公开(公告)号：WO2017068997A1

公开(公告)日：2017-04-27

申请号：PCT/JP2016/079894

申请日：2016-10-07

申请人： SONY SEMICONDUCTOR SOLUTIONS CORPORATION

发明人： WAKIYAMA Satoru ,  SHIMIZU Kan ,  HAYASHI Toshihiko ,  NAKAMURA Takuya ,  JYO Naoki

IPC分类号： H01L23/485 ,  H01L21/60 ,  H01L27/146

CPC分类号： H01L24/05 ,  H01L23/3192 ,  H01L24/03 ,  H01L24/06 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/48 ,  H01L24/81 ,  H01L27/14634 ,  H01L27/14636 ,  H01L2224/0239 ,  H01L2224/0345 ,  H01L2224/0346 ,  H01L2224/0361 ,  H01L2224/03616 ,  H01L2224/03828 ,  H01L2224/039 ,  H01L2224/0391 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05009 ,  H01L2224/05082 ,  H01L2224/05157 ,  H01L2224/05181 ,  H01L2224/05187 ,  H01L2224/05547 ,  H01L2224/05548 ,  H01L2224/05571 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05669 ,  H01L2224/0603 ,  H01L2224/06181 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/1403 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/48463 ,  H01L2224/73257 ,  H01L2224/81011 ,  H01L2224/81022 ,  H01L2224/81065 ,  H01L2224/8114 ,  H01L2224/81191 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/81464 ,  H01L2224/81469 ,  H01L2224/8182 ,  H01L2924/00014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/014 ,  H01L2924/01047 ,  H01L2924/01083 ,  H01L2924/01029 ,  H01L2924/01049 ,  H01L2924/00012 ,  H01L2224/45099

摘要： An imaging device includes a first semiconductor element including at least one bump pad that has a concave shape. The at least one bump pad includes a first metal layer and a second metal layer on the first metal layer. The imaging device includes a second semiconductor element including at least one electrode. The imaging device includes a microbump electrically connecting the at least one bump pad to the at least one electrode. The microbump includes a diffused portion of the second metal layer, and first semiconductor element or the second semiconductor element includes a pixel unit.

摘要翻译： 成像装置包括第一半导体元件，该第一半导体元件包括至少一个具有凹形形状的凸块焊盘。 所述至少一个凸块焊盘包括在第一金属层上的第一金属层和第二金属层。 成像装置包括具有至少一个电极的第二半导体元件。 成像装置包括将至少一个凸块焊盘电连接到至少一个电极的微凸块。 微凸块包括第二金属层的扩散部分，第一半导体元件或第二半导体元件包括像素单元。