Abstract:
A pixel structure may include a base substrate (10); a first insulating island (12) on a side of the base substrate (10); a first electrode (13) on a side of the first insulating island (12) opposite from the base substrate (10); a second electrode (11) on the base substrate (10) and at a peripheral area of the first insulating island (12); an active layer (14) electrically connected to the first electrode (13) and the second electrode (11); a second insulating layer (15) on a side of the active layer (14) opposite from the base substrate (10); a gate electrode (16) on a side of the second insulating layer (15) opposite from the base substrate (10); and a third insulating layer (17) on a side of the gate electrode (16) opposite from the base substrate (10).
Abstract:
A thin-film transistor includes: an active layer having a first side and a second side opposing to the first side; a main gate electrode spaced from the active layer on the first side, and including a conductive material; an auxiliary gate electrode spaced from the active layer on the second side, wherein the auxiliary gate electrode includes a phase change material having a phase change temperature; the auxiliary gate electrode is configured to have a transition between insulating and conductive based on a temperature of the auxiliary gate electrode; and the main gate electrode and the auxiliary gate electrode are electrically coupled to each other when the auxiliary gate electrode is conductive.
Abstract:
An active layer, a thin film transistor, an array substrate, and a display apparatus, and fabrication methods thereof are provided. A method for fabricating an active layer (4) in a thin film transistor is provided by forming a thin film by a direct current (DC) sputtering process; and etching the thin film to form the active layer (4). The thin film is made of a material selected to provide the active layer (4) with a carrier concentration of at least approximately 1x10 17 cm -3 and a carrier mobility of at least approximately 20 cm 2 /Vs.
Abstract:
A method for manufacturing a semiconductor thin film includes sequentially forming a first semiconductor layer, an intermediate layer, and a second semiconductor layer over a substrate. The first semiconductor layer and the second semiconductor layer can be one and another of an n-type semiconductor layer and a p-type semiconductor layer. At least one of the first semiconductor layer, the intermediate layer, or the second semiconductor layer is formed via a solution process. The n-type semiconductor layer can include indium oxide. The intermediate layer can include a self-assembly material. The p-type semiconductor layer can include a p-type organic semiconductor material, and can be pentacene. On the basis, a semiconductor thin film manufactured thereby, a semiconductor thin film transistor, and a display apparatus, are also disclosed.
Abstract:
A thin-film transistor (TFT) is provided in this disclosure, which comprises Sn-doped ZrO 2 . This oxide semiconductor material can be used in a semiconductor layer of a TFT, and a mass percentage of Sn doped in the ZrO 2 is about 1%-95%. A semiconductor layer comprising Sn-doped ZrO 2 exhibits higher acid tolerance after annealing. This disclosure also provides a method for fabricating a TFT, which comprises: (i) forming a semiconductor layer, wherein the semiconductor layer comprises Sn-doped ZrO 2 , and (ii) annealing the semiconductor layer.
Abstract:
The disclosure provides a method of manufacturing a thin film transistor on a base substrate by patterning an active layer comprising a metal oxynitride, and treating the active layer with a plasma comprising oxygen.
Abstract:
The present disclosure is related to a thin film transistor. The thin film transistor may include an active layer; a gate insulating layer on the active layer; and a gate and a plurality of metal films on the gate insulating layer. The plurality of metal films may be spaced apart from the gate, and insulated from the gate and the active layer.
Abstract:
A method for forming a thin film transistor array substrate (110) comprises forming an active layer (140) using a zinc target under an environment of oxygen and nitrogen in a sputtering chamber, and forming a source/drain buffer layer (151/152) on the active layer (140) using the zinc target by a sputtering process in the sputtering chamber under an environment containing one of oxygen and nitrogen. A thin film transistor array substrate (110) comprises an active layer (140), a source/drain buffer layer (151/152) on and in contact with the active layer (140), wherein the active layer (140) is made of oxynitride compound of zinc, and the source/drain buffer layer (151/152) is made of one of an oxide and a nitride of zinc. A display device comprising the thin film transistor array substrate (110) is also provided.
Abstract:
Provided is a thin film transistor. The thin film transistor includes an active layer (6), and a source electrode (4) and a drain electrode (5) on the active layer (6). Each of the source electrode (4) and the drain electrode (5) includes a metal electrode sub-layer (1) and a diffusion barrier sub-layer (2) made of a material comprising M1O a N b , wherein M1 is single metal or a combination of metals, a≥0, and b>0, between the metal electrode sub-layer (1) and the active layer (6) for preventing diffusion of metal electrode material into the active layer (6).
Abstract translation:提供一种薄膜晶体管。 薄膜晶体管包括有源层(6),以及在有源层(6)上的源电极(4)和漏电极(5)。 源电极(4)和漏电极(5)中的每一个包括金属电极子层(1)和由包含M1O aN b的材料制成的扩散阻挡子层(2),其中M1是单金属或 金属电极子层(1)和有源层(6)之间的金属a≥0和b> 0的组合,用于防止金属电极材料扩散到有源层(6)中。
Abstract:
A metal oxide semiconductor thin film, a thin film transistor (TFT), methods for fabricating the metal oxide semiconductor thin film and the TFT, and a display apparatus are provided. In some embodiments, the metal oxide semiconductor comprises: a first metal element, a second metal element and a third metal element, wherein: the first metal element is at least one of scandium, yttrium, aluminum, indium, and a rare earth element; the second metal element is at least one of calcium, strontium, and barium; and the third metal element is at least one of titanium and tin.