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公开(公告)号:CN104937715A
公开(公告)日:2015-09-23
申请号:CN201380071181.0
申请日:2013-11-24
申请人: 埃勒塔系统有限公司
IPC分类号: H01L23/66 , H01L23/10 , H01L23/498 , H01L21/56 , H01L25/065
CPC分类号: H01L25/0655 , H01L21/4817 , H01L21/486 , H01L21/52 , H01L21/56 , H01L23/053 , H01L23/055 , H01L23/147 , H01L23/367 , H01L23/49811 , H01L23/49827 , H01L23/49838 , H01L23/49866 , H01L23/66 , H01L24/17 , H01L24/46 , H01L24/48 , H01L24/49 , H01L24/81 , H01L24/85 , H01L25/0652 , H01L2223/6605 , H01L2223/6627 , H01L2223/6644 , H01L2224/05599 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/45015 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/73265 , H01L2224/85399 , H01L2224/92247 , H01L2924/00014 , H01L2924/01029 , H01L2924/10253 , H01L2924/10271 , H01L2924/10272 , H01L2924/10329 , H01L2924/1033 , H01L2924/15174 , H01L2924/15192 , H01L2924/15311 , H01L2924/181 , H01L2924/20101 , H01L2924/20102 , H01L2924/20103 , H01L2924/20104 , H01L2924/20105 , H01L2924/3011 , H01L2924/3025 , H01L2924/351 , H01L2924/00 , H01L2924/20755 , H01L2224/45099 , H01L2924/207 , H01L2924/00012
摘要: 给出集成电路器件及其制造方法。集成电路器件(1)包含可能通过不同的半导体技术制造的两个或更多个有源部件(30a、30b)和适于承载两个或更多个有源部件的内插器结构(10),使得有源部件中的至少一个承载于内插器结构的顶表面上。集成电路器件还包括布置于内插器结构的顶表面上并且封装有源部件中的至少一个金属帽(40)。本发明的集成电路器件的各种变体适于在极端条件下操作。
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公开(公告)号:CN104937715B
公开(公告)日:2018-02-06
申请号:CN201380071181.0
申请日:2013-11-24
申请人: 埃勒塔系统有限公司
IPC分类号: H01L23/66 , H01L23/10 , H01L23/498 , H01L21/56 , H01L25/065
CPC分类号: H01L25/0655 , H01L21/4817 , H01L21/486 , H01L21/52 , H01L21/56 , H01L23/053 , H01L23/055 , H01L23/147 , H01L23/367 , H01L23/49811 , H01L23/49827 , H01L23/49838 , H01L23/49866 , H01L23/66 , H01L24/17 , H01L24/46 , H01L24/48 , H01L24/49 , H01L24/81 , H01L24/85 , H01L25/0652 , H01L2223/6605 , H01L2223/6627 , H01L2223/6644 , H01L2224/05599 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/45015 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/73265 , H01L2224/85399 , H01L2224/92247 , H01L2924/00014 , H01L2924/01029 , H01L2924/10253 , H01L2924/10271 , H01L2924/10272 , H01L2924/10329 , H01L2924/1033 , H01L2924/15174 , H01L2924/15192 , H01L2924/15311 , H01L2924/181 , H01L2924/20101 , H01L2924/20102 , H01L2924/20103 , H01L2924/20104 , H01L2924/20105 , H01L2924/3011 , H01L2924/3025 , H01L2924/351 , H01L2924/00 , H01L2924/20755 , H01L2224/45099 , H01L2924/207 , H01L2924/00012
摘要: 给出集成电路器件及其制造方法。集成电路器件(1)包含可能通过不同的半导体技术制造的两个或更多个有源部件(30a、30b)和适于承载两个或更多个有源部件的内插器结构(10),使得有源部件中的至少一个承载于内插器结构的顶表面上。集成电路器件还包括布置于内插器结构的顶表面上并且封装有源部件中的至少一个的至少一个金属帽(40)。本发明的集成电路器件的各种变体适于在极端条件下操作。
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