公开(公告)号：WO00059824A1

公开(公告)日：2000-10-12

申请号：PCT/DE2000/000890

申请日：2000-03-23

IPC: B81C1/00 ,  G01F1/684 ,  G01F1/692 ,  G01F1/69

CPC classification number: G01F1/692 ,  G01F1/6845 ,  Y10S156/922 ,  Y10S438/976 ,  Y10T29/49002 ,  Y10T29/49004 ,  Y10T29/49007 ,  Y10T29/4902 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T156/1082 ,  Y10T156/11

Abstract: Firstly, a supporting frame (1) is produced, whose opening (10) is spanned by an auxiliary layer (3) which lies flush with one side of said opening. Once the micro-structures, flat sections or membranes have been produced on the communal plane of auxiliary layer (3) and supporting frame (1), the auxiliary layer (3) is removed, preferably by using an etching process. In a preferred embodiment, the self-supporting micro-structures which have been produced according to the inventive method are used as an electrically heated resistance grid in a device for measuring weak gas flows.

Abstract translation: 首先，将支撑框架（1）产生时，其开口（10）被覆盖平齐在一侧上的辅助层（3）。 微结构上的辅助层（3）和支撑框架的公共平面平坦部分或膜的产生（1）之后，辅助层（3）优选通过蚀刻除去。 通过本发明的方法生产的自支撑微结构在一个优选的应用中用作电加热电阻栅中的装置，用于测量弱气流。

公开(公告)号：WO1997000534A1

公开(公告)日：1997-01-03

申请号：PCT/JP1996001621

申请日：1996-06-13

Applicant: NITTO DENKO CORPORATION ,  HITACHI, LTD. ,  YAMAMOTO, Takayuki ,  KUBOZONO, Tatsuya ,  KIHARA, Yasuo ,  OKAWA, Yuji ,  HASHIMOTO, Koichi ,  MATSUMURA, Takeshi ,  SEKIDO, Tatsuya ,  YAMAMOTO, Masayuki ,  HARADA, Chiaki

Inventor： NITTO DENKO CORPORATION ,  HITACHI, LTD.

IPC: H01L21/027

CPC classification number: H01L21/6836 ,  B08B7/0028 ,  G03F7/34 ,  G03F7/346 ,  G03F7/42 ,  H01L2221/68327 ,  Y10S156/922 ,  Y10T156/11

Abstract: When a resist on an object such as a silicon wafer is removed by using an adhesive sheet or the like, foreign particles are prevented from transferring from the adhesive sheet to the object to avoid electrical problems that may affect yield and reliability. To this end, a method of resist removal is provided wherein an adhesive layer formed on a resist-coated object is peeled together with the resist, the adhesive layer having an elastic modulus of at least 1 kg/mm at the time of peeling. An adhesive, an adhesive sheet, etc, used for this method are also provided.

Abstract translation: 当通过使用粘合片等除去诸如硅晶片的物体上的抗蚀剂时，防止异物从粘合片转移到物体，以避免可能影响产率和可靠性的电气问题。 为此，提供了一种抗蚀剂去除方法，其中形成在抗蚀涂层物体上的粘合剂层与抗蚀剂一起剥离，粘合剂层的弹性模量至少为1kg / mm 2， 剥离。 还提供了用于该方法的粘合剂，粘合片等。

公开(公告)号：WO2005028176A2

公开(公告)日：2005-03-31

申请号：PCT/US2004031071

申请日：2004-09-16

Applicant: SIPIX IMAGING INC ,  CHAUG YI-SHUNG ,  WANG XIAOJIA ,  KILUK SEAN ,  TSENG SCOTT ,  ZANG HONGMEI ,  LIANG RONG-CHANG

Inventor： CHAUG YI-SHUNG ,  WANG XIAOJIA ,  KILUK SEAN ,  TSENG SCOTT ,  ZANG HONGMEI ,  LIANG RONG-CHANG

IPC: B29C20060101 ,  B41M1/30 ,  C23C14/04 ,  C23C14/08 ,  C23C14/20 ,  G02F1/1343 ,  H01L51/00 ,  H05K3/04 ,  H05K3/14 ,  H05K3/16 ,  H05K3/18 ,  H05K3/38 ,  B29C

CPC classification number: H05K3/048 ,  B29C45/14811 ,  B29K2995/002 ,  B32B38/10 ,  C23C14/042 ,  C23C14/086 ,  C23C14/20 ,  G02F1/13439 ,  G09F7/165 ,  H01L51/0022 ,  H05K3/04 ,  H05K3/146 ,  H05K3/16 ,  H05K3/184 ,  H05K3/386 ,  H05K2201/0317 ,  H05K2203/0257 ,  H05K2203/0264 ,  H05K2203/0522 ,  H05K2203/0746 ,  Y10S156/922 ,  Y10T156/11 ,  Y10T156/1189

Abstract: A process for forming a patterned thin film structure on a substrate or in-mold decoration film is disclosed. A pattern is printed with a material, such as a masking coating or ink, on the substrate, the pattern being such that, in one embodiment, the desired structures will be formed in the areas where the printed material is not present, i.e., a negative image of thin film structure to be formed is printed. In another embodiment, the pattern is printed with a material that is difficult to strip from the substrate, and the desired thin film structures will be formed in the areas where the printed material is present, i.e., a positive image of the thin film structure is printed. The thin film material is deposited on the patterned substrate, and the undesired area is stripped, leaving behind the patterned thin film structure.

Abstract translation: 公开了一种在基板或模内装饰膜上形成图案化薄膜结构的工艺。 在衬底上印有诸如掩模涂层或油墨的材料的图案，该图案使得在一个实施例中，将在不存在印刷材料的区域中形成所需的结构，即， 打印要形成的薄膜结构的负像。 在另一个实施例中，图案印刷有难以从衬底剥离的材料，并且所需的薄膜结构将形成在存在印刷材料的区域中，即，薄膜结构的正像是 打印。 薄膜材料沉积在图案化的衬底上，并且不需要的区域被剥离，留下图案化的薄膜结构。

公开(公告)号：WO01012433A3

公开(公告)日：2001-09-07

申请号：PCT/US2000/022845

申请日：2000-08-17

IPC: C23C16/01 ,  C23C16/18 ,  C23C16/448 ,  C23C16/453 ,  H05K3/02 ,  H05K3/38 ,  B05D7/00 ,  C23C16/04 ,  C23C16/455 ,  C23C18/00

CPC classification number: C23C16/4486 ,  C23C16/01 ,  C23C16/18 ,  C23C16/453 ,  H05K3/025 ,  H05K3/382 ,  Y10S156/922 ,  Y10S428/901 ,  Y10S428/924 ,  Y10S428/926 ,  Y10S428/938 ,  Y10T156/11 ,  Y10T428/12438 ,  Y10T428/12556 ,  Y10T428/12583 ,  Y10T428/1259 ,  Y10T428/12611 ,  Y10T428/12639 ,  Y10T428/12646 ,  Y10T428/12667 ,  Y10T428/12708 ,  Y10T428/12715 ,  Y10T428/12722 ,  Y10T428/12743 ,  Y10T428/1275 ,  Y10T428/12778 ,  Y10T428/12792 ,  Y10T428/1284 ,  Y10T428/12868 ,  Y10T428/12875 ,  Y10T428/12882 ,  Y10T428/12889 ,  Y10T428/12896 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/12944 ,  Y10T428/12993

Abstract: A thin film product having a nanostructured surface, a laminate product including the thin film and a temporary substrate opposite the nanostructured surface, a laminate product including the thin film and a final substrate attached to the nanostructured surface and a method of producing the thin film products. The thin film is particularly useful in the electronics industry for the production of integrated circuits, touch screen, flat panel display, printed circuit boards and EMF shielding. The nanostructured surface includes surface features that are mostly smaller than one micron, while the dense portion of the thin film is between 10-200mm. The thin film is produced by coating a temporary substrate (such as aluminum foil) with a coating material (such as copper) using any process. One such method is concentrated heat deposition or a combustion, chemical vapor deposition process. The resulting thin film provides a high level of adhesion to a final substrate, by embedding the nanostructures with the material of the final substrate (such as epoxy resin). The surface of the thin film adjacent the temporary substrate substantially conforms to the substrate surface and has a relatively low peel strength. In this manner, the temporary substrate is easily removed from the thin film after attaching the opposite nanostructured side of the thin film to the final substrate with a resulting, higher peel strength.

Abstract translation: 具有纳米结构表面的薄膜产品，包含该薄膜和与该纳米结构表面相对的临时基材的层压产品，包含该薄膜的层压产品，以及附着于该表面的最终基材 纳米结构和生产薄膜产品的方法。 该薄膜在电子工业中用于集成电路，触摸屏，平板显示器，印刷电路板和电磁屏蔽的生产特别有用。 纳米结构表面具有通常小于1微米的表面特性，而薄膜的致密部分具有10-200纳米。 例如，可以通过使用任何方法用涂覆材料（例如铜）涂覆临时基板（诸如铝箔）来制造薄膜 集中热沉积方法，或者燃烧沉积或化学气相沉积的方法。 通过将纳米结构结合到最终基底（例如环氧树脂）的材料中，获得的薄膜对最终基底具有高水平的粘附性。 与临时基板相邻的薄膜表面基本上与基板表面一致，并具有较低的剥离强度。 以这种方式，在薄膜的相对纳米结构化表面附着到具有较高剥离强度的最终衬底之后，可以容易地从薄膜去除临时衬底。

公开(公告)号：WO0112433A2

公开(公告)日：2001-02-22

申请号：PCT/US0022845

申请日：2000-08-17

Applicant: MICROCOATING TECHNOLOGIES INC ,  HUNT ANDREW TYE ,  LUTEN HENRY A III

Inventor： HUNT ANDREW TYE ,  LUTEN HENRY A III

IPC: C23C16/01 ,  C23C16/18 ,  C23C16/448 ,  C23C16/453 ,  H05K3/02 ,  H05K3/38 ,  B32B15/00

CPC classification number: C23C16/4486 ,  C23C16/01 ,  C23C16/18 ,  C23C16/453 ,  H05K3/025 ,  H05K3/382 ,  Y10S156/922 ,  Y10S428/901 ,  Y10S428/924 ,  Y10S428/926 ,  Y10S428/938 ,  Y10T156/11 ,  Y10T428/12438 ,  Y10T428/12556 ,  Y10T428/12583 ,  Y10T428/1259 ,  Y10T428/12611 ,  Y10T428/12639 ,  Y10T428/12646 ,  Y10T428/12667 ,  Y10T428/12708 ,  Y10T428/12715 ,  Y10T428/12722 ,  Y10T428/12743 ,  Y10T428/1275 ,  Y10T428/12778 ,  Y10T428/12792 ,  Y10T428/1284 ,  Y10T428/12868 ,  Y10T428/12875 ,  Y10T428/12882 ,  Y10T428/12889 ,  Y10T428/12896 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/12944 ,  Y10T428/12993

Abstract: A thin film product having a nanostructured surface, a laminate product including the thin film and a temporary substrate opposite the nanostructured surface, a laminate product including the thin film and a final substrate attached to the nanostructured surface and a method of producing the thin film products. The thin film is particularly useful in the electronics industry for the production of integrated circuits, touch screen, flat panel display, printed circuit boards and EMF shielding. The nanostructured surface includes surface features that are mostly smaller than one micron, while the dense portion of the thin film is between 10-200mm. The thin film is produced by coating a temporary substrate (such as aluminum foil) with a coating material (such as copper) using any process. One such method is concentrated heat deposition or a combustion, chemical vapor deposition process. The resulting thin film provides a high level of adhesion to a final substrate, by embedding the nanostructures with the material of the final substrate (such as epoxy resin). The surface of the thin film adjacent the temporary substrate substantially conforms to the substrate surface and has a relatively low peel strength. In this manner, the temporary substrate is easily removed from the thin film after attaching the opposite nanostructured side of the thin film to the final substrate with a resulting, higher peel strength.

Abstract translation: 具有纳米结构表面的薄膜产品，包括薄膜和与纳米结构表面相对的临时基底的层压制品，包括薄膜和附着在纳米结构表面上的最终基底的层压制品以及制造薄膜产品的方法 。 薄膜在电子工业中特别适用于生产集成电路，触摸屏，平板显示器，印刷电路板和EMF屏蔽。 纳米结构表面包括大多小于1微米的表面特征，而薄膜的致密部分在10-200mm之间。 通过使用任何方法用涂覆材料（例如铜）涂覆临时基板（例如铝箔）来制造薄膜。 一种这样的方法是集中热沉积或燃烧，化学气相沉积工艺。 通过将纳米结构与最终基底（例如环氧树脂）的材料嵌入，所得薄膜提供了对最终基底的高水平粘附。 邻近临时衬底的薄膜的表面基本上符合衬底表面并且具有相对低的剥离强度。 以这种方式，在将薄膜的相对的纳米结构侧附着到最终基板上之后，可以容易地从薄膜上去除临时基板，从而获得更高的剥离强度。

公开(公告)号：WO98052391A1

公开(公告)日：1998-11-19

申请号：PCT/US1998/010044

申请日：1998-05-15

IPC: H05K1/00 ,  H05K3/00 ,  C09J7/02

CPC classification number: H05K3/007 ,  H05K1/0393 ,  H05K2203/0152 ,  H05K2203/016 ,  H05K2203/0278 ,  Y10S156/922 ,  Y10T156/11

Abstract: Methods of fixturing a flexible circuit substrate (20) to a processing carrier (60) are disclosed. In one implementation, the flexible circuit substrate (20) and processing carrier (60) are attached with an adhesive film (40) provided therebetween. The adhesive film (40) comprises acrylic, silicone or a silicone acrylic blend in a preferred embodiment of the present invention. Ideally, substantially the total surface area of a first surface (22) of the flexible circuit substrate (20) is attached to the processing carrier (60). The flexible circuit substrate (20) is removed from the adhesive film (40) following processing thereof. In a preferred embodiment of the present invention, the adhesive film (40) is monolithic. An electrical component (36) is attached to the flexible circuit substrate (20) and the flexible circuit substrate (20) is encapsulated in accordance with one implementation of the present invention.

Abstract translation: 公开了将柔性电路基板（20）固定到处理载体（60）的方法。 在一个实施方案中，柔性电路基板（20）和处理载体（60）附接有设置在它们之间的粘合膜（40）。 在本发明的优选实施方案中，粘合膜（40）包含丙烯酸，硅树脂或硅氧烷丙烯酸共混物。 理想地，柔性电路基板（20）的第一表面（22）的总表面积基本上附着在处理载体（60）上。 在其处理之后，从粘合膜（40）去除柔性电路基板（20）。 在本发明的优选实施例中，粘合膜（40）是整体的。 根据本发明的一个实施方式，将电气部件（36）附接到柔性电路基板（20）并且柔性电路基板（20）被封装。

公开(公告)号：WO1985001125A1

公开(公告)日：1985-03-14

申请号：PCT/NL1984000028

申请日：1984-08-24

Applicant: VAN ULDEN, Petrus, Jacobus, Leo, Cornelius

IPC: G03B21/64

CPC classification number: G03B27/6264 ,  G03D15/10 ,  Y10S156/922 ,  Y10T156/1095 ,  Y10T156/1097 ,  Y10T156/11 ,  Y10T156/1734 ,  Y10T428/24331 ,  Y10T428/24612

Abstract: A method of manufacturing a tape of sequential, framed, photographic diapositives in which at least one side of each frame not containing picture information is fixed by an adhesive to a continuous tape which moves rectilinearly in a direction parallel to said side.

Abstract translation: 一种制造顺序的框架式照相二极体胶带的方法，其中不包含图像信息的每个框架的至少一侧通过粘合剂固定到沿着平行于所述侧面的方向直线移动的连续带。