    摘要： A microwave transmission line includes a substrate of high-resistivity silicon, a first dielectric film and a second dielectric film successively formed on the principal surface of the substrate and having different compositions, and a conductor film formed with at least the first dielectric film interposed between the conductor film and the substrate. One of the first and second dielectric films has positive space charges and the other has negative space charges. A signal electric field propagates through the substrate, the first dielectric film and the second dielectric film.

    摘要翻译： 微波传输线包括高电阻率硅基片，第一电介质膜和第二电介质膜，该第一电介质膜和第二电介质膜依次形成在基片的主表面上且具有不同的组成，导电膜至少形成有介于 导体膜和基板。 第一和第二电介质膜之一具有正空间电荷，另一个具有负空间电荷。 信号电场通过衬底，第一介电膜和第二电介质膜传播。

    Method for creating waveguides in multilayer ceramic structures and a waveguide having a core bounded by air channels
    4.
    发明授权
    Method for creating waveguides in multilayer ceramic structures and a waveguide having a core bounded by air channels 失效
    用于在多层陶瓷结构中制造波导的方法和具有由空气通道限定的芯的波导

    公开(公告)号：US06909345B1

    公开(公告)日：2005-06-21

    申请号：US10030502

    申请日：2000-07-10

    申请人： Olli Salmela ,  Esa Kemppinen ,  Hans Somerma ,  Pertti Ikäläinen ,  Markku Koivisto

    发明人： Olli Salmela ,  Esa Kemppinen ,  Hans Somerma ,  Pertti Ikäläinen ,  Markku Koivisto

    IPC分类号： H01P3/12 ,  H01P11/00 ,  H01P3/18

    CPC分类号： H01P3/121 ,  Y10T29/49016

    摘要： The invention relates to a waveguide manufacturing and a waveguide manufactured with the method, which can be integrated into a circuit structure manufactured with the multilayer ceramic technique. The core part (23, 33, 43, 53a, 53b, 53c) of the waveguide is formed by a unit assembled of ceramic layers, which is limited in the yz plane by two impedance discontinuities and in the xz plane by two planar surfaces (24, 25, 34, 35, 54a, 54c, 55a, 55b, 55c) made of conductive material. The conductive surfaces can be connected to each other by vias made of conductive material (38, 39, 48, 49). The waveguide manufactured with the method according to the invention is a fixed part of the circuit structure as a whole.

    摘要翻译： 本发明涉及一种使用该方法制造的波导制造和波导，其可以集成到由多层陶瓷技术制造的电路结构中。 波导的核心部分（23,33,43,53a，53b，53c）由陶瓷层组成的单元形成，陶瓷层在yz平面中受到两个阻抗不连续的限制，在xz平面上被两个 由导电材料制成的平面（24,25,34,35,54a，54c，55a，55b，55c）。 导电表面可以通过由导电材料（38,39,48,49）制成的通孔彼此连接。 使用根据本发明的方法制造的波导作为整体的电路结构的固定部分。

    Multiple-layer microstrip assembly with inter-layer connections
    5.
    发明授权
    Multiple-layer microstrip assembly with inter-layer connections 失效
    具有层间连接的多层微带线组件

    公开(公告)号：US5309122A

    公开(公告)日：1994-05-03

    申请号：US967828

    申请日：1992-10-28

    申请人： Brian J. Cox ,  Russell W. Johnson ,  Patrick Westfeldt, Jr.

    发明人： Brian J. Cox ,  Russell W. Johnson ,  Patrick Westfeldt, Jr.

    IPC分类号： H01P3/08 ,  H01P5/02 ,  H01P11/00 ,  H01P5/18 ,  H01P3/18

    CPC分类号： H01P3/081 ,  H01P11/00 ,  H01P3/088 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/4824 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/3011 ,  Y10T29/49126

    摘要： A multiple-layer microstrip assembly having an inter-layer connection for transitioning electrical signals between analogous surfaces of separate layers, comprising a plurality of layers, each having a top surface and a bottom surface; first top circuitry disposed on the first top surface of a first layer; first bottom circuitry disposed on the first bottom surface of the first layer; connecting means for electrically connecting the first top circuitry to the first bottom circuitry; second top circuitry disposed on the second top surface of a second layer; and binding means to hold the two layers together, wherein the first bottom circuitry is sufficiently adjacent and overlapping the second top circuitry to form an electrical connection therebetween, thereby forming a signal transition between the first top surface of the first layer and the second top surface of the second layer.

    摘要翻译： 一种多层微带组件，具有用于在分离层的类似表面之间转换电信号的层间连接，包括多个层，每个层具有顶表面和底表面; 设置在第一层的第一顶表面上的第一顶部电路; 第一底部电路设置在第一层的第一底表面上; 连接装置，用于将第一顶部电路电连接到第一底部电路; 设置在第二层的第二顶表面上的第二顶部电路; 以及用于将两层保持在一起的装订装置，其中第一底部电路充分相邻并且与第二顶部电路重叠以在其间形成电连接，从而在第一层的第一顶表面和第二顶表面之间形成信号转变 的第二层。

    Stacked differentially driven transmission line on integrated circuit
    6.
    发明授权
    Stacked differentially driven transmission line on integrated circuit 失效
    集成电路上堆叠的差分驱动传输线

    公开(公告)号：US4626889A

    公开(公告)日：1986-12-02

    申请号：US682938

    申请日：1984-12-18

    申请人： Masakazu Yamamoto ,  Akira Masaki ,  Ryotaro Kamikawai

    发明人： Masakazu Yamamoto ,  Akira Masaki ,  Ryotaro Kamikawai

    IPC分类号： H01L21/3205 ,  H01L23/52 ,  H01L23/522 ,  H01L23/64 ,  H01P3/08 ,  H01P3/18

    CPC分类号： H01L23/64 ,  H01L23/522 ,  H01L2924/0002 ,  H01L2924/3011

    摘要： A semiconductor integrated circuit structure including a semiconductor substrate having a large area adapted for a large scale integration, a circuit formed in the substrate for generating a pair of complementary signals, a pair of common potential level layers with an electrically insulating layer interposed therebetween, the common potential level layers being formed above and being electrically insulated from the substrate, and a pair of electric conductor pattern layers formed in the insulating layer for conducting the pair of complementary signals. The electric conductor pattern layers are arranged so as to be overlapped with each other in a direction substantially perpendicular to the large area substrate and so as to be substantially parallel with the large area substrate. The overall length of the electric conductor pattern layers is such that when an electric signal is conducted through an electric conductor in an IC having a length equal to the above-mentioned overall length, attenuation of the signal thereby is not negligible.

    摘要翻译： 一种半导体集成电路结构，包括具有适合于大规模集成的大面积的半导体衬底，形成在用于产生一对互补信号的衬底中的电路，一对具有介于其间的电绝缘层的公共电位电平层， 公共电位层形成在上方并与衬底电绝缘，以及一对电导体图案层，形成在绝缘层中，用于引导该对互补信号。 电导体图案层被布置成在与大面积基板大致垂直的方向上彼此重叠，并且与大面积基板大致平行。 电导体图形层的总长度使得当电信号通过长度等于上述总长度的IC中的导电体传导时，信号的衰减不可忽略。

    Flat transmission path for communication system
    7.
    发明授权
    Flat transmission path for communication system 失效
    通信系统平面传输路径

    公开(公告)号：US4233577A

    公开(公告)日：1980-11-11

    申请号：US47586

    申请日：1979-06-11

    申请人： Dalmazio Raveglia ,  Carlo Lonati ,  Giancarlo Macchi

    发明人： Dalmazio Raveglia ,  Carlo Lonati ,  Giancarlo Macchi

    IPC分类号： H01P3/18 ,  H01P3/00 ,  H04B3/32 ,  H04J3/02 ,  H01P5/12 ,  H01B11/00

    CPC分类号： H04B3/32 ,  H01P3/00 ,  H04J3/02

    摘要： A transmission path for a pulse-type communication system comprises two flat outer conductors and one flat inner conductor separated from one another by layers of dielectric material such as Teflon. The maximum effective thickness of the conductors is on the order of magnitude of the penetration depth of the current. The stack of conductive and nonconductive layers is flanked by two ferrite strips of the same height as the stack and in contact therewith, these strips serving to gather the laterally emanating lines of force into closed loops alongside the stack. At least one of the strips may be subdivided into sections separated by gaps through which branch leads can extend into contact with the flat conductors.

    摘要翻译： 用于脉冲型通信系统的传输路径包括两个平坦的外部导体和一个平坦的内部导体，这些导电体通过介电材料（例如特氟隆）的层彼此分开。 导体的最大有效厚度在电流的穿透深度的数量级上。 导电层和非导电层的堆叠侧面是两个与堆叠高度相同的铁氧体条，并且与其接触，这些条用于将横向发射的线束收集在堆叠旁边的闭环中。 至少一个条可以被分隔开的部分分开，间隙通过该间隙分支引线可以延伸成与扁平导体接触。