公开(公告)号：WO2005008747A3

公开(公告)日：2005-08-25

申请号：PCT/US2004021459

申请日：2004-07-02

Applicant: KLA TENCOR TECHNOLOGIES ,  MARELLA PAUL FRANK ,  MCCAULEY SHARON ,  CHANG ELLIS ,  VOLK WILLIAM ,  WILEY JAMES ,  WATSON STERLING ,  KEKARE SAGAR A ,  HESS CARL

Inventor： MARELLA PAUL FRANK ,  MCCAULEY SHARON ,  CHANG ELLIS ,  VOLK WILLIAM ,  WILEY JAMES ,  WATSON STERLING ,  KEKARE SAGAR A ,  HESS CARL

IPC: G01N21/95 ,  G03F1/44 ,  G03F7/20 ,  G03F1/00 ,  G01N21/956

CPC classification number: G06T7/0006 ,  G01N21/9501 ,  G01N21/956 ,  G01N2021/95676 ,  G03F1/84 ,  G03F7/7065 ,  G06T7/0008 ,  G06T2207/30148

Abstract: Methods and systems for inspection of wafers and reticles using designer intent data are provided. One computer-implemented method includes identifying nuisance defects on a wafer based on inspection data produced by inspection of a reticle, which is used to form a pattern on the wafer prior to inspection of the wafer. Another computer-implemented method includes detecting defects on a wafer by analyzing data generated by inspection of the wafer in combination with data representative of a reticle, which includes designations identifying different types of portions of the reticle. An additional computer-implemented method includes determining a property of a manufacturing process used to process a wafer based on defects that alter a characteristic of a device formed on the wafer. Further computer-implemented methods include altering or simulating one or more characteristics of a design of an integrated circuit based on data generated by inspection of a wafer.

Abstract translation: 提供了使用设计人员意图数据检查晶圆和标线的方法和系统。 一种计算机实现的方法包括基于通过检查光罩产生的检查数据来识别晶片上的有害缺陷，其用于在晶片检查之前在晶片上形成图案。 另一种计算机实现的方法包括通过结合表示标线的数据分析由晶片的检查产生的数据来检测晶片上的缺陷，该数据包括标识掩模版的不同类型的部分的标记。 附加的计算机实现的方法包括基于改变晶片上形成的器件的特性的缺陷来确定用于处理晶片的制造工艺的特性。 进一步的计算机实现的方法包括基于通过检查晶片产生的数据来改变或模拟集成电路的设计的一个或多个特性。

公开(公告)号：WO2005008747A2

公开(公告)日：2005-01-27

申请号：PCT/US2004/021459

申请日：2004-07-02

Applicant: KLA-TENCOR TECHNOLOGIES ,  MARELLA, Paul Frank ,  MCCAULEY, Sharon ,  CHANG, Ellis ,  VOLK, William ,  WILEY, James ,  WATSON, Sterling ,  KEKARE, Sagar A. ,  HESS, Carl

Inventor： MARELLA, Paul Frank ,  MCCAULEY, Sharon ,  CHANG, Ellis ,  VOLK, William ,  WILEY, James ,  WATSON, Sterling ,  KEKARE, Sagar A. ,  HESS, Carl

IPC: H01L21/00

CPC classification number: G06T7/0006 ,  G01N21/9501 ,  G01N21/956 ,  G01N2021/95676 ,  G03F1/84 ,  G03F7/7065 ,  G06T7/0008 ,  G06T2207/30148

Abstract: Methods and systems for inspection of wafers and reticles using designer intent data are provided. One computer-implemented method includes identifying nuisance defects on a wafer based on inspection data produced by inspection of a reticle, which is used to form a pattern on the wafer prior to inspection of the wafer. Another computer-implemented method includes detecting defects on a wafer by analyzing data generated by inspection of the wafer in combination with data representative of a reticle, which includes designations identifying different types of portions of the reticle. An additional computer-implemented method includes determining a property of a manufacturing process used to process a wafer based on defects that alter a characteristic of a device formed on the wafer. Further computer-implemented methods include altering or simulating one or more characteristics of a design of an integrated circuit based on data generated by inspection of a wafer.

Abstract translation: 提供了使用设计者意图数据检查晶片和分划板的方法和系统。 一种计算机实现的方法包括基于通过检查标线产生的检查数据来识别晶片上的滋扰缺陷，所述标线用于在检查晶片之前在晶片上形成图案。 另一种计算机实现的方法包括通过结合表示掩模版的数据分析通过检查晶片产生的数据来检测晶片上的缺陷，其包括识别掩模版的不同类型部分的标记。 另外的计算机实现的方法包括基于改变晶片上形成的器件的特性的缺陷来确定用于处理晶片的制造工艺的特性。 其他计算机实现的方法包括基于通过检查晶片产生的数据改变或模拟集成电路设计的一个或多个特性。

公开(公告)号：WO2005024404B1

公开(公告)日：2005-05-19

申请号：PCT/US2004029189

申请日：2004-09-03

Applicant: KLA TENCOR TECHNOLOGIES ,  LANGE STEVE R ,  MARELLA PAUL FRANK ,  CEGLIO NAT ,  HWANG SHIOW-HWEI ,  FU TAO-YI

Inventor： LANGE STEVE R ,  MARELLA PAUL FRANK ,  CEGLIO NAT ,  HWANG SHIOW-HWEI ,  FU TAO-YI

IPC: G01N21/95

CPC classification number: G01N21/9501 ,  G01N21/8806

Abstract: Methods and systems for inspection of a specimen using different parameters are provided. One computer-implemented method includes determining optimal parameters for inspection based on selected defects. This method also includes setting parameters of an inspection system at the optimal parameters prior to inspection. Another method for inspecting a specimen includes illuminating the specimen with light having a wavelength below about 350 nm and with light having a wavelength above about 350 nm. The method also includes processing signals representative of light collected from the specimen to detect defects or process variations on the specimen. One system configured to inspect a specimen includes a first optical subsystem coupled to a broadband light source and a second optical subsystem coupled to a laser. The system also includes a third optical subsystem configured to couple light from the first and second optical subsystems to an objective, which focuses the light onto the specimen.

Abstract translation: 提供了使用不同参数检查试样的方法和系统。 一种计算机实现的方法包括基于所选择的缺陷来确定用于检查的最佳参数。 该方法还包括在检查之前将检查系统的参数设置为最佳参数。 用于检查样品的另一种方法包括用波长低于约350nm的光和波长高于约350nm的光照射样品。 该方法还包括处理代表从样品收集的光的信号，以检测样品上的缺陷或过程变化。 配置成检查样本的一个系统包括耦合到宽带光源的第一光学子系统和耦合到激光器的第二光学子系统。 该系统还包括配置成将来自第一和第二光学子系统的光耦合到物镜的第三光学子系统，其将光聚焦到样本上。

公开(公告)号：WO1993023982A1

公开(公告)日：1993-11-25

申请号：PCT/US1993004416

申请日：1993-05-10

Applicant: NCHIP, INC. ,  TUCKERMAN, David, B. ,  BRATHWAITE, Nicholas, E. ,  MARELLA, Paul ,  FLATOW, Kirk

Inventor： NCHIP, INC.

IPC: H05K07/06

CPC classification number: H01L24/85 ,  H01L24/27 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/83 ,  H01L25/0657 ,  H01L29/0657 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48472 ,  H01L2224/49109 ,  H01L2224/49112 ,  H01L2224/4912 ,  H01L2224/49171 ,  H01L2224/49174 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/78313 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2224/85205 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10155 ,  H01L2924/10158 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/30105 ,  H01L2924/30107 ,  Y10T29/49128 ,  Y10T29/49162 ,  Y10T156/10 ,  Y10T156/1093 ,  H01L2224/78 ,  H01L2924/00

Abstract: A packaging technique for multichip modules including a three dimensional stack of IC's (150) each having a beveled edge and a contact pad for electrically connecting the contact pads to a circuit substrate (160).

Abstract translation: 一种用于多芯片模块的封装技术，包括具有倾斜边缘的IC的三维叠层（150）和用于将接触焊盘电连接到电路基板（160）的接触焊盘。

公开(公告)号：WO2005024404A1

公开(公告)日：2005-03-17

申请号：PCT/US2004/029189

申请日：2004-09-03

Applicant: KLA-TENCOR TECHNOLOGIES ,  LANGE, Steve, R. ,  MARELLA, Paul, Frank ,  CEGLIO, Nat ,  HWANG, Shiow-Hwei ,  FU, Tao-Yi

Inventor： LANGE, Steve, R. ,  MARELLA, Paul, Frank ,  CEGLIO, Nat ,  HWANG, Shiow-Hwei ,  FU, Tao-Yi

IPC: G01N21/95

CPC classification number: G01N21/9501 ,  G01N21/8806

Abstract: Methods and systems for inspection of a specimen using different parameters are provided. One computer-implemented method includes determining optimal parameters for inspection based on selected defects. This method also includes setting parameters of an inspection system at the optimal parameters prior to inspection. Another method for inspecting a specimen includes illuminating the specimen with light having a wavelength below about 350 nm and with light having a wavelength above about 350 nm. The method also includes processing signals representative of light collected from the specimen to detect defects or process variations on the specimen. One system configured to inspect a specimen includes a first optical subsystem coupled to a broadband light source and a second optical subsystem coupled to a laser. The system also includes a third optical subsystem configured to couple light from the first and second optical subsystems to an objective, which focuses the light onto the specimen.

Abstract translation: 提供了使用不同参数检查样本的方法和系统。 一种计算机实现的方法包括基于选择的缺陷确定用于检查的最佳参数。 该方法还包括在检查之前以最佳参数设置检查系统的参数。 用于检查样本的另一种方法包括用具有低于约350nm的波长的光和具有高于约350nm的波长的光照射样本。 该方法还包括处理代表从样本收集的光的信号，以检测样本上的缺陷或工艺变化。 配置成检查样本的一个系统包括耦合到宽带光源的第一光学子系统和耦合到激光器的第二光学子系统。 该系统还包括配置成将来自第一和第二光学子系统的光耦合到物镜的第三光学子系统，该物镜将光聚焦到样品上。