Abstract:
Substrate processing method and apparatus are disclosed. The apparatus includes a chuck having a surface with one or more gas flow openings configured to provide a flow of gas to the surface. The surface includes one or more vacuum channels distributed across the surface. The vacuum channels permit vacuum to be drawn therethrough. In the method a substrate may be supported proximate the chuck surface with a back surface of the substrate sufficiently close to the chuck surface that a flow of gas and vacuum can maintain the substrate back surface and the chuck surface in a spaced-apart relationship. Gas flow is provided to the chuck surface through the gas flow openings and vacuum is drawn through one or more vacuum channels. The substrate is moved along a direction substantially perpendicular to the surface of the substrate.
Abstract:
To increase inspection throughput, the field of view of an infrared camera can be moved over the sample at a constant velocity. Throughout this moving, a modulation can be provided to the sample and infrared images can be captured using the infrared camera. Moving the field of view, providing the modulation, and capturing the infrared images can be synchronized. The infrared images can be filtered to generate the time delay lock-in thermography, thereby providing defect identification. This filtering can account for the number of pixels of the infrared camera in a scanning direction. For the case of optical modulation, a dark field region can be provided for the field of view throughout the moving, thereby providing an improved signal-to-noise ratio during filtering. Localized defects can be repaired by a laser integrated into the detection system or marked by ink for later repair in the production line.
Abstract:
To measure the critical dimensions and other parameters of a one- or two-dimensional diffracting structure of a film, the calculation may be simplified by first performing a measurement of the thickness of the film, employing a film model that does not vary the critical dimension or parameters related to other characteristics of the structure. The thickness of the film may be estimated using the film model sufficiently accurately so that such estimate may be employed to simplify the structure model for deriving the critical dimension and other parameters related to the two-dimensional diffracting structure.
Abstract:
Methods and apparatus are presented to measure the photoluminescence of incoming wafers and extract parameters such as minority carrier life time, diffusion length, and defect density that may be used to predict final solar cell efficiency. In some examples, illumination light is supplied to a side of an as-cut silicon wafer and the induced luminescence measured from the same side and the opposite side of the wafer is used to determine an indication of the minority carrier lifetime. In another example, the luminescence induced by two instances of illumination light of different wavelength is used to determine an indication of the minority carrier lifetime. In another example, the spatial distribution of luminescence intensity over an area surrounding a focused illumination spot is used to determine an indication of the minority carrier lifetime. Other apparatus useful to passivate the surface of a wafer for inspection are also presented.
Abstract:
A tool for investigating a substrate, where the tool has a tool head for investigating the substrate, a chuck for disposing an upper surface of the substrate in proximity to the tool head, and an air bearing disposed on the tool head adjacent the substrate. The air bearing has a pressure source and a vacuum source, where the vacuum source draws the substrate toward the air bearing and the pressure source prevents the substrate from physically contacting the air bearing. The pressure source and the vacuum source work in cooperation to dispose the upper surface of the substrate at a known distance from the tool head. By using the air bearing as part of the tool in this manner, registration of the substrate to the tool head is accomplished relative to the upper surface of the substrate, not the back side of the substrate.
Abstract:
A tool for investigating a substrate, where the tool has a tool head for investigating the substrate, a chuck for disposing an upper surface of the substrate in proximity to the tool head, and an air bearing disposed on the tool head adjacent the substrate. The air bearing has a pressure source and a vacuum source, where the vacuum source draws the substrate toward the air bearing and the pressure source prevents the substrate from physically contacting the air bearing. The pressure source and the vacuum source work in cooperation to dispose the upper surface of the substrate at a known distance from the tool head. By using the air bearing as part of the tool in this manner, registration of the substrate to the tool head is accomplished relative to the upper surface of the substrate, not the back side of the substrate.
Abstract:
A spectrometer having an electron beam generator for generating an electron beam that is directed at a sample. An electron beam positioner directs the electron beam onto a position of the sample, and thereby produces a secondary emitted stream from the sample, where the secondary emitted stream includes at least one of electrons and x-rays. An secondary emitted stream positioner positions the secondary emitted stream onto a detector array, which receives the secondary emitted stream and detects both the amounts and the received positions of the secondary emitted stream. A modulator modulates the electron beam that is directed onto the sample, and thereby sweeps the electron beam between a first position and a second position on the sample. An extractor is in signal communication with both the modulator and the detector array.
Abstract:
Disclosed are apparatus and methods for illuminating a sample, e.g. , during an inspection of such sample for defects. In one aspect, the illumination apparatus includes a bundle of fibers that each have a first end and a second end. The illumination apparatus further includes an illumination selector for selectively transmitting one or more incident beams into one or more corresponding first ends of the optical fibers so that the selected one or more incident beams are output from one or more corresponding second ends of the fibers. The illumination apparatus also includes a lens arrangement for receiving the selected one or more incidents beams output from the corresponding one or more second ends of the fibers and directing the selected one or more incident beams towards the sample. The lens arrangement and the fibers are arranged with respect to each other so as to image an imaging plane of the sample at the second ends of the fibers. In one aspect, the incident beams are laser beams. In a specific application of the invention, the sample is selected from a group consisting of a semiconductor device, a semiconductor wafer, and a semiconductor reticle.
Abstract:
An apparatus for illuminating a target surface, the apparatus having a plurality of LED arrays, where each of the arrays has a plurality of individually addressable LEDs, and where at least one of the arrays is disposed at an angle of between about forty-five degrees and about ninety degrees relative to the target surface, where all of the arrays supply light into a light pipe, the light pipe having interior walls made of a reflective material, where light exiting the light pipe illuminates the target surface, and a controller for adjusting an intensity of the individually addressable light sources.