Abstract:
In an embodiment, a processor includes at least one core to execute instructions and a memory controller coupled to the at least one core. In turn, the memory controller includes a spare logic to cause a dynamic transfer of data stored on a first memory device coupled to the processor to a second memory device coupled to the processor, responsive to a temperature of the first memory device exceeding a thermal threshold. Other embodiments are described and claimed.
Abstract:
A circuit includes a plurality of transistors responsive to a plurality of latches that store a test code. The circuit further includes a first bit line coupled to a data cell and coupled to a sense amplifier. The circuit also includes a second bit line coupled to a reference cell and coupled to the sense amplifier. A current from a set of the plurality of transistors is applied to the data cell via the first bit line. The set of the plurality of transistors is determined based on the test code. The circuit also includes a test mode reference circuit coupled to the first bit line and to the second bit line.
Abstract:
A semiconductor storage device in which an operation check can be made in the worst case of address combination and its testing method are disclosed. In testing the semiconductor storage device, specific data is written in a memory cell array (30), a test mode is set up by using a test signal (TE1) of 1 , a refresh address for test is stored in a data storage circuit (51), a first address for test is applied to an address terminal (21) thereby to conduct normal read or write according to the fist address, a second address for test is applied to the address terminal (21) thereby to conduct refresh according to the refresh address and to conduct normal read or write according to the second address, and data in the memory cell array (30) is checked to detect a false if any.
Abstract:
A memory system (10) capable of being configured for optimum performance after fabrication using control parameters stored in non-volatile data storage units (12A). The system includes an array of memory cells (12) separate from the data storage units (12A), arranged in a multiplicity of rows and columns, with each cell located in one of the rows being coupled to a common word line and with each cell located in one of the columns being coupled to a common bit line. Control circuitry (19) for controlling memory operations such as programming the memory cells and reading the memory cells when the memory system is in a normal mode of operation. The non-volatile data storage units (12A) store control parameter data used by the control means for controlling the memory operations, with the control parameters being modifiable when the memory system is placed in an alternative mode of operation as opposed the normal mode of operation. Once the memory has been fabricated and characterized, the control parameters can be selected for optimum memory performance and loaded into the data storage units.
Abstract:
Addresses of memory cells that have errors corrected by error correction operations are evaluated to identify a failed row of memory. A post package repair is implemented on the failed row with a method comprising obtaining indications of the error correction operations, logging addresses of memory cells having errors corrected by the error correction operations, evaluating the addresses to identify the failed row, and implementing the post package repair operation on the failed row.
Abstract:
Memory die can be stacked to form a three-dimensional integrated circuit. For example, through-silicon vias (TSVs) can permit signals to pass vertically through the three-dimensional integrated circuit. Disclosed herein are apparatuses and methods to perform post package trimming of memory die, which advantageously permits the memory die to be trimmed after the memory die is stacked, such that test and trimming characteristics are relatively close to that which will be actually be encountered.
Abstract:
In an embodiment, a memory device may contain device processing logic and a mode register. The mode register may a register that may specify a mode of operation of the memory device. A field in the mode register may hold a value that may indicate whether a command associated with the memory device is disabled. The value may be held in the field until either the memory device is power-cycled or reset. The device processing logic may acquire an instance of the command. The device processing logic may determine whether the command is disabled based on the value held by the mode register. The device processing logic may not execute the instance of the command if the device processing logic determines the command is disabled. If the device processing logic determines the command is not disabled, the device processing logic may execute the instance of the command.
Abstract:
A microcontroller communicating via a data path and an address path with a memory block containing encrypted contents, the microcontroller including the capability for detecting resets effectuated in the wake of an unauthorized attempt to gain access to the encrypted contents and the capability of evading such an unauthorized attempt.
Abstract:
A supervoltage circuit has been described which uses a resistor divider as an input stage. The resistor divider decreases the dependency of the supervoltage trip point on transistor threshold voltages (Vt). The stability of supervoltage trip point is significantly increased over traditional supervoltage circuits using diode connected transistors as an input stage. The supervoltage circuit can be included in any integrated circuit including memory devices.
Abstract:
A special mode key match comparison module has N-storage elements and a special mode key match comparator. The N-storage elements accumulate a serial data stream, and then determine whether a digital device should operate in a normal user mode, in a public programming mode, or in a particular private test mode. To reduce the possibility of accidentally decoding a false test or programming mode, the data stream has a sufficiently large number of N-bits to substantially reduce the probability of a false decode. To further reduce the possibility of accidentally decoding a programming or test mode, the special mode key match comparison module may be reset if less or more than N-clocks are detected during the accumulation of the N-bit serial data stream. The special mode key match data patterns may represent a normal user mode, a public programming mode, and particular private manufacturer test modes.