公开(公告)号：WO2013081829A1

公开(公告)日：2013-06-06

申请号：PCT/US2012/065060

申请日：2012-11-14

Applicant: CREE, INC.

Inventor： TARSA, Eric ,  KELLER, Bernd ,  GUSCHL, Peter ,  NEGLEY, Gerald

IPC: H01L33/54 ,  G02B17/08 ,  B29C33/52 ,  B29C39/34 ,  B29C43/18 ,  B29C45/14 ,  B29C45/44 ,  H01L33/00 ,  B29C33/68

CPC classification number: H01L33/54 ,  B29C33/52 ,  B29C33/68 ,  B29C43/18 ,  B29C45/14655 ,  B29C45/4457 ,  B33Y80/00 ,  G02B19/0028 ,  G02B19/0061 ,  G02B19/0066 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2933/005 ,  H01L2924/00014

Abstract: A light emitting diode (LED) package (300) with primary optic and method of fabricating the same is disclosed that comprises an LED (102) disposed on a surface. The package further comprises at least one intermediate element (104) on the surface and at least partially surrounding the LED. Furthermore, an encapsulant (112) is over the LED forming a primary optic. The intermediate element at least partially defines the shape of the primary optic.

Abstract translation: 公开了一种具有主要光学元件的发光二极管（LED）封装（300）及其制造方法，其包括设置在表面上的LED（102）。 所述封装还包括在所述表面上的至少一个中间元件（104）并且至少部分地围绕所述LED。 此外，密封剂（112）在LED上方形成主光学元件。 中间元件至少部分地限定主光学元件的形状。

公开(公告)号：WO2013043441A3

公开(公告)日：2013-05-16

申请号：PCT/US2012054991

申请日：2012-09-13

Applicant: CREE INC ,  PICKARD PAUL KENNETH

Inventor： PICKARD PAUL KENNETH

IPC: F21V7/22

CPC classification number: F21V7/22 ,  F21K9/233 ,  F21V7/0008 ,  F21V7/0033 ,  F21V7/04 ,  F21V13/14 ,  F21V29/74 ,  F21Y2115/10 ,  Y10T29/49002

Abstract: A specular reflector and LED lamps using embodiments of the reflector are disclosed. Embodiments of the invention provide a reflector (100, 302, 404, 704) for solid state lamps (400, 500, 600). The reflector (100, 302, 404, 704) can be a specular reflector. The reflector (100, 302, 404, 704) includes a rigid, polymeric substrate (104, 304) and sputtered metal (106, 306, 405) applied to the substrate (104, 304). In some embodiments, the metal is silver. In some embodiments, the metal (106, 306, 405) is applied without an intervening base coat. In some embodiments, the substrate (104, 304) is made from or includes an aromatic polyester such as polyarylate. The reflector (100, 302, 404, 704) can include a discontinuous or irregular surface yet still exhibit very high overall reflectivity and efficiency because the metal (106, 306, 405) can be applied without an intervening base coat. In some embodiments, the reflector is used in lamps having a retroreflective optical design.

Abstract translation: 公开了使用反射器的实施例的镜面反射器和LED灯。 本发明的实施例提供了一种用于固态灯（400,500,600）的反射器（100,302,404,704）。 反射器（100,302,404,704）可以是镜面反射器。 反射器（100,302,404,704）包括施加到基板（104,304）的刚性聚合物基板（104,304）和溅射金属（106,306,405）。 在一些实施方案中，金属是银。 在一些实施例中，施加金属（106,306,405）而没有中间的底涂层。 在一些实施方案中，基材（104,304）由芳族聚酯制成或包括芳族聚酯如多芳基化合物。 反射器（100,302,404,704）可以包括不连续或不规则的表面，但仍然表现出非常高的总体反射率和效率，因为可以施加金属（106,306,405）而没有中间的底涂层。 在一些实施例中，反射器用于具有回射光学设计的灯。

公开(公告)号：WO2013016079A3

公开(公告)日：2013-04-25

申请号：PCT/US2012047084

申请日：2012-07-17

Applicant: CREE INC ,  SNELL NATHAN ,  LAY JAMES MICHAEL ,  NGUYEN NICK ,  O'FLAHERTY PATRICK JOHN

Inventor： SNELL NATHAN ,  LAY JAMES MICHAEL ,  NGUYEN NICK ,  O'FLAHERTY PATRICK JOHN

IPC: F21S2/00 ,  F21S4/00 ,  F21S8/06 ,  F21V7/00 ,  F21V15/015 ,  F21V21/005 ,  F21V23/00 ,  F21Y101/02

CPC classification number: F21V7/0008 ,  F21S2/00 ,  F21S4/28 ,  F21S8/026 ,  F21S8/043 ,  F21S8/06 ,  F21S8/063 ,  F21S9/02 ,  F21V7/0016 ,  F21V7/22 ,  F21V15/01 ,  F21V15/013 ,  F21V15/015 ,  F21V21/005 ,  F21V23/002 ,  F21V23/007 ,  F21V29/70 ,  F21V29/85 ,  F21Y2103/10 ,  F21Y2113/13 ,  F21Y2115/10

Abstract: A modular troffer-style fixture particularly well- suited for use with solid state light sources. The fixture comprises a reflector (102) that includes parallel rails running along its length, providing a mount mechanism and structural support. An exposed heat sink (500) is disposed proximate to the reflector. The portion of the heat sink facing the reflector functions as a mount surface for the light sources. The heat sink is hollow through the center in the longitudinal direction. The hollow portion defines a conduit through which electrical conductors can be run to power light emitters. One or more light sources disposed along the heat sink mount surface emit light toward the reflector where it can be mixed and/or shaped before it is emitted from the troffer as useful light. End caps (110) are arranged at both ends of the reflector and heat sink, allowing for the easy connection of multiple units in a serial arrangement.

Abstract translation: 特别适用于固态光源的模块化风格的夹具。 夹具包括反射器（102），其包括沿其长度延伸的平行轨道，提供安装机构和结构支撑件。 暴露的散热器（500）设置在反射器附近。 面对反射器的散热器的部分用作光源的安装表面。 散热器在纵向方向上穿过中心是中空的。 中空部分限定导管，通过该导管可以运行电导体来为发光体供电。 沿着散热器安装表面布置的一个或多个光源向反射器发射光，其中它可以作为有用的光从灯头发射之前被混合和/或成形。 端盖（110）布置在反射器和散热器的两端，允许以串联方式容易地连接多个单元。

公开(公告)号：WO2013036641A1

公开(公告)日：2013-03-14

申请号：PCT/US2012/053965

申请日：2012-09-06

Applicant: CREE, INC. ,  ALLEN, Scott Thomas ,  ZHANG, Qingchun

Inventor： ALLEN, Scott Thomas ,  ZHANG, Qingchun

IPC: H01L31/00

CPC classification number: H01L29/1608 ,  H01L21/8213 ,  H01L29/0619 ,  H01L29/165 ,  H01L29/47 ,  H01L29/66068 ,  H01L29/861 ,  H01L29/872

Abstract: An electronic device includes a silicon carbide layer including an n-type drift region therein, a contact forming a Schottky junction with the drift region, and a p-type junction barrier region on the silicon carbide layer. The p-type junction barrier region includes a p-type polysilicon region forming a P-N heterojunction with the drift region, and the p-type junction barrier region is electrically connected to the contact.

Abstract translation: 电子器件包括其中包含n型漂移区的碳化硅层，与漂移区形成肖特基结的接触以及碳化硅层上的p型结阻挡区。 p型结屏障区域包括与漂移区域形成P-N异质结的p型多晶硅区域，并且p型结阻挡区域电连接到触点。

公开(公告)号：WO2013019534A2

公开(公告)日：2013-02-07

申请号：PCT/US2012/048259

申请日：2012-07-26

Applicant: CREE, INC. ,  VILLARD, Russel, G. ,  KEENEY, Shawn ,  DESILVA, Nicholas ,  HIGLEY, Robert ,  MARKLE, Joshua, Josiah

Inventor： VILLARD, Russel, G. ,  KEENEY, Shawn ,  DESILVA, Nicholas ,  HIGLEY, Robert ,  MARKLE, Joshua, Josiah

IPC: F21V29/00 ,  F21V5/04 ,  F21V17/00

CPC classification number: F21K9/90 ,  F21K9/23 ,  F21V3/02 ,  F21V23/002 ,  F21V23/006 ,  F21V29/80 ,  F21W2121/00 ,  F21Y2115/10 ,  Y10T29/49002

Abstract: Light-emitting die (LED) Lamps, heat sinks, and related methods are provided. An LED lamp can include a mounting substrate having a top surface, a bottom surface and side edges. An LED package can be disposed on the top surface of the mounting substrate with the LED package comprising an LED chip. The LED lamp can include a heat sink that can include a heat sink base and a spacer extending upward from the base. The spacer can have a mounting area or pad distal from the heat sink base on which the bottom surface of the mounting substrate is disposed. The spacer can also have a width that is less than a width between the side edges of the mounting substrate. The LED lamp can further include a lens disposed over the LED package and the mounting substrate.

Abstract translation: 提供发光模具（LED）灯，散热器和相关方法。 LED灯可以包括具有顶表面，底表面和侧边缘的安装基板。 LED封装可以设置在安装基板的顶表面上，LED封装包括LED芯片。 LED灯可以包括散热器，其可以包括散热器基座和从基座向上延伸的间隔件。 间隔件可以具有远离散热器基座的安装区域或垫，安装基板的底表面设置在该散热器基座上。 间隔件还可以具有小于安装基板的侧边缘之间的宽度的宽度。 LED灯还可以包括设置在LED封装和安装基板上的透镜。

公开(公告)号：WO2013019334A1

公开(公告)日：2013-02-07

申请号：PCT/US2012/043699

申请日：2012-06-22

Applicant: CREE, INC. ,  AUBURN UNIVERSITY ,  DHAR, Sarit ,  RYU, Sei-Hyung ,  AGARWAL, Anant ,  WILLIAMS, John Robert

Inventor： DHAR, Sarit ,  RYU, Sei-Hyung ,  AGARWAL, Anant ,  WILLIAMS, John Robert

IPC: H01L21/00

CPC classification number: H01L21/3115 ,  H01L21/049 ,  H01L29/0878 ,  H01L29/1608 ,  H01L29/408 ,  H01L29/51 ,  H01L29/66068 ,  H01L29/78 ,  H01L29/7802

Abstract: Methods of forming a semiconductor structure include providing an insulation layer on a semiconductor layer and diffusing cesium ions into the insulation layer from a cesium ion source outside the insulation layer. A MOSFET including an insulation layer treated with cesium ions may exhibit increased inversion layer mobility.

Abstract translation: 形成半导体结构的方法包括在半导体层上提供绝缘层，并且将铯离子从绝缘层外部的铯离子源扩散到绝缘层中。 包括用铯离子处理的绝缘层的MOSFET可能表现出增加的反型层迁移率。

公开(公告)号：WO2013016355A1

公开(公告)日：2013-01-31

申请号：PCT/US2012/048004

申请日：2012-07-24

Applicant: CREE, INC. ,  LOWES, Theodore D. ,  IBBETSON, James ,  HEIKMAN, Sten ,  TONG, Tao

Inventor： LOWES, Theodore D. ,  IBBETSON, James ,  HEIKMAN, Sten ,  TONG, Tao

IPC: H01L33/08

CPC classification number: H01L27/153 ,  H01L33/382 ,  H01L33/46 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: A packaged light emitting diode (LED) includes a submount, a monolithic multi-junction LED on the submount, and an encapsulant material on the monolithic multi-junction LED. The monolithic multi-junction LED includes a substrate, a plurality of sub-LEDs on the submount, a plurality of conductive metal interconnects coupled to the sub-LEDs and connecting the sub-LEDs in a predetermined arrangement including an anode contact and a cathode contact, and an electrostatic discharge protection circuit in the substrate and coupled in parallel with the arrangement of sub-LEDs.

Abstract translation: 封装的发光二极管（LED）包括底座，底座上的单片多结LED以及单片多结LED上的密封剂材料。 单片多结LED包括基板，在底座上的多个子LED，耦合到子LED的多个导电金属互连件并以包括阳极接触件和阴极接触件的预定布置连接子LED 以及基板中的静电放电保护电路，并且与子LED的布置并联连接。

公开(公告)号：WO2013016122A1

公开(公告)日：2013-01-31

申请号：PCT/US2012/047344

申请日：2012-07-19

Applicant: CREE, INC. ,  ATHALYE, Praneet Jayant ,  NI, Liqin ,  VAN DE VEN, Antony P. ,  UNDERWOOD, Robert D. ,  NEGLEY, Gerald H. ,  GIVEN, Terry

Inventor： ATHALYE, Praneet Jayant ,  NI, Liqin ,  VAN DE VEN, Antony P. ,  UNDERWOOD, Robert D. ,  NEGLEY, Gerald H. ,  GIVEN, Terry

IPC: H05B39/02

CPC classification number: H05B33/083 ,  H01L25/0753 ,  H01L33/54 ,  H01L2924/0002 ,  H01L2933/005 ,  H01L2924/00

Abstract: A solid state lighting apparatus can include a substrate having first and second opposing surfaces, where at least one of the opposing surfaces is configured to mount devices thereon. A string of chip-on-board light emitting diode (LED) sets, can be on the first surface of the substrate and coupled in series with one another. An ac voltage source input, from outside the solid state lighting apparatus, can be coupled to the first or second surface of the substrate.

Abstract translation: 固态照明装置可以包括具有第一和第二相对表面的基板，其中至少一个相对表面被配置成在其上安装装置。 一系列芯片上的发光二极管（LED）组可以在衬底的第一表面上并且彼此串联耦合。 从固态照明装置外部的交流电压源输入可以耦合到基板的第一或第二表面。

公开(公告)号：WO2013016079A2

公开(公告)日：2013-01-31

申请号：PCT/US2012/047084

申请日：2012-07-17

Applicant: CREE, INC. ,  SNELL, Nathan ,  LAY, James, Michael ,  NGUYEN, Nick ,  O'FLAHERTY, Patrick, John

Inventor： SNELL, Nathan ,  LAY, James, Michael ,  NGUYEN, Nick ,  O'FLAHERTY, Patrick, John

IPC: F21V29/00

CPC classification number: F21V7/0008 ,  F21S2/00 ,  F21S4/28 ,  F21S8/026 ,  F21S8/043 ,  F21S8/06 ,  F21S8/063 ,  F21S9/02 ,  F21V7/0016 ,  F21V7/22 ,  F21V15/01 ,  F21V15/013 ,  F21V15/015 ,  F21V21/005 ,  F21V23/002 ,  F21V23/007 ,  F21V29/70 ,  F21V29/85 ,  F21Y2103/10 ,  F21Y2113/13 ,  F21Y2115/10

Abstract: A modular troffer-style fixture particularly well- suited for use with solid state light sources. The fixture comprises a reflector that includes parallel rails running along its length, providing a mount mechanism and structural support. An exposed heat sink is disposed proximate to the reflector. The portion of the heat sink facing the reflector functions as a mount surface for the light sources. The heat sink is hollow through the center in the longitudinal direction. The hollow portion defines a conduit through which electrical conductors can be run to power light emitters. One or more light sources disposed along the heat sink mount surface emit light toward the reflector where it can be mixed and/or shaped before it is emitted from the troffer as useful light. End caps are arranged at both ends of the reflector and heat sink, allowing for the easy connection of multiple units in a serial arrangement.

Abstract translation: 特别适用于固态光源的模块化风格的夹具。 该固定装置包括一个反射器，该反射器包括沿着其长度延伸的平行轨道，提供安装机构和结构支撑。 暴露的散热器靠近反射器设置。 面对反射器的散热器的部分用作光源的安装表面。 散热器在纵向方向上穿过中心是中空的。 中空部分限定导管，通过该导管可以运行电导体来为发光体供电。 沿着散热器安装表面布置的一个或多个光源向反射器发射光，其中它可以作为有用的光从灯头发射之前被混合和/或成形。 端盖布置在反射器和散热器的两端，允许以串联方式容易地连接多个单元。

公开(公告)号：WO2013003348A1

公开(公告)日：2013-01-03

申请号：PCT/US2012/044199

申请日：2012-06-26

Applicant: CREE, INC. ,  NORTH CAROLINA STATE UNIVERSITY ,  DHAR, Sarit ,  CHENG, Lin ,  RYU, Sei-Hyung ,  AGARWAL, Anant, Kumar ,  PALMOUR, John, Williams ,  MAKI, Erik ,  GURGANUS, Jason ,  LICHTENWALNER, Daniel, Jenner

Inventor： DHAR, Sarit ,  CHENG, Lin ,  RYU, Sei-Hyung ,  AGARWAL, Anant, Kumar ,  PALMOUR, John, Williams ,  MAKI, Erik ,  GURGANUS, Jason ,  LICHTENWALNER, Daniel, Jenner

IPC: H01L21/28 ,  H01L29/51 ,  H01L21/314 ,  H01L21/331 ,  H01L21/336 ,  H01L29/16

CPC classification number: H01L29/7802 ,  H01L21/02142 ,  H01L21/02164 ,  H01L21/02172 ,  H01L21/02175 ,  H01L21/022 ,  H01L21/02282 ,  H01L21/02288 ,  H01L21/02378 ,  H01L21/045 ,  H01L21/049 ,  H01L29/0619 ,  H01L29/1606 ,  H01L29/1608 ,  H01L29/513 ,  H01L29/517 ,  H01L29/518 ,  H01L29/7395 ,  H01L29/78 ,  H01L29/7813

Abstract: Embodiments of a semiconductor device having increased channel mobility and methods of manufacturing thereof are disclosed. In one embodiment, the semiconductor device includes a substrate including a channel region and a gate stack on the substrate over the channel region. The gate stack includes an alkaline earth metal. In one embodiment, the alkaline earth metal is Barium (Ba). In another embodiment, the alkaline earth metal is Strontium (Sr). The alkaline earth metal results in a substantial improvement of the channel mobility of the semiconductor device.

Abstract translation: 公开了具有增加的信道移动性的半导体器件及其制造方法的实施例。 在一个实施例中，半导体器件包括在沟道区上的衬底上包括沟道区和栅叠层的衬底。 栅极堆叠包括碱土金属。 在一个实施方案中，碱土金属是钡（Ba）。 在另一个实施方案中，碱土金属是锶（Sr）。 碱土金属导致半导体器件的沟道迁移率的显着改善。