Abstract:
A two transistor memory cell is described that uses high mobility amorphous oxide semiconductors. In one example, a sensing transistor has a source and a drain in a first metal layer and a gate between the source and the drain. The gate has a channel formed of a metal oxide semiconductor. A charging transistor has a source and a drain in a second metal layer and a gate channel also formed of metal oxide semiconductor, wherein the source of the charging transistor is coupled to the gate of the sensing transistor, and a gate electrode in a third metal layer is coupled to the gate of the charging transistor.
Abstract:
The memory device includes a first transistor and a circuit. The circuit includes a second to a (2 n + 1)th transistor, a first to an n -th capacitor, a first wiring, and a first to an n -th retention node ( n is an integer greater than or equal to 2). When n is 2, a memory cell MC[1] includes a transistor ROS[1], a transistor WOS[1], and a capacitor C[1] and a memory cell MC[2] includes a transistor ROS[2], a transistor WOS[2], and a capacitor C[2]. A back gate of the transistor WOS[1] and a back gate of the transistor WOS[2] are electrically connected to a wiring WBG. A bake gate of a first transistor, a back gate of the transistor ROS[1], and a back gate of the transistor ROS[2] are electrically connected to a wiring RBG.
Abstract:
A gain cell includes a write bit line input, a read bit line output, a write trigger input and a read trigger input. The gain cell also includes a write transistor, retention element and read transistor. Each of the transistors includes a respective first diffusion connection, gate connection and second diffusion connection. The write transistor first diffusion connection is connected to the write bit line input and the write transistor gate connection is connected to the write trigger input. The read transistor first diffusion connection being connected to the read bit line output and the second diffusion connection is connected to the read trigger input. The retention element buffers between write transistor and the read transistor during data retention. The retention element also connects or disconnects a write transistor diffusion connection to/from a constant voltage in accordance with a retained data level at the read transistor gate connection.
Abstract:
A conventional DRAM needs to be refreshed at an interval of several tens of milliseconds to hold data, which results in large power consumption. In addition, a transistor therein is frequently turned on and off; thus, deterioration of the transistor is also a problem. These problems become significant as the memory capacity increases and transistor miniaturization advances. A transistor is provided which includes an oxide semiconductor and has a trench structure including a trench for a gate electrode and a trench for element isolation. Even when the distance between a source electrode and a drain electrode is decreased, the occurrence of a short-channel effect can be suppressed by setting the depth of the trench for the gate electrode as appropriate.
Abstract:
A random access memory (RAM) cell provides a control section and a storage section coupled to the storage section. The storage section includes complementary metal-oxide semiconductor (CMOS) transistors and the storage section is read by pre-charging the control section to a virtual drain voltage.
Abstract:
A four-transistor memory cell having a cross coupled transistors (Q10, Q11) and a pair of pass gates (Q12, Q13) is disclosed. The four-transistor memory cell is refreshed by charge transfer between the bit lines (BL, BL#) and the internal node (90, 92) during bit line precharge.
Abstract:
A low-power storage device is provided. The storage device includes a first transistor, a second transistor, a logic element, and a semiconductor element. The second transistor controls supply of a first signal to a gate of the first transistor. When the potential of a second signal to be input is changed from a first potential into a second potential lower than the first potential, the logic element changes the potential of a first terminal of the first transistor from a third potential lower than the second potential into the first potential after the logic element changes the potential of the first terminal of the first transistor from the second potential into the third potential. The semiconductor element has a function of making a second terminal of the first transistor floating. The first transistor includes a channel formation region in an oxide semiconductor film.
Abstract:
Techniques for refreshing a semiconductor memory device are disclosed. In one particular exemplary embodiment, the techniques may be realized as a method for refreshing a semiconductor memory device may include applying a plurality of voltage potentials to a memory cell in an array of memory cells. Applying a plurality of voltage potentials to the memory cell may include applying a first voltage potential to a first region of the memory cell via a respective source line of the array. Applying a plurality of voltage potentials to the memory cells may also include applying a second voltage potential to a second region of the memory cell via a respective local bit line and a respective selection transistor of the array. Applying a plurality of voltage potentials to the memory cells may further include applying a third voltage potential to a respective word line of the array, wherein the word line may be spaced apart from and capacitively to a body region of the memory cell that may be electrically floating and disposed between the first region and the second region. Applying a plurality of voltage potentials to the memory cells may further include applying a fourth voltage potential to a third region of the memory cell via a respective carrier injection line of the array.
Abstract:
An object is to provide a semiconductor device with a novel structure in which stored data can be held even when power is not supplied, and the number of times of writing is not limited. The semiconductor device is formed using a wide gap semiconductor and includes a potential change circuit which selectively applies a potential either equal to or different from a potential of a bit line to a source line. Thus, power consumption of the semiconductor device can be sufficiently reduced.