公开(公告)号：WO2011105961A1

公开(公告)日：2011-09-01

申请号：PCT/SG2010/000065

申请日：2010-02-23

Applicant: AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH ,  KHAN, Oratti, Kalandar, Navas ,  HO, Soon Wee ,  ONG, Siong Chiew, Joe ,  SELVANAGAM, Cheryl, Sharmani

Inventor： KHAN, Oratti, Kalandar, Navas ,  HO, Soon Wee ,  ONG, Siong Chiew, Joe ,  SELVANAGAM, Cheryl, Sharmani

IPC: H01L23/538 ,  H01L21/60 ,  H01L25/04

CPC classification number: H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/81 ,  H01L24/95 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05609 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/1147 ,  H01L2224/13022 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13164 ,  H01L2224/16237 ,  H01L2224/81097 ,  H01L2224/81136 ,  H01L2224/8121 ,  H01L2224/81801 ,  H01L2224/81907 ,  H01L2224/95136 ,  H01L2225/06513 ,  H01L2225/06555 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01042 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00

Abstract: According to an embodiment of the present invention, a method of stacking chips is provided. The method includes: providing a first substrate, wherein, on or within a surface of the first substrate, a first contact structure is arranged, wherein the first contact structure includes an intermediate layer and at least one contact for contacting the first substrate, the intermediate layer being provided on the surface of the first substrate and having at least one recess, the at least one recess accommodating or allowing access to the at least one contact; providing a second substrate, wherein on a surface of the second substrate, a second contact structure is arranged, the second contact structure having at least one contact; and inserting the second contact structure into the at least one recess of the intermediate layer.

Abstract translation: 根据本发明的实施例，提供了一种堆叠芯片的方法。 该方法包括：提供第一衬底，其中，在第一衬底的表面上或其表面上布置有第一接触结构，其中第一接触结构包括中间层和用于接触第一衬底，中间体 层设置在第一基板的表面上并且具有至少一个凹部，所述至少一个凹部容纳或允许接近至少一个触点; 提供第二基板，其中在所述第二基板的表面上布置有第二接触结构，所述第二接触结构具有至少一个接触部; 以及将所述第二接触结构插入所述中间层的所述至少一个凹部中。