GROWTH OF COLORLESS SILICON CARBIDE CRYSTALS
    2.
    发明申请
    GROWTH OF COLORLESS SILICON CARBIDE CRYSTALS 审中-公开
    无色碳化硅晶体的生长

    公开(公告)号:WO1997028297A1

    公开(公告)日:1997-08-07

    申请号:PCT/US1997001292

    申请日:1997-01-24

    CPC classification number: C30B23/00 C30B29/36

    Abstract: Large single crystals of silicon carbide are grown in a furnace sublimation system. The crystals are grown with compensating levels of p-type and n-type dopants (i.e., roughly equal levels of the two dopants) in order to produce a crystal that is essentially colorless. The crystal may be cut and fashioned into synthetic gemstones having extraordinary toughness and hardness, and a brilliance meeting or exceeding that of diamond.

    Abstract translation: 大型单晶碳化硅在炉升华系统中生长。 晶体以补偿水平的p型和n型掺杂剂(即,大致相等的两种掺杂剂)生长,以便产生基本上无色的晶体。 水晶可以被切割成具有非凡的韧性和硬度的合成宝石,以及达到或超过钻石的辉煌。

    LED FABRICATION VIA ION IMPLANT ISOLATION
    4.
    发明申请
    LED FABRICATION VIA ION IMPLANT ISOLATION 审中-公开
    LED制造通过离子植入隔离

    公开(公告)号:WO2004102686A1

    公开(公告)日:2004-11-25

    申请号:PCT/US2004/014023

    申请日:2004-05-06

    Abstract: A semiconductor light emitting diode includes a semiconductor substrate, an epitaxial layer of n-type Group III nitride on the substrate, a p-type epitaxial layer of Group III nitride on the n-type epitaxial layer and forming a p-n junction with the n-type layer, and a resistive gallium nitride region on the n-type epitaxial layer and adjacent the p-type epitaxial layer for electrically isolating portions of the p-n junction. A metal contact layer is formed on the p-type epitaxial layer. In method embodiments disclosed, the resistive gallium nitride border is formed by forming an implant mask on the p-type epitaxial region and implanting ions into portions of the p-type epitaxial region to render portions of the p-type epitaxial region semi-insulating. A photoresist mask or a sufficiently thick metal layer may be used as the implant mask.

    Abstract translation: 半导体发光二极管包括半导体衬底,衬底上的n型III族氮化物的外延层,n型外延层上的III族氮化物的p型外延层,并与n型外延层形成pn结, 型层和n型外延层上的电阻性氮化镓区,并且邻近p型外延层,用于电隔离pn结的部分。 在p型外延层上形成金属接触层。 在公开的方法实施例中,通过在p型外延区上形成注入掩模并将离子注入到p型外延区的一部分中以形成半绝缘的p型外延区的部分来形成电阻性氮化镓边界。 可以使用光致抗蚀剂掩模或足够厚的金属层作为植入掩模。

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