公开(公告)号：WO2019022860A1

公开(公告)日：2019-01-31

申请号：PCT/US2018/038005

申请日：2018-06-18

Applicant: HRL LABORATORIES, LLC

Inventor： YI, Wei ,  TSANG, Kenneth, K. ,  LAM, Stephen, K. ,  BAI, Xiwei ,  CROWELL, Jack, A. ,  FLORES, Elias, A.

IPC: H01L45/00

Abstract: A vanadium dioxide (VO 2 )-based threshold switch device exhibiting current-controlled negative differential resistance (S-type NDR), an electrical oscillator circuit based on the threshold switch device, a wafer including a plurality of said devices, and a method of manufacturing said device are provided. The VO 2 -based threshold switch device exhibits volatile resistance switching and current-controlled negative differential resistance from the first time a sweeping voltage or voltage pulse is applied across the device without being treated with an electroforming process. Furthermore, the device exhibits substantially identical switching characteristics over at least 10 3 switching operations between a high resistance state (HRS) and a low resistance state (LRS), and a plurality of threshold switch devices exhibits a threshold voltage VT spreading of less than about 25%. The threshold switch device may be included in an oscillator circuit to produce an astable oscillator that may serve as a functional building block in spiking-neuron based neuromorphic computing.

公开(公告)号：WO2013176906A1

公开(公告)日：2013-11-28

申请号：PCT/US2013/040447

申请日：2013-05-09

Applicant: HRL LABORATORIES, LLC

Inventor： KHALIL, Sameh ,  BOUTROS, Karim S.

IPC: H01L29/778 ,  H01L21/335

CPC classification number: H01L29/66462 ,  H01L21/0274 ,  H01L21/3085 ,  H01L21/31144 ,  H01L29/0657 ,  H01L29/2003 ,  H01L29/4236 ,  H01L29/7786

Abstract: A HEMT device has a substrate; a buffer layer disposed above the substrate; a carrier supplying layer disposed above the buffer layer; a gate element penetrating the carrier supplying layer; and a drain element disposed on the carrier supplying layer. The carrier supplying layer has a non-uniform thickness between the gate element and the drain element, the carrier supplying layer having a relatively greater thickness adjacent the drain element and a relatively thinner thickness adjacent the gate element. A non-uniform two-dimensional electron gas conduction channel is formed in the carrier supplying layer, the two-dimensional electron gas conduction channel having a non-uniform profile between the gate and drain elements.

Abstract translation: HEMT装置具有基板; 设置在所述基板上方的缓冲层; 设置在所述缓冲层上方的载体供给层; 穿过载体供给层的栅极元件; 以及设置在载体供给层上的漏极元件。 载体供应层在栅极元件和漏极元件之间具有不均匀的厚度，载体供应层具有与漏极元件相邻的相对较大的厚度，并且邻近栅极元件具有相对较薄的厚度。 在载体供给层中形成不均匀的二维电子气导电通道，二维电子气导电通道在栅极和漏极元件之间具有不均匀的轮廓。

公开(公告)号：WO2010096085A1

公开(公告)日：2010-08-26

申请号：PCT/US2009/054068

申请日：2009-08-17

Applicant: SAFARILAND, LLC ,  KRAMER, Michael ,  RUTZ, Corey

Inventor： KRAMER, Michael ,  RUTZ, Corey

IPC: B67D1/04

CPC classification number: F42C17/02 ,  F42B12/40 ,  F42B12/46 ,  F42B12/50 ,  F42C11/001 ,  F42C11/065 ,  F42C17/04 ,  F42C19/02 ,  F42C19/06

Abstract: A non-lethal projectile used to immobilize, impair, disorient, or distract a live target. The non-lethal projectile can also be used as a signaling device. In one embodiment, a non-lethal payload carrying projectile that is detonated at a set distance determined and set by the operator. The distance is electronically controlled and can be set in the field seconds before the projectile is fired.

Abstract translation: 用于固定，损害，迷失方向或分散现场目标的非致命射弹。 非致死弹丸也可以用作信号装置。 在一个实施例中，一个非致命的有效载荷的载体在被操作者确定和设定的设定距离处被引爆。 距离是电子控制的，可以在射弹射出之前的几秒钟内设置。

公开(公告)号：WO2008153939A1

公开(公告)日：2008-12-18

申请号：PCT/US2008/007118

申请日：2008-06-06

Applicant: DYNAMIC DETAILS, INC. ,  SIDHU, Rajwant, Singh

Inventor： SIDHU, Rajwant, Singh

IPC: C23C18/16 ,  H05K3/18

CPC classification number: H05K3/427 ,  H05K1/116 ,  H05K3/243 ,  H05K3/4602 ,  H05K2201/0347 ,  H05K2201/0959 ,  H05K2203/025 ,  H05K2203/0554 ,  H05K2203/1476 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: Printed circuit boards have circuit layers with one or more via filled holes with copper wraps and methods of manufacturing the same. An embodiment of the present invention provides a method to enhance the consistency of the wraparound plating of through-hole vias of printed circuit boards with (requiring) via filling to provide extra reliability to the printed circuit boards and enables the designers and/or manufacturers of printed circuit boards to design and manufacture boards with relatively fine features and/or tight geometries.

Abstract translation: 印刷电路板具有带铜箔的一个或多个通孔填充孔的电路层及其制造方法。 本发明的实施例提供了一种通过（需要）通过填充来提高印刷电路板的通孔通孔的环绕电镀的一致性的方法，以向印刷电路板提供额外的可靠性，并且使设计者和/或制造商 印刷电路板设计和制造具有相对精细特征和/或紧密几何形状的电路板。

公开(公告)号：WO2016025058A1

公开(公告)日：2016-02-18

申请号：PCT/US2015/034242

申请日：2015-06-04

Applicant: HRL LABORATORIES, LLC

Inventor： CLOUGH, Eric, C. ,  HUNDLEY, Jacob, M. ,  CHANG, Chia-ming, Gavin ,  JACOBSEN, Alan, J.

IPC: B32B3/12 ,  G10K11/172

CPC classification number: B32B3/12 ,  B32B1/00 ,  B32B3/08 ,  B32B7/045 ,  B32B7/12 ,  B32B9/005 ,  B32B15/043 ,  B32B15/08 ,  B32B15/20 ,  B32B2250/40 ,  B32B2255/06 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2305/024 ,  B32B2307/102 ,  B32B2307/206 ,  B32B2307/50 ,  B32B2307/51 ,  B32B2307/542 ,  B32B2307/546 ,  B32B2605/00 ,  B32B2607/00 ,  E04B1/86 ,  G10K11/168

Abstract: A sandwich material having both structural strength and significant acoustic attenuation. In one embodiment, a sandwich is composed of an architected core secured between two facesheets, with a compliant layer forming the connection between the core and the facesheets. The compliant core has a low modulus, resulting in a low speed for elastic shear waves in the sandwich, at low static loads. At high static loads the compliant material stiffens and allows the sandwich to exhibit significant structural strength.

Abstract translation: 具有结构强度和显着声衰减的夹心材料。 在一个实施例中，三明治由固定在两个面板之间的结构化芯构成，柔性层形成芯和面板之间的连接。 柔性芯具有低模量，导致在低静态载荷下三明治中的弹性剪切波的低速度。 在高静态载荷下，柔性材料变硬并允许三明治显示出显着的结构强度。

公开(公告)号：WO2010019820A1

公开(公告)日：2010-02-18

申请号：PCT/US2009/053783

申请日：2009-08-13

Applicant: DYNAMIC DETAILS, INC. ,  KUMAR, Raj ,  DREYER, Monte ,  TAYLOR, Michael, J. ,  ZEPEDA, Ruben

Inventor： KUMAR, Raj ,  DREYER, Monte ,  TAYLOR, Michael, J. ,  ZEPEDA, Ruben

IPC: H05K1/11 ,  H05K1/03

CPC classification number: H05K3/4614 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/427 ,  H05K3/429 ,  H05K3/462 ,  H05K3/4623 ,  H05K2201/0195 ,  H05K2201/0352 ,  H05K2201/09454 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09736 ,  H05K2201/09845 ,  H05K2203/0191 ,  H05K2203/0554 ,  H05K2203/061 ,  H05K2203/1152 ,  Y10T29/49128 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: Methods of manufacturing at least a portion of a printed circuit board. The circuit board is formed to include a plurality of sub-assemblies, each of the sub-assemblies including a plurality of circuit layers and having at least one countersink and at least one hole, the countersink having a first diameter and a first depth from a first side of at least one of the sub-assemblies and into the at least one sub-assembly, the hole having a second diameter smaller than the first diameter and a second depth longer than the first depth from the first side of the at least one sub-assembly and into the at least one sub-assembly at the countersink; a metal metalized within the hole and the countersink; a lamination adhesive interposed between one and a corresponding one of the sub-assemblies and having at least one via formed there through; and a counter paste filled within the via.

Abstract translation: 制造印刷电路板的至少一部分的方法。 电路板形成为包括多个子组件，每个子组件包括多个电路层并且具有至少一个埋头孔和至少一个孔，该埋头孔具有第一直径和从第一深度 至少一个子组件的第一侧并且进入至少一个子组件，该孔具有小于第一直径的第二直径和比从至少一个子组件的第一侧的第一深度更长的第二深度 子组件并进入至少一个子组件在锪孔处; 孔内金属化和埋头孔; 插入在一个和相应的一个子组件之间且在其中形成有至少一个通孔的层压粘合剂; 以及填充在通孔内的计数器糊状物。

公开(公告)号：WO2008079391A1

公开(公告)日：2008-07-03

申请号：PCT/US2007/026282

申请日：2007-12-20

Applicant: ARIZONA BOARD OF REGENTS FOR AND ON BEHALF OF ASU ,  DIAZ, Rodolfo ,  PEEBLES, Jeffrey ,  LEBARON, Richard ,  ORNENO, Richard

Inventor： DIAZ, Rodolfo ,  PEEBLES, Jeffrey ,  LEBARON, Richard ,  ORNENO, Richard

IPC: G01R19/15

CPC classification number: G01N27/9006

Abstract: A linearly polarized eddy current sensor including a source antenna and a parasitic antenna coupled to the source antenna, serves as a high sensitivity tool for the measurement of the surface impedance of sheet goods without requiring contact with the sample. Sheet goods can have an anisotropic, frequency-dependent surface impedance that is sensitive to minor changes in configuration of the sample. Because the electric field induced by the sensor is linearly polarized, measurement of directionally dependent sheet impedance can be achieved. The measurement is performed with the resonant device operating in resonance mode whereby the immediate proximity of the material to be measured causes damping and shifting of the coupled loop resonance. The resonant frequency of the sensor can be tuned by making changes to its geometry.

Abstract translation: 包括源天线和耦合到源天线的寄生天线的线性极化涡流传感器用作用于测量片材的表面阻抗的高灵敏度工具，而不需要与样品接触。 片状物品可具有各向异性，频率依赖性的表面阻抗，对于样品配置的微小变化敏感。 由于传感器感应的电场是线性极化的，因此可以实现方向依赖片材阻抗的测量。 谐振装置以谐振模式工作进行测量，由此所要测量的材料的紧邻将导致耦合的环路谐振的阻尼和移位。 可以通过改变传感器的几何形状来调节传感器的谐振频率。

公开(公告)号：WO2007124146A2

公开(公告)日：2007-11-01

申请号：PCT/US2007/009819

申请日：2007-04-19

Applicant: DYNAMIC DETAILS, INC. ,  KUMAR, Raj ,  DREYER, Monte ,  TAYLOR, Michael, J.

Inventor： KUMAR, Raj ,  DREYER, Monte ,  TAYLOR, Michael, J.

IPC: H05K1/11

CPC classification number: H05K3/4623 ,  H05K3/205 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/423 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/462 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09309 ,  H05K2201/096 ,  H05K2203/0191 ,  H05K2203/0271 ,  H05K2203/0502 ,  H05K2203/061 ,  H05K2203/0733 ,  H05K2203/107 ,  H05K2203/1461 ,  H05K2203/1536 ,  H05K2203/304 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: Printed circuit boards having circuit layers laminated with stacked (or staggered) micro via(s) and methods of manufacturing the same. Aspects of embodiments of the present invention are directed to a printed circuit board with Z-axis interconnect(s) or micro via(s) that can eliminate a need for plating micro vias and/or eliminate a need for planarizing plated bumps of a surface, that can be fabricated with one or two lamination cycles, and/or that can have carrier-to-carrier (or substrate-to-substrate) attachments with conductive vias, each filled with a conductive material (e.g., with a conductive paste) in the Z-axis. In one embodiment, a printed circuit board having a plurality of circuit layers with at least one z-axis interconnect can be fabricated using a single lamination cycle.

Abstract translation: 具有层叠有（或交错）微通道的电路层的印刷电路板及其制造方法。 本发明的实施例的方面涉及具有Z轴互连或微通道的印刷电路板，其可以消除对电镀微通孔的需要和/或消除对平面化电镀凸块的需要 ，可以用一个或两个层压循环制造，和/或可以具有导电通孔的载流子到载体（或基底对基底）附件，每个填充有导电材料（例如，使用导电浆料） 在Z轴上。 在一个实施例中，可以使用单个层压循环来制造具有具有至少一个z轴互连的多个电路层的印刷电路板。

公开(公告)号：WO2007095026A2

公开(公告)日：2007-08-23

申请号：PCT/US2007/003251

申请日：2007-02-05

Applicant: ALL PROTECT, LLC ,  WHITE, Steve ,  DORIN, Michael ,  NOTO, John

Inventor： WHITE, Steve ,  DORIN, Michael ,  NOTO, John

IPC: A63H27/00

CPC classification number: B60R25/25 ,  A61B5/117 ,  A61B5/145 ,  A61B5/14532 ,  A61B5/14546 ,  A61B5/1455 ,  B60K28/063 ,  B60R25/04 ,  B60R25/102 ,  B60R25/241 ,  B60R25/252 ,  B60R25/255 ,  B60R25/257 ,  B60R2325/105 ,  B60R2325/205 ,  B60R2325/304

Abstract: A method and system for preventing use of a vehicle by an operator of the vehicle. The system includes a system controller; a biometric authenticator coupled to the system controller; and a substance detecting device adapted to provide a substance level in the operator to the system controller. Here, the system controller is adapted to communicate a driving restriction to the vehicle if the substance level in the operator is above a tolerance level or if the operator is not authenticated by the authenticator, the substance level is determined at an extremity of the operator, the operator is also authenticated at the extremity, and the extremity is selected from the group consisting of finger, thumb, toe, ear, palm, sole, foot, hand, and head.

Abstract translation: 一种用于防止车辆操作者使用车辆的方法和系统。 该系统包括一个系统控制器; 耦合到系统控制器的生物认证器; 以及物质检测装置，其适于将操作者的物质水平提供给系统控制器。 这里，系统控制器适于在驾驶员的物质水平高于公差水平的情况下或者如果操作者未被认证者认证的情况下向车辆传达驾驶限制，则在操作员的肢体处确定物质水平， 操作者也在肢体认证，肢体选自手指，拇指，脚趾，耳朵，手掌，脚底，手和头部组成的组。

公开(公告)号：WO2016028691A1

公开(公告)日：2016-02-25

申请号：PCT/US2015/045531

申请日：2015-08-17

Applicant: HRL LABORATORIES, LLC

Inventor： PAGE, David ,  YANG, Sophia, S. ,  JACOBSEN, Alan, J. ,  ECKEL, Zak, C. ,  ROPER, Christopher, S. ,  CARTER, William

IPC: B81B1/00 ,  B81C1/00

CPC classification number: G02B6/1225 ,  B29C64/129 ,  B29C64/286 ,  B29K2096/00 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y80/00 ,  G02B1/002 ,  G02B6/138 ,  G02B2006/12173 ,  G03F7/0037 ,  G03F7/2012 ,  G03F7/70416

Abstract: A system and method for forming microlattice structures of large thickness. In one embodiment, a photomonomer resin is secured in a mold having a transparent bottom, the interior surface of which is coated with a mold-release agent. A substrate is placed in contact with the top surface of the photomonomer resin. The photomonomer resin is illuminated from below by one or more sources of collimated light, through a photomask, causing polymer waveguides to form, extending up to the substrate, forming a microlattice structure connected with the substrate. After a layer of microlattice structure has formed, the substrate is raised using a translation-rotation system, additional photomonomer resin is added to the mold, and the photomonomer resin is again illuminated through the photomask, to form an additional layer of microlattice structure. The process is repeated multiple times to form a stacked microlattice structure.

Abstract translation: 一种用于形成大厚度的微晶格结构的系统和方法。 在一个实施方案中，将光单体树脂固定在具有透明底部的模具中，其内表面涂覆有脱模剂。 将基底放置成与光单体树脂的顶表面接触。 通过一个或多个准直光源通过光掩模从下面照射光单体树脂，导致聚合物波导形成，延伸到衬底，形成与衬底连接的微晶格结构。 在形成一层微晶格结构之后，使用平移 - 旋转系统升高基板，向模具中加入额外的光单体树脂，并且通过光掩模再次照射光单体树脂，以形成附加的微格子结构层。 该过程重复多次以形成堆叠的微格子结构。