公开(公告)号：WO2006138495A2

公开(公告)日：2006-12-28

申请号：PCT/US2006/023367

申请日：2006-06-14

Applicant: CUBIC WAFER, INC. ,  TREZZA, John ,  MISRA, Abhay

Inventor： TREZZA, John ,  MISRA, Abhay

IPC: H01L21/00

CPC classification number: H01L25/18 ,  H01L21/76898 ,  H01L23/481 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05023 ,  H01L2224/05026 ,  H01L2224/05027 ,  H01L2224/0508 ,  H01L2224/05147 ,  H01L2224/05568 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/1147 ,  H01L2224/13147 ,  H01L2224/13609 ,  H01L2224/16 ,  H01L2224/24226 ,  H01L2224/75305 ,  H01L2225/06513 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2225/06596 ,  H01L2924/01004 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01049 ,  H01L2924/01052 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A method involves stacking a first chip, comprising high-speed circuitry formed using a first fabrication process, together with a wafer comprising multiple iterations of low-speed circuitry formed using a second fabrication process, hybridizing the first chip to the wafer so as to form electrical connections between the first chip and one of the iterations of the low-speed circuitry so as to form a hybridized unit and dicing the unit from the wafer.

Abstract translation: 一种方法包括堆叠第一芯片，包括使用第一制造工艺形成的高速电路，以及包括使用第二制造工艺形成的多次低速电路迭代的晶片，将第一芯片与晶片杂交以形成 第一芯片之间的电连接和低速电路的迭代之一，以形成混合单元并从晶片切割该单元。

公开(公告)号：WO2006138493A2

公开(公告)日：2006-12-28

申请号：PCT/US2006/023365

申请日：2006-06-14

Applicant: CUBIC WAFER, INC. ,  TREZZA, John ,  FRUSHOUR, Ross

Inventor： TREZZA, John ,  FRUSHOUR, Ross

IPC: H01L21/30 ,  H01L21/44

CPC classification number: H01L21/76898 ,  H01L23/481 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05023 ,  H01L2224/05026 ,  H01L2224/05027 ,  H01L2224/0508 ,  H01L2224/05147 ,  H01L2224/05568 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/1147 ,  H01L2224/13147 ,  H01L2224/13609 ,  H01L2224/24226 ,  H01L2225/06513 ,  H01L2225/06524 ,  H01L2225/06531 ,  H01L2225/06534 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2924/01004 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00014

Abstract: An apparatus for use with multiple chips having multiple posts as to engage at least a portion of a surface of one of the multiple chips, a frame configured to releasably constrain each of the posts so that, when unconstrained, each individual post can contact an individual chip and, when constrained, will allow a uniform vertical force to be applied to the chips.

Abstract translation: 一种用于具有多个芯片的多个芯片的装置，用于接合所述多个芯片中的一个芯片的表面的至少一部分，框架，其被配置为可释放地约束每个所述柱，使得当不受约束时，每个单独的柱可以接触个体 并且当被约束时将允许将均匀的垂直力施加到芯片。

公开(公告)号：WO2006138423A3

公开(公告)日：2006-12-28

申请号：PCT/US2006/023246

申请日：2006-06-14

Applicant: CUBIC WAFER, INC. ,  TREZZA, John ,  CALLAHAN, John ,  DUDOFF, Gregory

Inventor： TREZZA, John ,  CALLAHAN, John ,  DUDOFF, Gregory

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

Abstract: A method of electrically joining a first contact on a first wafer with a second contact on a second wafer, the first contact, a rigid material, and the second contact, a material that is malleable relative to the rigid material, such that when brought together the rigid material will penetrate the malleable material, the rigid and malleable materials both being electrically conductive involves bringing the rigid material into contact with the malleable material, applying a force to one of the first contact or the second contact so as to cause the rigid material to penetrate the malleable material, heating the rigid and malleable material so as to cause the malleable material to soften, and constraining the malleable material to within a pre-specified area.

公开(公告)号：WO2006138381A2

公开(公告)日：2006-12-28

申请号：PCT/US2006/023174

申请日：2006-06-14

Applicant: CUBIC WAFER, INC. ,  TREZZA, John ,  CALLAHAN, John ,  DUDOFF, Gregory

Inventor： TREZZA, John ,  CALLAHAN, John ,  DUDOFF, Gregory

IPC: H01L21/4763

CPC classification number: H01L25/50 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/11 ,  H01L24/13 ,  H01L25/0657 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05023 ,  H01L2224/05026 ,  H01L2224/05027 ,  H01L2224/0508 ,  H01L2224/05147 ,  H01L2224/05568 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/1147 ,  H01L2224/13012 ,  H01L2224/13099 ,  H01L2224/13609 ,  H01L2224/16 ,  H01L2224/24226 ,  H01L2225/06513 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06593 ,  H01L2924/0001 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A method of joining contacts on two chips, each having multiple contacts, to each other involves maintaining a first of the chips at a first temperature, the first of the chips having a rigid electrical contact thereon, bringing a second chip, having an electrical contact that is malleable with respect to the rigid contact and matingly corresponding thereto, into contact with the first such that the corresponding rigid and malleable contacts are brought together, locally raising the second of the chips to a local temperature that is sufficiently high to cause material of the rigid and malleable contact to interdiffuse, interpenetrate or both, but below both a temperature that would cause the material to become liquidus and a fuse temperature, and allowing the second of the chips to cool to at least the first temperature.

Abstract translation: 将彼此具有多个触点的两个芯片上的触点接合的方法包括将第一芯片保持在第一温度，第一芯片在其上具有刚性电接触，带来具有电接触的第二芯片 相对于其刚性接触并且与其配合地相对应地是可延展的，与第一接触部相接触，使得相应的刚性和可延展的触点被接合在一起，将第二芯片局部地升高到足够高的局部温度以使材料 刚性和可延展的接触件相互扩散，互穿或两者，但低于将导致材料变成液相线的温度和熔丝温度，并且允许第二芯片冷却至少第一温度。

公开(公告)号：WO2003003424A1

公开(公告)日：2003-01-09

申请号：PCT/US2002/022087

申请日：2002-06-28

Applicant: XANOPTIX, INC.

Inventor： TREZZA, John ,  HAMSTER, Harald

IPC: H01L21/00

CPC classification number: H01L25/167 ,  G02B6/32 ,  G02B6/4204 ,  G02B6/4206 ,  G02B6/4246 ,  G02B6/4249 ,  G02B6/4292 ,  H01L27/156 ,  H01L2221/68359 ,  H01L2924/0002 ,  H01S5/005 ,  H01S5/0201 ,  H01S5/0217 ,  H01S5/0224 ,  H01S5/02252 ,  H01S5/02272 ,  H01S5/02284 ,  H01S5/18305 ,  H01S5/18311 ,  H01S5/4012 ,  H01S5/4087 ,  H01S5/423 ,  H01L2924/00

Abstract: A multi-wavelength laser array has a group of multiple lasers, each of the lasers in the group being constructed to emit at a specified wavelength within a range, the specified wavelength of one laser being different form the specified wavelength of the other lasers in the group. The lasers in the group are individually selectable so that, when emission at a particular wavelength is called for, a laser capable of providing the particular wavelength will be selected.

Abstract translation: 多波长激光器阵列具有一组多个激光器，该组中的每个激光器被构造成在一定范围内以特定波长发射，一个激光器的指定波长不同于其中的另一个激光器的指定波长 组。 该组中的激光器可单独选择，使得当需要在特定波长的发射时，将选择能够提供特定波长的激光器。

公开(公告)号：WO2003003070A3

公开(公告)日：2003-01-09

申请号：PCT/US2002/022094

申请日：2002-06-28

Applicant: XANOPTIX, INC.

Inventor： KANG, Keith ,  TREZZA, John

IPC: G02B06/36

Abstract: A coupler adapter (320, 620) for attaching a multi-fiber connector (330, 630) holding fiber bundles (340, 640) to an opto-electronic module (300) when the size of the opto-electronic component (310, 610) for the module (300) is larger than the spacing of the high precision alignment elements (332) used in commercial connectors (330). The adapter includes alignment features (324, 410), for example guide pins, that may be mounted on a base (328) of the adapter (320, 620) or directly to the module (300). A window (322) may be used on the base (328) to permit transmission of optical signals for the fiber bundles (340, 640) to interact with the opto-electronic module (300).

公开(公告)号：WO2003003070A2

公开(公告)日：2003-01-09

申请号：PCT/US2002/022094

申请日：2002-06-28

Applicant: XANOPTIX, INC.

Inventor： KANG, Keith ,  TREZZA, John

IPC: G02B

CPC classification number: G02B6/4292 ,  G02B6/3883 ,  G02B6/3885 ,  G02B6/4249

Abstract: A coupler adapter (320, 620) for attaching a multi-fiber connector (330, 630) holding fiber bundles (340, 640) to an opto-electronic module (300) when the size of the opto-electronic component (310, 610) for the module (300) is larger than the spacing of the high precision alignment elements (332) used in commercial connectors (330). The adapter includes alignment features (324, 410), for example guide pins, that may be mounted on a base (328) of the adapter (320, 620) or directly to the module (300). A window (322) may be used on the base (328) to permit transmission of optical signals for the fiber bundles (340, 640) to interact with the opto-electronic module (300).

Abstract translation: 一种用于在将光纤束（340,640）的光纤尺寸的大小设置在光电子模块（300）上时将光纤束（340,640）的多光纤连接器（330,630） 用于模块（300）的光电子部件（310,610）大于在商用连接器（330）中使用的高精度对准元件（332）的间隔。 适配器包括可以安装在适配器（320,620）的基座（328）上或直接安装到模块（300）的对准特征（324,410），例如导销。 可以在基座（328）上使用窗口（322）以允许光纤束（340,640）的光信号的传输与光电模块（300）相互作用。