公开(公告)号：WO2014137288A1

公开(公告)日：2014-09-12

申请号：PCT/SG2014/000066

申请日：2014-02-19

Applicant: HERAEUS MATERIALS SINGAPORE PTE.LTD.

Inventor： CHEW, Yeong Huey ,  SARANGAPANI, Murali ,  MILKE, Eugen

IPC: H01L23/49 ,  C22C9/00 ,  H01L21/60

CPC classification number: C22C9/00 ,  C22C5/04 ,  H01L24/05 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/4312 ,  H01L2224/4321 ,  H01L2224/4382 ,  H01L2224/43848 ,  H01L2224/43985 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/45664 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48824 ,  H01L2224/48844 ,  H01L2224/85099 ,  H01L2224/85205 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/01047 ,  H01L2924/01015 ,  H01L2924/013 ,  H01L2924/00013 ,  H01L2924/01203 ,  H01L2924/01201 ,  H01L2924/2075 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20109 ,  H01L2924/00015 ,  H01L2924/20303 ,  H01L2924/20304 ,  H01L2924/20305 ,  H01L2924/01204 ,  H01L2924/01202 ,  H01L2924/00 ,  H01L2924/2011 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01034

Abstract: The invention is related to a bonding wire, comprising a core (2) with a surface, wherein the core (2) comprises copper as a main component, and a coating layer (3) superimposed over the surface of the core (2), wherein the coating layer (3) comprises palladium as a main component, wherein the core (2) comprises at least 5 wt. ppm silver and at least 20 wt. ppm phosphorus as further components, wherein the wire meets the relation 0.000025

Abstract translation: 本发明涉及一种接合线，其包括具有表面的芯（2），其中所述芯（2）包括铜作为主要成分，以及叠层在所述芯（2）的表面上的涂层（3） 其中所述涂层（3）包含钯作为主要组分，其中所述芯（2）包含至少5重量％ ppm银和至少20wt。 ppm磷作为其他组分，其中线满足关系0.000025

公开(公告)号：WO2014137286A1

公开(公告)日：2014-09-12

申请号：PCT/SG2014/000064

申请日：2014-02-19

Applicant: HERAEUS MATERIALS SINGAPORE PTE.LTD.

Inventor： CHEW, Yeong, Huey ,  SARANGAPANI, Murali ,  MILKE, Eugen

IPC: H01L23/49 ,  C22C9/00 ,  H01L21/60

CPC classification number: H01L24/43 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/4312 ,  H01L2224/4321 ,  H01L2224/4382 ,  H01L2224/43848 ,  H01L2224/43985 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/45664 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48824 ,  H01L2224/48844 ,  H01L2224/85099 ,  H01L2224/85205 ,  H01L2924/00011 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/01047 ,  H01L2924/01015 ,  H01L2924/01203 ,  H01L2924/01201 ,  H01L2924/2075 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20109 ,  H01L2924/00014 ,  H01L2924/20303 ,  H01L2924/20304 ,  H01L2924/20305 ,  H01L2924/01204 ,  H01L2924/01202 ,  H01L2924/013 ,  H01L2924/00013 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2924/2011 ,  H01L2924/00012 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01034

Abstract: The invention is related to a bonding wire, comprising a core (2) with a surface, wherein the core comprises copper as a main component, and a coating layer (3) superimposed over the surface of the core (2), wherein the coating layer (3) comprises palladium as a main component, wherein the core (2) comprises at least 5 wt.ppm silver and at least 20 wt. ppm phosphorus as further components, wherein the wire meets the relation 0.0008

Abstract translation: 本发明涉及一种接合线，其包括具有表面的芯（2），其中所述芯包括铜作为主要成分，以及重叠在所述芯（2）的表面上的涂层（3），其中所述涂层 层（3）包括钯作为主要成分，其中芯（2）包含至少5重量ppm的银和至少20重量％ ppm磷作为其他组分，其中线满足关系0.0008