摘要:
Die Erfindung betrifft einen Strukturkörper und ein Verfahren zu seiner Herstellung, wobei der Strukturkörper wenigstens aus einem pulverförmigen Ausgangsmaterial unter Einwirkung von Wärme und/oder Druck hergestellt ist und mehrere Schichten aufweist, wobei das Ausgangsmaterial überwiegend aus thermoplastischem Basismaterial besteht, die Dichte von wenigstens zwei Schichten des Strukturkörpers unterschiedlich ist, sowie wenigstens eine Schicht geringerer Dichte Mikrohohlkugeln enthält.
摘要:
Auskleidungsschlauch zur Sanierung von fluidführenden Systemen mit a) mindestens einem inneren Folienschlauch auf der Basis eines thermoplastischen Kunststoffs, b) mindestens einem äußeren Folienschlauch auf der Basis eines thermoplastischen Kunststoffs und c) mindestens einem mit einem photochemisch härtbaren Harz getränkten Faserschlauch zwischen mindestens einem inneren und mindestens einem äußeren Folienschlauch, wobei ein äußerer Folienschlauch, der mit mindestens einem mit einem photochemisch härtbaren Harz getränkten Faserschlauch in Berührung steht, auf der im eingebauten Zustand dem Faserschlauch zugewandten Oberfläche funktionelle Gruppen aufweist, die eine Reaktion mit dem Faserschlauch eingehen
摘要:
A method of manufacturing at least one structural panel (20) for an engineering structure comprises conveying a layered structure (40) through a roller assembly comprising at least one pair of heating rollers (50) and at least one pair of cooling rollers (52), where the cooling rollers are at a lower temperature than the heating rollers. The layer structure comprises a thermoplastic foam layer 24 and at least one skin layer (22). The heating rollers 0 heat the skin layer (22) to melt at least part of the foam layer (24) adjacent to the skin layer (22) and bond the foam layer (24) to the skin (22). The cooling rollers (52) cool the layered structure (40) so that the thermoplastic resolidifies, retaining its bond with the skin to form the bonded panel (20). This approach greatly reduces manufacturing costs for structural panels.
摘要:
Vorrichtung (10) zur Entdröhnung eines Bauteils (40), aufweisend eine Dämpfungsschicht (20) aus einem geschäumten Material und eine mit der Dämpfungsschicht (20) fest verbundenen Versteifungsschicht (30), welche steifer ist als die Dämpfungsschicht (20), wobei die Dämpfungsschicht (20) durch einen geschäumten Schmelzkleber gebildet ist.
摘要:
본 발명은, 고분자 입자를 대전하여 대전된 고분자 입자를 형성하는 대전수단 및 상기 대전된 고분자 입자를, 전기화학소자용 기재의 적어도 일면에 전사하여 접착층이 도포된 전기화학소자용 기재를 형성하는 전사수단을 포함하며, 상기 전기화학소자용 기재는 캐소드, 애노드 및 세퍼레이터 중 1종 이상인 인쇄유닛; 및 상기 접착층이 도포된 전기화학소자용 기재를 이용하여, 열 및 압력을 가해 캐소드, 애노드, 및 상기 캐소드와 상기 애노드 사이에 개재된 세퍼레이터를 포함하는 전극조립체를 형성하는 적층유닛;을 포함하는 전극조립체의 제조장치를 제공한다. 본 발명에 따르면 용매첨가가 아닌, 정전기를 이용한 레이저 프린팅 방식으로 전기화학소자용 기재에 접착층을 형성시킴으로써 용매가 불필요하고, 이에 따른 취급 및 보관에 대한 부담이 없어 비용절감 효과가 발생하고, 용매의 건조단계가 불필요하여, 신속하게 전극조립체를 제조할 수 있다.
摘要:
Panel for forming a floor covering, wherein this panel (1) comprises at least a layer (9) of thermoplastic material, characterized in that said layer (9) also comprises at least individual fibers having a length greater than 1 millimeter.
摘要:
A method of joining substrate portions includes positioning the substrate portions such that the substrate portions overlap at an overlap area. The substrate portions each have a melting temperature and an outer surface. A fluid is heated to a temperature sufficient to at least partially melt the substrate portions. A jet of the heated fluid is directed from a fluid orifice onto the substrate portions at the overlap area. The heated fluid penetrates at least one of the outer surfaces of the substrate portions. The substrate portions are at least partially melted using the heated fluid. The substrate portions are compressed using a pressure applying surface adjacent the fluid orifice to join the substrate portions together at the overlap area.
摘要:
Multi-layer bags may be formed to include first and second sidewalls joined along a first side edge, an opposite second side edge, and a closed bottom edge. The first and second layers may be non-continuously laminated together in discrete sections to include bonded regions in which the layers are bonded and unbonded regions in which the layers are not bonded. Such a bag may be described as a "bag- in-a-bag" type configuration in which the inner bag is non-continuously bonded to the outer bag. The inventors have surprisingly found that such configurations of non-continuous bonding provides increased and unexpected strength properties to the multi-layer films and bags.