公开(公告)号：WO2006082887A3

公开(公告)日：2007-01-18

申请号：PCT/JP2006301758

申请日：2006-02-02

申请人： ZEON CORP ,  TANAKA AKIRA

发明人： TANAKA AKIRA

IPC分类号： B32B27/00 ,  B32B27/24 ,  C09J7/02 ,  C09J201/02

CPC分类号： G02B1/10 ,  B32B17/10018 ,  B32B37/12 ,  B32B2315/08 ,  B32B2398/20 ,  B32B2457/00 ,  C09J7/22 ,  C09J163/00 ,  C09J2201/622 ,  Y10T156/1089 ,  Y10T156/1092 ,  Y10T428/266 ,  Y10T428/269 ,  Y10T428/28 ,  Y10T428/2813 ,  Y10T428/287 ,  Y10T428/2891 ,  Y10T428/31504 ,  Y10T428/31507 ,  Y10T428/31616 ,  Y10T428/31645 ,  Y10T428/31649 ,  Y10T428/31667 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31692 ,  Y10T428/31786 ,  Y10T428/31855

摘要： Disclosed is a multilayer film for a strain-free laminate which is used for flexible TFT substrates or the like. Also disclosed are a laminate obtained by arranging such a multilayer film on a substrate made of an inorganic material, and a method for producing such a laminate. Specifically disclosed is a multilayer film wherein an adhesive resin layer which can be adhered to inorganic materials is arranged on a film base made of a resin. This multilayer film is characterized in that the average thermal expansion coefficient between 60°C and 80°C measured while heating the multilayer film from 30°C to 130°C is larger by 30-400 ppm/°C than the average thermal expansion coefficient between 60°C and 80°C measured while reheating the multilayer film, which is once heated to 130°C and then cooled to 30°C or less, from 30°C to 130°C. Also specifically disclosed is a laminate obtained by bonding such a multilayer film on at least one surface of a substrate which is made of an inorganic material. Further specifically disclosed is a method for producing such a laminate wherein the multilayer film and the substrate of inorganic material are bonded at a temperature not less than 40°C but not more than the glass transition temperature of a resin constituting the adhesive resin layer of the multilayer film.

摘要翻译： 公开了用于柔性TFT基板等的无应变层叠体的多层膜。 还公开了通过将这种多层膜设置在由无机材料制成的基板上获得的层压体以及这种层压体的制造方法。 具体公开了一种多层膜，其中可粘附到无机材料上的粘合树脂层布置在由树脂制成的膜基底上。 该多层膜的特征在于，将多层膜从30℃加热至130℃时测定的60℃〜80℃的平均热膨胀系数比平均热膨胀系数大30〜400ppm /℃ 在将多次膜再加热一次加热至130℃，然后冷却至30℃以下的同时，在30℃〜130℃下测定60℃〜80℃。 还具体公开了通过在由无机材料制成的基板的至少一个表面上接合这样的多层膜获得的层压体。 进一步具体公开的是这样的层压体的制造方法，其中，多层膜和无机材料的基材在不低于40℃但不高于构成粘合树脂层的树脂的玻璃化转变温度的温度下接合 多层膜。

公开(公告)号：WO0247139A3

公开(公告)日：2004-01-15

申请号：PCT/JP0110590

申请日：2001-12-04

申请人： EBARA CORP ,  KONDO FUMIO ,  MISHIMA KOJI ,  TANAKA AKIRA ,  SUZUKI YOKO ,  TOGAWA TETSUJI ,  INOUE HIROAKI

发明人： KONDO FUMIO ,  MISHIMA KOJI ,  TANAKA AKIRA ,  SUZUKI YOKO ,  TOGAWA TETSUJI ,  INOUE HIROAKI

IPC分类号： B65G49/07 ,  B24B37/04 ,  B24B49/16 ,  C23C18/16 ,  C25D5/00 ,  C25D5/50 ,  C25D7/12 ,  H01L21/00 ,  H01L21/02 ,  H01L21/288 ,  H01L21/304 ,  H01L21/3205 ,  H01L21/321 ,  H01L21/673 ,  H01L21/677 ,  H01L21/768 ,  H01L23/52 ,  B24B7/22

CPC分类号： H01L21/67161 ,  B24B37/005 ,  B24B37/042 ,  B24B37/245 ,  B24B37/345 ,  B24B41/061 ,  B24B49/16 ,  C23C18/1632 ,  C23C18/1653 ,  C25D7/123 ,  H01L21/02074 ,  H01L21/02087 ,  H01L21/0209 ,  H01L21/288 ,  H01L21/2885 ,  H01L21/3212 ,  H01L21/67167 ,  H01L21/67173 ,  H01L21/67184 ,  H01L21/67219 ,  H01L21/6723 ,  H01L21/67393 ,  H01L21/67396 ,  H01L21/67772 ,  H01L21/7684 ,  H01L21/76843 ,  H01L21/76849 ,  H01L21/76864 ,  H01L21/76873 ,  H01L21/76874 ,  H01L21/76877

摘要： A substrate processing method comprising steps for forming a copper film on a surface of a substrate. These steps includes the step of filling a first metal in the trenches so as to form a plated film of the first metal on an entire surface of the substrate by electroplating, wherein the electromagnetic field is adjusted by the virtual anode so that differences of thickness of the plated film between the central portion and the peripheral portion of the substrate being minimized, and polishing and removing the plated film by pressing the substrate to the polishing surface, wherein the pressures pressing the substrate to the polishing surface at a central portion and a peripheral portion are adjusted.

摘要翻译： 一种基板处理方法，包括在基板的表面上形成铜膜的步骤。 这些步骤包括在沟槽中填充第一金属以便通过电镀在基板的整个表面上形成第一金属的镀膜的步骤，其中电磁场由虚拟阳极调节，使得厚度差异 基板的中心部分和周边部分之间的镀膜最小化，并且通过将基板压在研磨表面上来研磨和去除镀膜，其中将基板压在抛光表面的压力在中心部分和周边 部分进行调整。

公开(公告)号：WO2007007919A3

公开(公告)日：2007-08-16

申请号：PCT/JP2006314326

申请日：2006-07-13

申请人： ASTELLAS PHARMA INC ,  INOUE TAKAYUKI ,  TOJO TAKASHI ,  MORITA MASATAKA ,  NAKAJIMA YUTAKA ,  HATANAKA KEIKO ,  SHIRAKAMI SHOHEI ,  SASAKI HIROSHI ,  TANAKA AKIRA ,  TAKAHASHI FUMIE ,  MUKOYOSHI KOICHIRO ,  HIGASHI YASUYUKI ,  OKIMOTO AKIRA ,  HONDO TAKESHI ,  SAWADA HITOSHI

发明人： INOUE TAKAYUKI ,  TOJO TAKASHI ,  MORITA MASATAKA ,  NAKAJIMA YUTAKA ,  HATANAKA KEIKO ,  SHIRAKAMI SHOHEI ,  SASAKI HIROSHI ,  TANAKA AKIRA ,  TAKAHASHI FUMIE ,  MUKOYOSHI KOICHIRO ,  HIGASHI YASUYUKI ,  OKIMOTO AKIRA ,  HONDO TAKESHI ,  SAWADA HITOSHI

IPC分类号： C07D471/04 ,  A61K31/437 ,  A61P11/06 ,  A61P17/00 ,  A61P25/28 ,  A61P35/00 ,  A61P35/02 ,  A61P37/06 ,  C07D471/14 ,  C07D498/04

CPC分类号： C07D471/14 ,  C07D519/00

摘要： The invention relates to compound of the formula (I) or its salt, wherein -R 1 , -R 2 , -R 3 , -R 4 , -R 5 , -M-, -X- and -Y= are as defined in the description, their use of as, medicament, the process for their preparation and use for the treatment of JAK3 mediated diseases.

摘要翻译： 本发明涉及式（I）化合物或其盐，其中-R 1，R 2，R 3， R 4，-R 5，-M-，-X-和-Y =如说明书中所定义，它们作为药物的用途，其用途为 制备和用于治疗JAK3介导的疾病。

公开(公告)号：WO2005061475A3

公开(公告)日：2006-05-04

申请号：PCT/JP2004019454

申请日：2004-12-17

申请人： ASTELLAS PHARMA INC ,  HATTORI KOUJI ,  FUJII NAOAKI ,  TANAKA AKIRA ,  WASHIZUKA KENICHI ,  SAKURAI MINORU ,  KURODA SATORU ,  TODA SUSUMU ,  NAKAJIMA YUTAKA

发明人： HATTORI KOUJI ,  FUJII NAOAKI ,  TANAKA AKIRA ,  WASHIZUKA KENICHI ,  SAKURAI MINORU ,  KURODA SATORU ,  TODA SUSUMU ,  NAKAJIMA YUTAKA

IPC分类号： C07D209/42 ,  C07D215/48 ,  C07D307/85 ,  C07D471/04

CPC分类号： C07D215/48 ,  C07D209/42 ,  C07D307/85 ,  C07D471/04

摘要： Ornithine derivatives of the formula (I): wherein X is -CO- or -(CH 2 ) k - (wherein k is 1, 2 or 3); Y is Z-(CH 2 ) n -, and the like; {wherein Z is R 1 -CO-NR 4 -, and the like, (wherein R 1 is aryl, and the like; and R 4 is hydrogen, or lower alkyl); and n is 1, 2, 3, 4, 5 or 6}; R 2 is aryl-(lower alkyl), and the like; R 3 is -Q-R 7 , [wherein Q is -CO- or -SO 2 -, R 7 is heterocyclyl], and the like; and R 5 and R 6 are independently hydrogen or lower alkyl; or a pharmaceutically acceptable salt thereof, which are useful as medicament.

摘要翻译： 式（I）的鸟氨酸衍生物：其中X是-CO-或 - （CH 2 CH 2）n - （其中k是1,2或3）; Y是Z-（CH 2）n - 等等; {其中Z是R 1 -CO-NR 4 - 等，（其中R 1是芳基等）和 R 4是氢或低级烷基）; n为1,2,3,4,5或6}; R 2是芳基 - （低级烷基）等; R 3是-QR 7，[其中Q是-CO-或-SO 2 - ，R 7， 是杂环基]等; R 5和R 6独立地是氢或低级烷基; 或其药学上可接受的盐，其可用作药物。