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公开(公告)号：CN105765715B
公开(公告)日：2018-08-03
申请号：CN201480064539.1
申请日：2014-07-31
申请人： 三菱电机株式会社
发明人： 田屋昌树
IPC分类号： H01L25/07 , H01L21/60 , H01L21/607 , H01L23/28 , H01L25/18
CPC分类号： H01L23/053 , H01L21/4853 , H01L23/24 , H01L23/293 , H01L23/3142 , H01L23/3735 , H01L23/49811 , H01L23/49844 , H01L23/535 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/35 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/83 , H01L24/84 , H01L25/07 , H01L25/18 , H01L2224/04026 , H01L2224/05624 , H01L2224/05647 , H01L2224/291 , H01L2224/32227 , H01L2224/35847 , H01L2224/37005 , H01L2224/37011 , H01L2224/37012 , H01L2224/37032 , H01L2224/37124 , H01L2224/37147 , H01L2224/4007 , H01L2224/40137 , H01L2224/40245 , H01L2224/4046 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/48245 , H01L2224/73263 , H01L2224/83447 , H01L2224/83801 , H01L2224/83815 , H01L2224/84205 , H01L2224/84447 , H01L2224/85447 , H01L2924/00014 , H01L2924/00015 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/35121 , H01L2924/00 , H01L2224/48 , H01L2924/014 , H01L2924/00012 , H01L2924/207 , H01L2924/2076
摘要： 本发明得到提高制造成品率并且确保稳定的接合强度来提高可靠性的功率模块。种功率模块,具备:基体材料部(3),在个面形成电极部(4);导体部(5),与该基体材料部(3)的形成有电极部(4)的个面对置地配置,并与外部电连接;以及布线部(7),接合到形成于基体材料部(3)的个面的电极部(4)和导体部(5)的与基体材料部(3)的个面对置的面,对电极部(4)和导体部(5)进行电连接。
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公开(公告)号：CN104821303A
公开(公告)日：2015-08-05
申请号：CN201410302823.X
申请日：2014-06-30
申请人： 株式会社东芝
发明人： 宫川毅
IPC分类号： H01L23/495 , H01L23/31
CPC分类号： H01L23/49537 , H01B1/02 , H01B5/00 , H01L23/3107 , H01L23/49503 , H01L23/49524 , H01L23/49541 , H01L23/49548 , H01L23/49562 , H01L23/49568 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/35 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/73 , H01L24/83 , H01L24/84 , H01L2224/291 , H01L2224/29147 , H01L2224/29294 , H01L2224/29339 , H01L2224/32245 , H01L2224/33181 , H01L2224/352 , H01L2224/35847 , H01L2224/3701 , H01L2224/37012 , H01L2224/37013 , H01L2224/37147 , H01L2224/40245 , H01L2224/40499 , H01L2224/4103 , H01L2224/41051 , H01L2224/73263 , H01L2224/83143 , H01L2224/83447 , H01L2224/83801 , H01L2224/83815 , H01L2224/84143 , H01L2224/84801 , H01L2224/84815 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/20645 , H01L2924/20646 , H01L2924/20647 , H01L2924/20648 , H01L2924/20649 , H01L2924/2065 , H01L2924/00 , H01L2924/00012 , H01L2924/00014 , H01L2924/014
摘要： 本发明涉及连接器框架以及半导体装置。连接器框架具备框架部、从所述框架部突出并一体地设置于所述框架部的第1连接器、以及从所述框架部突出并一体地设置于所述框架部的第2连接器。所述第1连接器具有第1部分、和设置于所述第1部分与所述框架部之间且比所述第1部分薄的第2部分。所述第2连接器的厚度与所述第1连接器的所述第2部分相同。
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公开(公告)号：CN105765715A
公开(公告)日：2016-07-13
申请号：CN201480064539.1
申请日：2014-07-31
申请人： 三菱电机株式会社
发明人： 田屋昌树
IPC分类号： H01L25/07 , H01L21/60 , H01L21/607 , H01L23/28 , H01L25/18
CPC分类号： H01L23/053 , H01L21/4853 , H01L23/24 , H01L23/293 , H01L23/3142 , H01L23/3735 , H01L23/49811 , H01L23/49844 , H01L23/535 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/35 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/83 , H01L24/84 , H01L25/07 , H01L25/18 , H01L2224/04026 , H01L2224/05624 , H01L2224/05647 , H01L2224/291 , H01L2224/32227 , H01L2224/35847 , H01L2224/37005 , H01L2224/37011 , H01L2224/37012 , H01L2224/37032 , H01L2224/37124 , H01L2224/37147 , H01L2224/4007 , H01L2224/40137 , H01L2224/40245 , H01L2224/4046 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/48245 , H01L2224/73263 , H01L2224/83447 , H01L2224/83801 , H01L2224/83815 , H01L2224/84205 , H01L2224/84447 , H01L2224/85447 , H01L2924/00014 , H01L2924/00015 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/35121 , H01L2924/00 , H01L2224/48 , H01L2924/014 , H01L2924/00012 , H01L2924/207 , H01L2924/2076
摘要： 本发明得到提高制造成品率并且确保稳定的接合强度来提高可靠性的功率模块。一种功率模块，具备：基体材料部(3)，在一个面形成电极部(4)；导体部(5)，与该基体材料部(3)的形成有电极部(4)的一个面对置地配置，并与外部电连接；以及布线部(7)，接合到形成于基体材料部(3)的一个面的电极部(4)和导体部(5)的与基体材料部(3)的一个面对置的面，对电极部(4)和导体部(5)进行电连接。
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公开(公告)号：CN103918076A
公开(公告)日：2014-07-09
申请号：CN201380003722.6
申请日：2013-10-25
申请人： 日本精工株式会社
CPC分类号： H05K1/09 , H01L23/142 , H01L23/3735 , H01L23/49582 , H01L23/49811 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/35 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/73 , H01L24/83 , H01L24/84 , H01L24/92 , H01L25/07 , H01L25/072 , H01L25/18 , H01L2224/05553 , H01L2224/0603 , H01L2224/291 , H01L2224/29294 , H01L2224/293 , H01L2224/32227 , H01L2224/32238 , H01L2224/33181 , H01L2224/352 , H01L2224/35847 , H01L2224/3701 , H01L2224/37013 , H01L2224/37147 , H01L2224/40095 , H01L2224/40225 , H01L2224/40227 , H01L2224/40475 , H01L2224/40499 , H01L2224/4103 , H01L2224/4112 , H01L2224/48 , H01L2224/73263 , H01L2224/77272 , H01L2224/83191 , H01L2224/83192 , H01L2224/8321 , H01L2224/83424 , H01L2224/83447 , H01L2224/83801 , H01L2224/83815 , H01L2224/84424 , H01L2224/84447 , H01L2224/84801 , H01L2224/84815 , H01L2224/85 , H01L2224/9221 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/181 , H01L2924/19105 , H01L2924/3011 , H01L2924/351 , H05K1/0271 , H05K1/05 , H05K1/181 , H05K3/3431 , H05K2201/10166 , H05K2201/1028 , H05K2201/1031 , H05K2201/10409 , H05K2201/10946 , H05K2201/10962 , Y02P70/611 , Y02P70/613 , H01L2924/00015 , H01L2924/00014 , H01L2224/83 , H01L2224/84 , H01L2224/33 , H01L2924/00012 , H01L2924/00
摘要： 半导体模块(30)具有通过焊锡(34b、34c)使形成于晶体管裸芯片(35)的上表面的电极(S、G)和多个布线图案(33a～33d)中的布线图案(33b、33c)接合的铜连接器(36a、36b)。铜连接器(36bb)具有与晶体管裸芯片(35)的电极(G)接合的电极接合部(36bb)和与电极接合部(36bb)以相对置的方式而配置的、与布线图案(33c)接合的基板接合部(36bc)。电极接合部(36bb)的与单向正交的方向上的宽度W1比基板接合部(36bb)的与单向正交的方向上的宽度W2窄。
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公开(公告)号：CN103918076B
公开(公告)日：2016-11-16
申请号：CN201380003722.6
申请日：2013-10-25
申请人： 日本精工株式会社
CPC分类号： H05K1/09 , H01L23/142 , H01L23/3735 , H01L23/49582 , H01L23/49811 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/35 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/73 , H01L24/83 , H01L24/84 , H01L24/92 , H01L25/07 , H01L25/072 , H01L25/18 , H01L2224/05553 , H01L2224/0603 , H01L2224/291 , H01L2224/29294 , H01L2224/293 , H01L2224/32227 , H01L2224/32238 , H01L2224/33181 , H01L2224/352 , H01L2224/35847 , H01L2224/3701 , H01L2224/37013 , H01L2224/37147 , H01L2224/40095 , H01L2224/40225 , H01L2224/40227 , H01L2224/40475 , H01L2224/40499 , H01L2224/4103 , H01L2224/4112 , H01L2224/48 , H01L2224/73263 , H01L2224/77272 , H01L2224/83191 , H01L2224/83192 , H01L2224/8321 , H01L2224/83424 , H01L2224/83447 , H01L2224/83801 , H01L2224/83815 , H01L2224/84424 , H01L2224/84447 , H01L2224/84801 , H01L2224/84815 , H01L2224/85 , H01L2224/9221 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/181 , H01L2924/19105 , H01L2924/3011 , H01L2924/351 , H05K1/0271 , H05K1/05 , H05K1/181 , H05K3/3431 , H05K2201/10166 , H05K2201/1028 , H05K2201/1031 , H05K2201/10409 , H05K2201/10946 , H05K2201/10962 , Y02P70/611 , Y02P70/613 , H01L2924/00015 , H01L2924/00014 , H01L2224/83 , H01L2224/84 , H01L2224/33 , H01L2924/00012 , H01L2924/00
摘要： 半导体模块(30)具有通过焊锡(34b、34c)使形成于晶体管裸芯片(35)的上表面的电极(S、G)和多个布线图案(33a～33d)中的布线图案(33b、33c)接合的铜连接器(36a、36b)。铜连接器(36bb)具有与晶体管裸芯片(35)的电极(G)接合的电极接合部(36bb)和与电极接合部(36bb)以相对置的方式而配置的、与布线图案(33c)接合的基板接合部(36bc)。电极接合部(36bb)的与单向正交的方向上的宽度W1比基板接合部(36bb)的与单向正交的方向上的宽度W2窄。
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公开(公告)号：CN103930981B
公开(公告)日：2016-07-13
申请号：CN201380003694.8
申请日：2013-10-25
申请人： 日本精工株式会社
CPC分类号： H05K7/02 , H01L23/142 , H01L23/3735 , H01L23/49811 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/35 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/73 , H01L24/83 , H01L24/84 , H01L24/92 , H01L25/07 , H01L25/072 , H01L25/18 , H01L2224/291 , H01L2224/29294 , H01L2224/293 , H01L2224/32227 , H01L2224/32238 , H01L2224/32245 , H01L2224/33181 , H01L2224/352 , H01L2224/35847 , H01L2224/3701 , H01L2224/37013 , H01L2224/37124 , H01L2224/37139 , H01L2224/37144 , H01L2224/37147 , H01L2224/40095 , H01L2224/40227 , H01L2224/40475 , H01L2224/40499 , H01L2224/4103 , H01L2224/4112 , H01L2224/48 , H01L2224/73263 , H01L2224/77272 , H01L2224/83191 , H01L2224/83192 , H01L2224/8321 , H01L2224/83424 , H01L2224/83447 , H01L2224/83801 , H01L2224/83815 , H01L2224/84424 , H01L2224/84447 , H01L2224/84801 , H01L2224/84815 , H01L2224/85 , H01L2224/9221 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/19105 , H01L2924/3011 , H01L2924/351 , H05K1/181 , H05K2201/10166 , H05K2201/1031 , H05K2201/10409 , Y02P70/611 , H01L2924/00015 , H01L2924/00014 , H01L2224/83 , H01L2224/84 , H01L2224/33 , H01L2924/00012 , H01L2924/00
摘要： 提供了一种在实现缩短制造节拍和降低制造成本的同时能够提高组装性的半导体模块。半导体模块(30)具备：金属制的基板(31)；形成于基板(31)之上的绝缘层(32)；形成于绝缘层(32)上的多个布线图案(33a～33d)；通过焊锡(34a)封装于布线图案(33a)上的晶体管裸芯片(35)；以及通过焊锡(34b、34c)使晶体管裸芯片(35)的电极(S、G)上和布线图案(33b、33c)上接合的金属板连接器(36a、36b)。金属板连接器(36a、36b)是桥形，在部件中央部具有平整面和重心。
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公开(公告)号：CN103930981A
公开(公告)日：2014-07-16
申请号：CN201380003694.8
申请日：2013-10-25
申请人： 日本精工株式会社
CPC分类号： H05K7/02 , H01L23/142 , H01L23/3735 , H01L23/49811 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/35 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/73 , H01L24/83 , H01L24/84 , H01L24/92 , H01L25/07 , H01L25/072 , H01L25/18 , H01L2224/291 , H01L2224/29294 , H01L2224/293 , H01L2224/32227 , H01L2224/32238 , H01L2224/32245 , H01L2224/33181 , H01L2224/352 , H01L2224/35847 , H01L2224/3701 , H01L2224/37013 , H01L2224/37124 , H01L2224/37139 , H01L2224/37144 , H01L2224/37147 , H01L2224/40095 , H01L2224/40227 , H01L2224/40475 , H01L2224/40499 , H01L2224/4103 , H01L2224/4112 , H01L2224/48 , H01L2224/73263 , H01L2224/77272 , H01L2224/83191 , H01L2224/83192 , H01L2224/8321 , H01L2224/83424 , H01L2224/83447 , H01L2224/83801 , H01L2224/83815 , H01L2224/84424 , H01L2224/84447 , H01L2224/84801 , H01L2224/84815 , H01L2224/85 , H01L2224/9221 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/19105 , H01L2924/3011 , H01L2924/351 , H05K1/181 , H05K2201/10166 , H05K2201/1031 , H05K2201/10409 , Y02P70/611 , H01L2924/00015 , H01L2924/00014 , H01L2224/83 , H01L2224/84 , H01L2224/33 , H01L2924/00012 , H01L2924/00 , H01L2224/8302
摘要： 提供了一种在实现缩短制造节拍和降低制造成本的同时能够提高组装性的半导体模块。半导体模块(30)具备：金属制的基板(31)；形成于基板(31)之上的绝缘层(32)；形成于绝缘层(32)上的多个布线图案(33a～33d)；通过焊锡(34a)封装于布线图案(33a)上的晶体管裸芯片(35)；以及通过焊锡(34b、34c)使晶体管裸芯片(35)的电极(S、G)上和布线图案(33b、33c)上接合的金属板连接器(36a、36b)。金属板连接器(36a、36b)是桥形，在部件中央部具有平整面和重心。
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公开(公告)号：CN105474386B
公开(公告)日：2018-05-29
申请号：CN201480046107.8
申请日：2014-10-06
申请人： 日本精工株式会社
CPC分类号： H01L24/41 , H01L23/3735 , H01L23/492 , H01L23/49811 , H01L23/49838 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/35 , H01L24/37 , H01L24/40 , H01L24/83 , H01L24/84 , H01L24/92 , H01L25/07 , H01L25/072 , H01L25/18 , H01L29/7393 , H01L29/78 , H01L2224/05553 , H01L2224/0603 , H01L2224/2732 , H01L2224/29101 , H01L2224/32227 , H01L2224/32238 , H01L2224/32245 , H01L2224/33181 , H01L2224/352 , H01L2224/35847 , H01L2224/3701 , H01L2224/37011 , H01L2224/37013 , H01L2224/37124 , H01L2224/37139 , H01L2224/37144 , H01L2224/37147 , H01L2224/37611 , H01L2224/4001 , H01L2224/40095 , H01L2224/40227 , H01L2224/40475 , H01L2224/40499 , H01L2224/4099 , H01L2224/4112 , H01L2224/73263 , H01L2224/83192 , H01L2224/8321 , H01L2224/83424 , H01L2224/83447 , H01L2224/83801 , H01L2224/83815 , H01L2224/84138 , H01L2224/8421 , H01L2224/84424 , H01L2224/84447 , H01L2224/84801 , H01L2224/84815 , H01L2224/9221 , H01L2924/00015 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/15724 , H01L2924/19105 , H01L2924/35121 , H01L2924/365 , H01L2924/00 , H01L2924/00014 , H01L2224/291 , H01L2924/014 , H01L2924/00012 , H01L2924/01047 , H01L2224/29294 , H01L2224/293 , H01L2224/48 , H01L2224/85 , H01L2224/83 , H01L2224/84 , H01L2924/01029 , H01L2924/013 , H01L2924/00013
摘要： 提供基于焊锡的电连接的可靠性较高并且廉价的半导体模块。电极接合部(36bb)的与裸芯片FET(35)的栅电极(G)的被接合面对置的接合面以及基板接合部(36bc)的与其他的布线图案(33c)的被接合面对置的接合面具备脱气排出机构，该脱气排出机构使在金属板连接器(36b)的焊接时熔融的焊锡中产生的脱气从介于接合面与被接合面之间的焊锡(34c、34f)排出。
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公开(公告)号：CN103918067B
公开(公告)日：2017-03-01
申请号：CN201380003744.2
申请日：2013-05-27
申请人： 日本精工株式会社
CPC分类号： H01L24/43 , H01L23/3735 , H01L23/49811 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/35 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/75 , H01L24/77 , H01L24/83 , H01L24/84 , H01L24/85 , H01L24/92 , H01L25/07 , H01L25/072 , H01L25/18 , H01L29/78 , H01L2224/05553 , H01L2224/0603 , H01L2224/291 , H01L2224/29101 , H01L2224/29294 , H01L2224/293 , H01L2224/32225 , H01L2224/32227 , H01L2224/32238 , H01L2224/33181 , H01L2224/352 , H01L2224/35847 , H01L2224/3701 , H01L2224/37011 , H01L2224/37013 , H01L2224/37147 , H01L2224/40095 , H01L2224/40227 , H01L2224/40475 , H01L2224/40499 , H01L2224/4103 , H01L2224/4112 , H01L2224/41175 , H01L2224/43848 , H01L2224/451 , H01L2224/48091 , H01L2224/48472 , H01L2224/494 , H01L2224/73263 , H01L2224/73265 , H01L2224/75272 , H01L2224/77272 , H01L2224/83191 , H01L2224/83192 , H01L2224/8321 , H01L2224/83424 , H01L2224/83447 , H01L2224/83801 , H01L2224/83815 , H01L2224/84424 , H01L2224/84447 , H01L2224/84801 , H01L2224/84815 , H01L2224/85 , H01L2224/85815 , H01L2224/9221 , H01L2924/00014 , H01L2924/00015 , H01L2924/01029 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/15724 , H01L2924/19105 , H01L2924/3011 , H01L2924/351 , H01L2924/3701 , H05K1/181 , H05K2201/10166 , H05K2201/1031 , H05K2201/10409 , Y02P70/611 , H01L2924/00 , H01L2224/48 , H01L2224/83 , H01L2224/84 , H01L2224/33 , H01L2924/00012 , H01L2224/45099 , H01L2224/48227
摘要： 提供对于晶体管裸芯片的电极和基板上的布线图案之间的接合，通过构成为利用焊锡封装作业进行，从而能够通过与在将晶体管裸芯片或其他表面封装部件封装于基板上的布线图案上时进行的焊锡封装作业相同的工序进行的半导体模块及其制造方法。半导体模块(30)包括：形成于绝缘层(32)上的多个布线图案(33a)～(33d)；通过焊锡(34a)封装于多个布线图案(33a)～(33d)中的一个布线图案(33a)上的晶体管裸芯片(35)；用于通过焊锡(34b)、(34c)将形成于晶体管裸芯片(35)的上表面的电极(S)、(G)与多个布线图案(33a)～(33d)中的其他布线图案(33b)、(33c)接合的、由铜板构成的铜连接器(36a)、(36b)。
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公开(公告)号：CN105474386A
公开(公告)日：2016-04-06
申请号：CN201480046107.8
申请日：2014-10-06
申请人： 日本精工株式会社
CPC分类号： H01L24/41 , H01L23/3735 , H01L23/492 , H01L23/49811 , H01L23/49838 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/35 , H01L24/37 , H01L24/40 , H01L24/83 , H01L24/84 , H01L24/92 , H01L25/07 , H01L25/072 , H01L25/18 , H01L29/7393 , H01L29/78 , H01L2224/05553 , H01L2224/0603 , H01L2224/2732 , H01L2224/29101 , H01L2224/32227 , H01L2224/32238 , H01L2224/32245 , H01L2224/33181 , H01L2224/352 , H01L2224/35847 , H01L2224/3701 , H01L2224/37011 , H01L2224/37013 , H01L2224/37124 , H01L2224/37139 , H01L2224/37144 , H01L2224/37147 , H01L2224/37611 , H01L2224/4001 , H01L2224/40095 , H01L2224/40227 , H01L2224/40475 , H01L2224/40499 , H01L2224/4099 , H01L2224/4112 , H01L2224/73263 , H01L2224/83192 , H01L2224/8321 , H01L2224/83424 , H01L2224/83447 , H01L2224/83801 , H01L2224/83815 , H01L2224/84138 , H01L2224/8421 , H01L2224/84424 , H01L2224/84447 , H01L2224/84801 , H01L2224/84815 , H01L2224/9221 , H01L2924/00015 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/15724 , H01L2924/19105 , H01L2924/35121 , H01L2924/365 , H01L2924/00 , H01L2924/00014 , H01L2224/291 , H01L2924/014 , H01L2924/00012 , H01L2924/01047 , H01L2224/29294 , H01L2224/293 , H01L2224/48 , H01L2224/85 , H01L2224/83 , H01L2224/84 , H01L2924/01029 , H01L2924/013 , H01L2924/00013
摘要： 提供基于焊锡的电连接的可靠性较高并且廉价的半导体模块。电极接合部(36bb)的与裸芯片FET(35)的栅电极(G)的被接合面对置的接合面以及基板接合部(36bc)的与其他的布线图案(33c)的被接合面对置的接合面具备脱气排出机构，该脱气排出机构使在金属板连接器(36b)的焊接时熔融的焊锡中产生的脱气从介于接合面与被接合面之间的焊锡(34c、34f)排出。
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