Abstract:
Processing methods comprising depositing an initial hardmask film on a substrate by physical vapor deposition and exposing the initial hardmask film to a treatment plasma comprising a silane compound to form the hardmask.
Abstract:
A photo-mask for use in extreme ultraviolet (EUV) lithography, in which the photo-mask has low coefficient of thermal expansion and high specific stiffness.
Abstract:
Disclosed are methods and apparatus for facilitating an inspection of a sample using an optical inspection tool. An optical inspection tool is used to obtain an optical image or signal from an EUV reticle that specifies an intensity variation across the EUV reticle, and this intensity variation is converted to a CD variation that removes a flare correction CD variation so as to generate a critical dimension uniformity (CDU) map without the flare correction CD variation. This removed flare correction CD variation originates from design data for fabricating the EUV reticle, and such flare correction CD variation is generally designed to compensate for flare differences that are present across a field of view (FOV) of a photolithography tool during a photolithography process. The CDU map is stored in one or more memory devices and/or displayed on a display device, for example, of the inspection tool or a photolithography system.
Abstract:
The present inventions relates to a substrate for a photolithographic mask comprising a coating deposited on a rear surface of the substrate, wherein the coating comprises (a) at least one electrically conducting layer, and (b) wherein a thickness of the at least one layer is smaller than 30 nm, preferably smaller than 20 nm, and most preferably smaller than 10 nm.
Abstract:
The invention refers to a method for analyzing a defect of an optical element for the extreme ultra-violet wavelength range comprising at least one substrate and at least one multi-layer structure, the method comprising the steps: (a) determining first data by exposing the defect to ultra-violet radiation, (b) determining second data by scanning the defect with a scanning probe microscope, (c) determining third data by scanning the defect with a scanning particle microscope, and (d) combining the first, the second and the third data.
Abstract:
A self-powered 'near field' lithographic system 100 includes three primary components, namely, a thin film or emitter substrate 110 including a radioactive material (e.g., a radioisotope 112), a target substrate 120 which carries an energy-modifiable layer 122 (e.g., photo-resist) and a stencil (e.g., 130) that is either positioned between the emitter and target substrates fabricated upon and defined in the emitter substrate. The stencil is made from a material capable of blocking particles emitted through radioactive decay from the radioisotope of the emitter substrate. The stencil includes openings or vias 132 patterned to permit selective transmission of the particles emitted through radioactive decay from the radioisotope of the emitter substrate 110, and the stencil is preferably placed up against (or very close to) the target substrate 120.
Abstract translation:自供电的“近场”光刻系统100包括三个主要部件,即包括放射性材料(例如放射性同位素112)的薄膜或发射极衬底110,目标衬底120 携带能量可修改层122(例如,光刻胶)和模板(例如130),该模板位于在发射器基板上制造并限定在发射器基板上的发射器基板和目标基板之间。 模板由能够阻挡来自发射器基板的放射性同位素的放射性衰减而发射的粒子的材料制成。 该模板包括开口或通孔132,该开口或通孔被图案化以允许通过放射性衰变从发射器基板110的放射性同位素发射的粒子的选择性透射,并且模板优选地被放置在目标基板120上(或非常接近)。 p >