Abstract:
A sensing circuit with current offset functionality. In one embodiment, the sensing circuit includes a memory circuit having a first offset circuit operative to offset a first current. The sensing circuit also includes a reference circuit coupled to the memory circuit, where the reference circuit includes a second offset circuit operative to offset a second current. The sensing circuit also includes a compare circuit coupled to the memory circuit and the reference circuit, where the compare circuit determines the state of a memory cell based on first current and the second current. According to the system disclosed herein, the first and second offset circuits optimize the performance of the sensing circuit and prevent errors when determining the state of the memory cell.
Abstract:
A sensing circuit with current offset functionality. In one embodiment, the sensing circuit includes a memory circuit having a first offset circuit operative to offset a first current. The sensing circuit also includes a reference circuit coupled to the memory circuit, where the reference circuit includes a second offset circuit operative to offset a second current. The sensing circuit also includes a compare circuit coupled to the memory circuit and the reference circuit, where the compare circuit determines the state of a memory cell based on first current and the second current. According to the system disclosed herein, the first and second offset circuits optimize the performance of the sensing circuit and prevent errors when determining the state of the memory cell.
Abstract:
A memory device (100) includes a memory array (102) and a sense amplifier (108). The memory array (102) includes a floating body cell (320, 420) configured to store a bit value. The sense amplifier (108) includes a bit output configured to provide an output voltage representative of the bit value and a reference source (302) configured to provide a reference voltage. The sense amplifier (108) further includes a current mirror (330, 430) configured to provide a current to the first floating body cell (320, 420) based on the reference voltage, and a differential amplifier circuit (332, 432) configured to determine the output voltage based on the reference voltage and a voltage across the floating body cell (320, 420) resulting from application of the current to the floating body cell (320, 420).
Abstract:
The memory circuit comprises at least one memory element (T1), a sense amplifier (SA) for sensing a state of the memory element (T1), a switching device (T2) for selectively coupling the sense amplifier (SA) to the memory element (T1), The sense amplifier (SA) comprises a first module (M1) and a second module (M2). The first module (M1) provides a first current limited to a maximum value (Iref+Ibias). The second module (M2) provides a second current which decreases from a value higher than the maximum value at the start of a sensing operation until a value lower than the maximum value at the end of the sensing operation. The memory circuit has a third module (CS2) for sinking a third current (Ibias) at a side of the switching device (T2) coupled to the memory element (T1).
Abstract:
A flash memory array includes a reference bit line on which a reference current is imposed. During read operation, bit lines selected for reading are connected to current-to- voltage converters, each of which generates an output voltage based upon the input current flowing in the bit line. The output voltage of the current- to- voltage converter is compared to a reference voltage derived from the output of a reference current-to-voltage converter whose input is driven by a reference current on a reference bit line. Any cell that conducts more current than the reference current will be regarded as an erased cell. Conversely, any cell that conducts less current than the reference current will be regarded as a programmed cell.
Abstract:
Source line bias is an error introduced by a non-zero resistance in the ground loop of the read/write circuits. During sensing the control gate voltage of a memory cell is erroneously biased by a voltage drop across the resistance. This error is minimized when the current flowing though the ground loop is reduced. A method for reducing source line bias is accomplished by read/write circuits with features and techniques for multi-pass sensing. When a page of memory cells are being sensed in parallel, each pass helps to identify and shut down the memory cells with conduction current higher than a given demarcation current value. In particular, the identified memory cells are shut down after all sensing in the current pass have been completed. In this way the shutting down operation does not disturb the sensing operation. Sensing in subsequent passes will be less affected by source line bias since the total amount of current flow is significantly reduced by eliminating contributions from the higher current cells. In another aspect of sensing improvement, a reference sense amplifier is employed to control multiple sense amplifiers to reduce their dependence on power supply and environmental variations.
Abstract:
A symmetrical high-speed current sense amplifier (44) having complementary reference cells and configurable load devices (42) that eliminates architecture-related capacitive mismatch contributions. The current sense amplifier (44) is adapted for use in a symmetric sensing architecture and includes a configurable current mirror (36). The current sense amplifier includes a voltage comparator (34), a first clamping device (T1) coupled between a first input of the voltage comparator and a first input signal, the first clamping device being coupled to a reference voltage. A second clampling device (T2) is coupled between the second input of the voltage comparator and a second input signal, the second clamping device being coupled to the reference voltage. A current mirror (36) is coupled between the first and second input of the voltage comparator. The current mirror may be configurable by select transistors. Alternatively, the current mirror may be hard-wired, and a multiplexer may be used to select whether the first input signal or the second input signal is connected to a first or second side of the current mirror. Configurable dummy loads (42) may be added at appropriate nodes to optimize the capacitive load and increase the speed of the amplifier. Equalization devices may be coupled between the first and second inputs of the voltage comparator (T4), and between the first input signal and the second input signal (T3).
Abstract:
A sense amplifier (15) that is configurable to operate in two modes in order to control a voltage swing on the sense amplifier output (40). The sense amplifier has two feedback paths (45 to 35) including a first feedback path (P101, N101, N133) having a transistor (N133) with a fast response time in order to allow the circuit to operate as fast as possible, and a second feedback path (P121, P102, N102, N121, N132, N131) for providing voltage swing control. In the first operating mode, the "turbo" mode, both feedback paths are in operation (BOOST = HIGH) to provide a higher margin of swing control, thus higher sensing speed. In the second operating mode, the "non-turbo" mode, only the first feedback path is in operation (BOOST = LOW) which allows for greater stability and a reduction in power consumption.
Abstract:
In a memory (10), a sensing system (14) detects bit states using one data (54) and two reference (64, 75) inputs, to sense a difference in conductance of a selected memory bit cell (77) and a midpoint reference conductance. Reference conductance is generated as the average conductance of a memory cell (78) in the high conductance state and a memory cell (79) in the low conductance state. The data input (54) is coupled to the selected memory bit cell (77). The two reference inputs are respectively coupled to memory cells in high and low conductance memory states. The sense amplifiers use either current biasing or voltage biasing to apply a sensing voltage within a predetermined voltage range across the bit cells. Capacitance coupled to complementary outputs of the sense amplifiers is balanced by the circuit designs. In one form, the two reference inputs are internally connected. One of several gain stages (90, 150, 110, 130) amplifies the sense amplifier output without injecting parasitic errors.
Abstract:
The preferred embodiments described herein provide a memory device with row (55) and column (30) decoder circuits arranged in a checkerboard pattern under a plurality of memory arrays (1-9). In one preferred embodiment, a memory device is provided with its row decoder circuits and column decoder circuits arranged in a checkerboard pattern under a plurality of memory arrays. Because each of the row decoder and column decoder circuits is associated with the memory array above its location and an adjacent array, a denser support circuit arrangement is provided as compared to prior approaches. Other preferred embodiments are provided, and each of the preferred embodiments described herein can be used alone or in combination with one another.