专利检索 cpc:"H01L2224/4099" 第 1 页

1.

发明授权
半导体模块失效

公开(公告)号：CN105474386B

公开(公告)日：2018-05-29

申请号：CN201480046107.8

申请日：2014-10-06

申请人： 日本精工株式会社

发明人： 须永崇 , 金子昇 , 三好修 , 铃木良一

IPC分类号： H01L23/48 , H01L21/60 , H01L25/07 , H01L25/18

CPC分类号： H01L24/41 , H01L23/3735 , H01L23/492 , H01L23/49811 , H01L23/49838 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/35 , H01L24/37 , H01L24/40 , H01L24/83 , H01L24/84 , H01L24/92 , H01L25/07 , H01L25/072 , H01L25/18 , H01L29/7393 , H01L29/78 , H01L2224/05553 , H01L2224/0603 , H01L2224/2732 , H01L2224/29101 , H01L2224/32227 , H01L2224/32238 , H01L2224/32245 , H01L2224/33181 , H01L2224/352 , H01L2224/35847 , H01L2224/3701 , H01L2224/37011 , H01L2224/37013 , H01L2224/37124 , H01L2224/37139 , H01L2224/37144 , H01L2224/37147 , H01L2224/37611 , H01L2224/4001 , H01L2224/40095 , H01L2224/40227 , H01L2224/40475 , H01L2224/40499 , H01L2224/4099 , H01L2224/4112 , H01L2224/73263 , H01L2224/83192 , H01L2224/8321 , H01L2224/83424 , H01L2224/83447 , H01L2224/83801 , H01L2224/83815 , H01L2224/84138 , H01L2224/8421 , H01L2224/84424 , H01L2224/84447 , H01L2224/84801 , H01L2224/84815 , H01L2224/9221 , H01L2924/00015 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/15724 , H01L2924/19105 , H01L2924/35121 , H01L2924/365 , H01L2924/00 , H01L2924/00014 , H01L2224/291 , H01L2924/014 , H01L2924/00012 , H01L2924/01047 , H01L2224/29294 , H01L2224/293 , H01L2224/48 , H01L2224/85 , H01L2224/83 , H01L2224/84 , H01L2924/01029 , H01L2924/013 , H01L2924/00013

摘要： 提供基于焊锡的电连接的可靠性较高并且廉价的半导体模块。电极接合部(36bb)的与裸芯片FET(35)的栅电极(G)的被接合面对置的接合面以及基板接合部(36bc)的与其他的布线图案(33c)的被接合面对置的接合面具备脱气排出机构，该脱气排出机构使在金属板连接器(36b)的焊接时熔融的焊锡中产生的脱气从介于接合面与被接合面之间的焊锡(34c、34f)排出。

2.

发明公开
半导体模块失效

公开(公告)号：CN105474386A

公开(公告)日：2016-04-06

申请号：CN201480046107.8

申请日：2014-10-06

申请人： 日本精工株式会社

发明人： 须永崇 , 金子昇 , 三好修 , 铃木良一

IPC分类号： H01L23/48 , H01L21/60 , H01L25/07 , H01L25/18

CPC分类号： H01L24/41 , H01L23/3735 , H01L23/492 , H01L23/49811 , H01L23/49838 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/35 , H01L24/37 , H01L24/40 , H01L24/83 , H01L24/84 , H01L24/92 , H01L25/07 , H01L25/072 , H01L25/18 , H01L29/7393 , H01L29/78 , H01L2224/05553 , H01L2224/0603 , H01L2224/2732 , H01L2224/29101 , H01L2224/32227 , H01L2224/32238 , H01L2224/32245 , H01L2224/33181 , H01L2224/352 , H01L2224/35847 , H01L2224/3701 , H01L2224/37011 , H01L2224/37013 , H01L2224/37124 , H01L2224/37139 , H01L2224/37144 , H01L2224/37147 , H01L2224/37611 , H01L2224/4001 , H01L2224/40095 , H01L2224/40227 , H01L2224/40475 , H01L2224/40499 , H01L2224/4099 , H01L2224/4112 , H01L2224/73263 , H01L2224/83192 , H01L2224/8321 , H01L2224/83424 , H01L2224/83447 , H01L2224/83801 , H01L2224/83815 , H01L2224/84138 , H01L2224/8421 , H01L2224/84424 , H01L2224/84447 , H01L2224/84801 , H01L2224/84815 , H01L2224/9221 , H01L2924/00015 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/15724 , H01L2924/19105 , H01L2924/35121 , H01L2924/365 , H01L2924/00 , H01L2924/00014 , H01L2224/291 , H01L2924/014 , H01L2924/00012 , H01L2924/01047 , H01L2224/29294 , H01L2224/293 , H01L2224/48 , H01L2224/85 , H01L2224/83 , H01L2224/84 , H01L2924/01029 , H01L2924/013 , H01L2924/00013

摘要： 提供基于焊锡的电连接的可靠性较高并且廉价的半导体模块。电极接合部(36bb)的与裸芯片FET(35)的栅电极(G)的被接合面对置的接合面以及基板接合部(36bc)的与其他的布线图案(33c)的被接合面对置的接合面具备脱气排出机构，该脱气排出机构使在金属板连接器(36b)的焊接时熔融的焊锡中产生的脱气从介于接合面与被接合面之间的焊锡(34c、34f)排出。