公开(公告)号：WO2013052235A1

公开(公告)日：2013-04-11

申请号：PCT/US2012/054209

申请日：2012-09-07

Applicant: CONTINENTAL AUTOMOTIVE SYSTEMS, INC. ,  CHIOU, Jen-Huang Albert

Inventor： CHIOU, Jen-Huang Albert

IPC: G01L9/00 ,  G01L13/02 ,  G01L19/14

CPC classification number: G01L9/0052 ,  G01L13/026 ,  G01L19/148

Abstract: A MEMS differential pressure sensing element is provided by two separate silicon dies attached to opposite sides of a silicon or glass spacer. The spacer is hollow. If the spacer is silicon, the dies are preferably attached to the hollow spacer using silicon-to-silicon bonding provided in part by silicon oxide layers. If the spacer is glass, the dies can be attached to the hollow spacer using anodic bonding. Conductive vias extend through the layers and provide electrical connections between Wheatstone bridge circuits formed from piezoresistors in the silicon dies.

Abstract translation: MEMS差压感测元件由附接到硅或玻璃间隔件的相对侧的两个分开的硅模具提供。 间隔件是中空的。 如果间隔物是硅，则模具优选地通过部分由氧化硅层提供的硅 - 硅键合附着到中空间隔物上。 如果间隔物是玻璃，则可以使用阳极接合将模具附接到中空间隔物。 导电通孔延伸穿过这些层，并提供由硅模具中的压阻器形成的惠斯通电桥电路之间的电连接。

公开(公告)号：WO2005017445B1

公开(公告)日：2005-07-21

申请号：PCT/US2004016928

申请日：2004-05-28

Applicant: MOTOROLA INC ,  CHIOU JEN-HUANG ALBERT

Inventor： CHIOU JEN-HUANG ALBERT

IPC: G01B20060101 ,  G01C19/00 ,  G01P3/44 ,  G01P9/00 ,  G01P9/04 ,  G01P15/08 ,  H04N5/225

CPC classification number: G01C19/5719

Abstract: There is a sensor element (24) for an electronic sensor device (20). The sensor element (24) may have a substrate (43), a pair of proof masses (34a, 34b), a set of drive beams (44), and at least one base beam (46). The pair of proof masses (34a, 34b) are suspended above the substrate (43) and attached to the substrate (43) at fixed anchor points (50). The set of drive beams (44) are positioned between the proof masses (34a, 34b) and the anchor points (50). Each drive beam (44) has a first longitudinal body portion (62) that extends in a first direction and a first flexible spring member (64) that extends along a second direction. The base beam (46) interconnects the set of drive beams (44) and has a second longitudinal body portion (72) and a second flexible spring member (74). The second longitudinal body portion (72) extends along the second direction and the second flexible spring member (74) extends along the first direction. The first and second flexible spring members (64, 74) may be serpentine in shape, such as folded beam-columns or wrinkle springs.

公开(公告)号：WO2011143549A3

公开(公告)日：2012-05-31

申请号：PCT/US2011036423

申请日：2011-05-13

Applicant: CONTINENTAL AUTOMOTIVE SYSTEMS ,  CHIOU JEN-HUANG ALBERT

Inventor： CHIOU JEN-HUANG ALBERT

IPC: H01L23/48 ,  G01L9/00 ,  G01L9/06

CPC classification number: H01L24/48 ,  G01L19/0069 ,  G01L19/148 ,  H01L24/45 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48011 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/4911 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/8592 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/19105 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/00014 ,  H01L2924/20652 ,  H01L2924/20653 ,  H01L2924/00 ,  H01L2924/20751 ,  H01L2924/00015 ,  H01L2924/2075

Abstract: Any two segments of a wire bonded on two bond pads at different elevations can be distinguished by a stationary node (or zero-displacement) during its second-mode vibration. In order to boost the natural frequency of such a bond wire to avoid a second-mode resonance occurring at the lowest frequency in the in-plane vibration, a wire can be optimized by connecting two equalized (shortest possible) wire segments to replace a wire consisting of a larger segment and a shorter segment. The purpose is to re-distribute a larger vibration movement in the longer segment with a lower stiffness of an arbitrary bond wire to two smaller equalized segments of an optimized wire to reduce an in-plane vibration to significantly improve the wire natural frequency and reliability in a harsh vibration environment such as over 30 kHz.

Abstract translation: 在不同高度的两个接合焊盘上焊接的任何两个导线段可以在其第二模式振动期间被固定节点（或零位移）区分。 为了提高这种接合线的固有频率以避免在平面内振动中以最低频率发生的第二模式共振，可以通过连接两个均衡的（最短可能的）线段来代替线来优化线，以代替线 由更大的段和更短的段组成。 目的是在较长的段中重新分配更大的振动运动，其中任意接合线的刚度较低，优化线的两个较小的均衡段，以减少平面内振动，从而显着提高线固有频率和可靠性 一个严酷的振动环境，如超过30 kHz。

公开(公告)号：WO2011123288A1

公开(公告)日：2011-10-06

申请号：PCT/US2011029405

申请日：2011-03-22

Applicant: CONTINENTAL AUTOMOTIVE SYSTEMS ,  CHIOU JEN-HUANG ALBERT ,  CHEN SHIUH-HUI STEVEN

Inventor： CHIOU JEN-HUANG ALBERT ,  CHEN SHIUH-HUI STEVEN

IPC: G01L9/00

CPC classification number: G01L19/147 ,  G01L9/0052 ,  H01L2224/48137

Abstract: Dual piezoresistive transducers formed into a single silicon die, are anodically bonded to a pedestal. Two separate pressure ports extend through a plastic housing. The port openings inside the housing are surrounded by a groove having a shape and size that accepts the pedestal. A thin, liquid adhesive is deposited into the groove and allowed to level out. The pedestal is placed into the adhesive and embeds itself therein. Adhesive overflow into the ports is avoided by dimensioning the groove and depositing an amount of adhesive that will fill the groove but not overflow when the pedestal is placed therein. Once the adhesive cures, the adhesive bond strength is greater due to the adhesive being in shear relative to the groove side walls and pedestal sidewalls. The grooved structure provides an apparatus and methodology for precise die mounting and media sealing.

Abstract translation: 形成单个硅模具的双压阻式换能器阳极结合到基座。 两个单独的压力端口延伸穿过塑料外壳。 外壳内的开口开口由具有接受基座的形状和尺寸的凹槽包围。 将薄的液体粘合剂沉积到凹槽中并允许平坦化。 将基座放置在粘合剂中并将其自身嵌入其中。 通过使凹槽的尺寸确定并且当底座放置在其中时沉积一定量的将填充凹槽但不溢出的粘合剂来避免粘合剂溢出到端口中。 一旦粘合剂固化，由于粘合剂相对于槽侧壁和基座侧壁处于剪切状态，粘合剂粘结强度更大。 开槽结构提供了精确的模具安装和介质密封的设备和方法。

公开(公告)号：WO2012102979A1

公开(公告)日：2012-08-02

申请号：PCT/US2012/022144

申请日：2012-01-23

Applicant: CONTINENTAL AUTOMOTIVE SYSTEMS, INC. ,  CHIOU, Jen-Huang Albert

Inventor： CHIOU, Jen-Huang Albert

IPC: G01L9/00 ,  G01L13/02

CPC classification number: G01L13/026 ,  G01L9/0052 ,  G01L19/0069 ,  G01L19/147 ,  G01L19/148 ,  H01L2224/48137 ,  H01L2224/73257

Abstract: A MEMS differential pressure sensing element (200) is provided by two separate silicon dies (210,224) attached to opposite sides of a silicon or glass spacer (202), the sides of which are recessed and the recesses formed therein at least partially evacuated. The dies are attached to the spacer using silicon - tosilicon bonding provided in part by silicon oxide layers (219,220) if a silicon spacer is used. The dies can be also attached to the spacer using anodic bonding if a glass spacer is used. Conductive vias (242) extend through the layers and provide electrical connections between Wheatstone bridge circuits formed from piezoresistors in the silicon dies.

Abstract translation: MEMS差压感测元件（200）由附接到硅或玻璃间隔件（202）的相对侧的两个分离的硅模具（210,224）提供，其两侧凹入，并且其中形成的凹部至少部分抽真空。 如果使用硅衬垫，则使用由氧化硅层（219,220）部分提供的硅 - 硅晶片将模具连接到间隔物。 如果使用玻璃间隔物，模具也可以使用阳极接合连接到间隔物上。 导电通孔（242）延伸穿过这些层，并提供由硅模具中的压敏电阻器形成的惠斯通电桥电路之间的电连接。

公开(公告)号：WO2011143549A2

公开(公告)日：2011-11-17

申请号：PCT/US2011/036423

申请日：2011-05-13

Applicant: CONTINENTAL AUTOMOTIVE SYSTEMS, INC. ,  CHIOU, Jen-Huang, Albert

Inventor： CHIOU, Jen-Huang, Albert

IPC: H01L29/84 ,  H02G15/02

CPC classification number: H01L24/48 ,  G01L19/0069 ,  G01L19/148 ,  H01L24/45 ,  H01L24/49 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48011 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/4911 ,  H01L2224/49112 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/85444 ,  H01L2224/8592 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/19105 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/00014 ,  H01L2924/20652 ,  H01L2924/20653 ,  H01L2924/00 ,  H01L2924/20751 ,  H01L2924/00015 ,  H01L2924/2075

Abstract: Any two segments of a wire bonded on two bond pads at different elevations can be distinguished by a stationary node (or zero-displacement) during its second-mode vibration. In order to boost the natural frequency of such a bond wire to avoid a second-mode resonance occurring at the lowest frequency in the in-plane vibration, a wire can be optimized by connecting two equalized (shortest possible) wire segments to replace a wire consisting of a larger segment and a shorter segment. The purpose is to re-distribute a larger vibration movement in the longer segment with a lower stiffness of an arbitrary bond wire to two smaller equalized segments of an optimized wire to reduce an in-plane vibration to significantly improve the wire natural frequency and reliability in a harsh vibration environment such as over 30 kHz.

Abstract translation: 在不同高度的两个接合焊盘上焊接的任何两个导线段可以在其第二模式振动期间被固定节点（或零位移）区分。 为了提高这种接合线的固有频率以避免在平面内振动中以最低频率发生的第二模式共振，可以通过连接两个均衡的（最短可能的）线段来代替线来优化线，以代替线 由更大的段和更短的段组成。 目的是在较长的段中重新分配更大的振动运动，其中任意接合线的刚度较低，优化线的两个较小的均衡段，以减少平面内振动，从而显着提高线固有频率和可靠性 一个严酷的振动环境，如超过30 kHz。

公开(公告)号：WO2005017445A3

公开(公告)日：2005-04-28

申请号：PCT/US2004016928

申请日：2004-05-28

Applicant: MOTOROLA INC ,  CHIOU JEN-HUANG ALBERT

Inventor： CHIOU JEN-HUANG ALBERT

IPC: G01B20060101 ,  G01C19/00 ,  G01P3/44 ,  G01P9/00 ,  G01P9/04 ,  G01P15/08 ,  H04N5/225

CPC classification number: G01C19/5719

Abstract: There is a sensor element (24) for an electronic sensor device (20). The sensor element (24) may have a substrate (43), a pair of proof masses (34a, 34b), a set of drive beams (44), and at least one base beam (46). The pair of proof masses (34a, 34b) are suspended above the substrate (43) and attached to the substrate (43) at fixed anchor points (50). The set of drive beams (44) are positioned between the proof masses (34a, 34b) and the anchor points (50). Each drive beam (44) has a first longitudinal body portion (62) that extends in a first direction and a first flexible spring member (64) that extends along a second direction. The base beam (46) interconnects the set of drive beams (44) and has a second longitudinal body portion (72) and a second flexible spring member (74). The second longitudinal body portion (72) extends along the second direction and the second flexible spring member (74) extends along the first direction. The first and second flexible spring members (64, 74) may be serpentine in shape, such as folded beam-columns or wrinkle springs.

Abstract translation: 存在用于电子传感器装置（20）的传感器元件（24）。 传感器元件（24）可具有衬底（43），一对检测质量块（34a，34b），一组驱动梁（44）和至少一个基础梁（46）。 一对检测质量块（34a，34b）悬挂在基底（43）上方并且在固定的锚定点（50）处附接到基底（43）。 该组驱动梁（44）位于检测质量块（34a，34b）和锚定点（50）之间。 每个驱动梁（44）具有沿第一方向延伸的第一纵向主体部分（62）和沿第二方向延伸的第一弹性部件（64）。 底梁46与驱动梁组44相互连接并且具有第二纵向主体部分72和第二弹性部件74。 第二纵向主体部分（72）沿着第二方向延伸，并且第二柔性弹簧构件（74）沿着第一方向延伸。 第一和第二柔性弹簧构件（64,74）可以是蜿蜒形状的，例如折叠梁柱或褶皱弹簧。

公开(公告)号：WO2005017445A2

公开(公告)日：2005-02-24

申请号：PCT/US2004/016928

申请日：2004-05-28

Applicant: MOTOROLA, INC. , A CORPORATION OF THE STATE OF DELAWARE ,  CHIOU, Jen-Huang Albert,

Inventor： CHIOU, Jen-Huang Albert,

IPC: G01B

CPC classification number: G01C19/5719

Abstract: There is a sensor element (24) for an electronic sensor device (20). The sensor element (24) may have a substrate (43), a pair of proof masses (34a, 34b), a set of drive beams (44), and at least one base beam (46). The pair of proof masses (34a, 34b) are suspended above the substrate (43) and attached to the substrate (43) at fixed anchor points (50). The set of drive beams (44) are positioned between the proof masses (34a, 34b) and the anchor points (50). Each drive beam (44) has a first longitudinal body portion (62) that extends in a first direction and a first flexible spring member (64) that extends along a second direction. The base beam (46) interconnects the set of drive beams (44) and has a second longitudinal body portion (72) and a second flexible spring member (74). The second longitudinal body portion (72) extends along the second direction and the second flexible spring member (74) extends along the first direction. The first and second flexible spring members (64, 74) may be serpentine in shape, such as folded beam-columns or wrinkle springs.

Abstract translation: 存在用于电子传感器装置（20）的传感器元件（24）。 传感器元件（24）可以具有基板（43），一对检验块（34a，34b），一组驱动梁（44）和至少一个基梁（46）。 一对检验质量块（34a，34b）悬挂在基板（43）的上方，并在固定的固定点（50）处附着在基板（43）上。 一组驱动梁（44）位于防弹块（34a，34b）和固定点（50）之间。 每个驱动梁（44）具有沿第一方向延伸的第一纵向主体部分（62）和沿第二方向延伸的第一柔性弹簧构件（64）。 基梁（46）将一组驱动梁（44）互连，并具有第二纵向主体部分（72）和第二柔性弹簧构件（74）。 第二纵向主体部分（72）沿着第二方向延伸，第二柔性弹簧构件（74）沿第一方向延伸。 第一和第二柔性弹簧构件（64,74）的形状可以是蛇形的，例如折叠的梁柱或褶皱弹簧。

公开(公告)号：WO2012115747A1

公开(公告)日：2012-08-30

申请号：PCT/US2012/023082

申请日：2012-01-30

Applicant: CONTINENTAL AUTOMOTIVE SYSTEMS, INC. ,  CHIOU, Jen-Huang Albert ,  CHEN, Shiuh-Hui Steven

Inventor： CHIOU, Jen-Huang Albert ,  CHEN, Shiuh-Hui Steven

IPC: G01L9/00

CPC classification number: G01L9/0055 ,  G01L19/04 ,  G01L19/145

Abstract: In a pressure sensing element made of piezoresistors formed into a silicon substrate, thermally-induced stresses on the piezoresistors and thermally-induced voltage offsets can be reduced by thinning the substrate prior to forming the resistors and then forming the resistors into the thinned-out recess. Forming a circular or disk-shaped recess in the substrate and then forming the resistors therein is believed to cause thermally-induced stresses to be evenly distributed and/or cancelled out on all four piezoresistors of a Wheatstone bridge circuit.

Abstract translation: 在由形成为硅衬底的压电电阻器制成的压力感测元件中，可以通过在形成电阻器之前使衬底变薄，然后将电阻器形成为薄型凹陷凹陷部来减小压敏电阻器上的热诱导应力和热感应电压偏移 。 认为在衬底中形成圆形或圆盘形凹槽，然后在其中形成电阻器被认为导致热诱导应力在惠斯通电桥电路的所有四个压阻上均匀分布和/或抵消。

公开(公告)号：WO2011123288A8

公开(公告)日：2011-10-06

申请号：PCT/US2011/029405

申请日：2011-03-22

Applicant: CONTINENTAL AUTOMOTIVE SYSTEMS, INC. ,  CHIOU, Jen-Huang Albert ,  CHEN, Shiuh-Hui Steven

Inventor： CHIOU, Jen-Huang Albert ,  CHEN, Shiuh-Hui Steven

IPC: G01L9/00

Abstract: Dual piezoresistive transducers formed into a single silicon die, are anodically bonded to a pedestal. Two separate pressure ports extend through a plastic housing. The port openings inside the housing are surrounded by a groove having a shape and size that accepts the pedestal. A thin, liquid adhesive is deposited into the groove and allowed to level out. The pedestal is placed into the adhesive and embeds itself therein. Adhesive overflow into the ports is avoided by dimensioning the groove and depositing an amount of adhesive that will fill the groove but not overflow when the pedestal is placed therein. Once the adhesive cures, the adhesive bond strength is greater due to the adhesive being in shear relative to the groove side walls and pedestal sidewalls. The grooved structure provides an apparatus and methodology for precise die mounting and media sealing.