专利检索 cpc:"H01L2224/33181" 第 1 页

1.

发明授权
电子模块的制造有权

公开(公告)号：CN104867863B

公开(公告)日：2018-07-10

申请号：CN201510067672.9

申请日：2015-02-09

申请人： 西门子公司

发明人： 米夏埃尔·莱佩纳特 , 龙尼·维尔纳

IPC分类号： H01L21/768

CPC分类号： H01L23/49811 , H01L23/3735 , H01L23/49838 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/75 , H01L24/77 , H01L24/83 , H01L24/84 , H01L24/92 , H01L25/18 , H01L2224/2732 , H01L2224/27334 , H01L2224/291 , H01L2224/2929 , H01L2224/29294 , H01L2224/293 , H01L2224/29339 , H01L2224/32227 , H01L2224/32245 , H01L2224/33181 , H01L2224/3701 , H01L2224/37147 , H01L2224/4005 , H01L2224/40227 , H01L2224/40499 , H01L2224/4103 , H01L2224/41051 , H01L2224/75315 , H01L2224/75983 , H01L2224/773 , H01L2224/77328 , H01L2224/77983 , H01L2224/8314 , H01L2224/83191 , H01L2224/83192 , H01L2224/83201 , H01L2224/83447 , H01L2224/83801 , H01L2224/8384 , H01L2224/84138 , H01L2224/84201 , H01L2224/84447 , H01L2224/84801 , H01L2224/8484 , H01L2224/9221 , H01L2224/92246 , H01L2224/92255 , H01L2924/13055 , H01L2924/13091 , H01L2924/00 , H01L2924/00014 , H01L2924/014 , H01L2924/0781 , H01L2924/00012 , H01L2924/06 , H01L2224/83 , H01L2224/84

摘要： 本发明涉及一种用于制造电子模块(L)、特别是功率电子模块的方法(S1‑S8)，所述方法包括至少一个半导体芯片(3，4)与至少一个引线框架(1)的触点接通，其中，半导体芯片(3，4)在其上侧(7)上并且在其下侧(6)上分别具有至少一个电接口(8，9)，并且至少一个引线框架(1)直接触点接通(S5)所述侧之一的所述接口(8，9)。一种电子模块(L)借助于所述方法(S1‑S8)来制造。本发明特别是能够应用在功率电子模块上。

2.

发明公开
IC封装件中夹布置的半导体器件和方法无效

公开(公告)号：CN108206163A

公开(公告)日：2018-06-26

申请号：CN201711399823.6

申请日：2017-12-19

申请人： 安世有限公司

发明人： 樊海波 , 波姆皮奥·V·乌马里 , 提姆·伯切尔 , 周伟煌

IPC分类号： H01L23/31 , H01L23/495 , H01L21/50 , H01L21/60

CPC分类号： H01L23/49568 , H01L21/4825 , H01L23/3107 , H01L23/3114 , H01L23/49513 , H01L23/49524 , H01L23/49537 , H01L23/49541 , H01L23/49562 , H01L24/37 , H01L24/40 , H01L24/83 , H01L24/84 , H01L2224/06181 , H01L2224/26145 , H01L2224/27013 , H01L2224/29116 , H01L2224/32245 , H01L2224/33181 , H01L2224/37147 , H01L2224/40095 , H01L2224/40245 , H01L2224/40491 , H01L2224/73263 , H01L2224/83815 , H01L2224/8491 , H01L2224/92246 , H01L2924/10253 , H01L2924/10329 , H01L2924/14 , H01L2924/181 , H01L2924/00012 , H01L2924/013 , H01L2924/01047 , H01L2924/0105 , H01L23/31 , H01L21/50 , H01L23/49575 , H01L24/741

摘要： 本申请提供了集成电路封装件中夹布置的半导体器件和方法。一种集成电路封装件具有夹，所述夹具有突出的槽形指状部。所述夹可以用于各种集成电路封装件中，包括诸如具有特定浪涌电流能力的整流器之类的软焊接紧凑型电源封装件。实施例可以实现为允许对焊接区域的目视检查能力，其中所述焊接区域用于经由所述夹将引线框架连接到IC封装件裸片的表面；同时仍提供足够的热物质来限制正向浪涌电流负荷期间的温度升高。这使得制造设计简单，而又不对性能让步太多。

3.

发明授权
半导体装置及半导体装置的制造方法有权

公开(公告)号：CN105009266B

公开(公告)日：2018-05-08

申请号：CN201380074382.6

申请日：2013-10-04

申请人： 三菱电机株式会社

发明人： 中田洋辅 , 中野诚也

IPC分类号： H01L21/60 , H05K3/34

CPC分类号： H01L24/05 , H01L21/78 , H01L23/49531 , H01L23/49562 , H01L24/03 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/45 , H01L24/48 , H01L24/83 , H01L24/95 , H01L2224/0345 , H01L2224/0347 , H01L2224/03848 , H01L2224/04026 , H01L2224/05007 , H01L2224/05011 , H01L2224/05073 , H01L2224/05124 , H01L2224/05563 , H01L2224/05565 , H01L2224/05583 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05655 , H01L2224/05666 , H01L2224/0568 , H01L2224/26145 , H01L2224/29027 , H01L2224/291 , H01L2224/29111 , H01L2224/32257 , H01L2224/33181 , H01L2224/45015 , H01L2224/45124 , H01L2224/48091 , H01L2224/48245 , H01L2224/48247 , H01L2224/48472 , H01L2224/48724 , H01L2224/48739 , H01L2224/48744 , H01L2224/48755 , H01L2224/48766 , H01L2224/4878 , H01L2224/73215 , H01L2224/73265 , H01L2224/831 , H01L2224/83801 , H01L2224/83815 , H01L2224/94 , H01L2924/1305 , H01L2924/13055 , H01L2924/181 , H01L2924/014 , H01L2924/00012 , H01L2924/00014 , H01L2924/01047 , H01L2924/01029 , H01L2924/01014 , H01L2224/03 , H01L2924/00

摘要： 元件电极(103)设置于半导体元件(101)的表面。金属膜(105)设置于元件电极(103)上，并具有内侧区域(105a)和位于内侧区域(105a)周围的外侧区域(105b1)。在金属膜(105)中设置有在内侧区域(105a)及外侧区域(105b1)之间将元件电极(103)露出的开口(TR)。元件电极(103)具有比金属膜(105)的焊料浸润性低的焊料浸润性。外部电极(117)与金属膜(105)的内侧区域(105a)进行焊料接合。

4.

发明公开
半导体装置有权

公开(公告)号：CN107946291A

公开(公告)日：2018-04-20

申请号：CN201711260262.1

申请日：2013-07-24

申请人： 瑞萨电子株式会社

发明人： 杉山道昭 , 木下顺弘

IPC分类号： H01L25/065 , H01L21/50 , H01L21/56 , H01L23/488 , H01L23/31 , H01L21/98

CPC分类号： H01L21/50 , H01L21/56 , H01L21/561 , H01L21/563 , H01L21/6836 , H01L23/3128 , H01L23/49833 , H01L23/5283 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/19 , H01L24/20 , H01L24/27 , H01L24/32 , H01L24/33 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/94 , H01L24/95 , H01L24/96 , H01L24/97 , H01L25/0657 , H01L25/50 , H01L2221/68327 , H01L2224/0401 , H01L2224/04105 , H01L2224/05023 , H01L2224/05025 , H01L2224/05073 , H01L2224/05147 , H01L2224/0557 , H01L2224/05611 , H01L2224/05655 , H01L2224/12105 , H01L2224/131 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/14131 , H01L2224/14135 , H01L2224/14136 , H01L2224/14181 , H01L2224/16145 , H01L2224/16146 , H01L2224/16225 , H01L2224/16227 , H01L2224/16237 , H01L2224/16238 , H01L2224/17181 , H01L2224/214 , H01L2224/215 , H01L2224/2731 , H01L2224/27334 , H01L2224/32145 , H01L2224/32225 , H01L2224/33181 , H01L2224/73104 , H01L2224/73204 , H01L2224/73253 , H01L2224/73259 , H01L2224/81191 , H01L2224/81447 , H01L2224/81801 , H01L2224/82105 , H01L2224/82106 , H01L2224/83104 , H01L2224/83191 , H01L2224/83192 , H01L2224/83862 , H01L2224/92224 , H01L2224/92242 , H01L2224/92244 , H01L2224/94 , H01L2224/95 , H01L2224/96 , H01L2224/97 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06544 , H01L2225/06568 , H01L2225/06586 , H01L2924/00014 , H01L2924/12042 , H01L2924/13091 , H01L2924/15311 , H01L2924/15313 , H01L2924/181 , H01L2924/3511 , H01L2924/00012 , H01L2224/83 , H01L2924/00 , H01L2924/014 , H01L2924/01047 , H01L2224/27 , H01L2224/81 , H01L2924/01029 , H01L2224/19 , H01L2224/05552

摘要： 通过在衬底的顶表面之上装配包括具有小直径的半导体芯片和具有大直径的半导体芯片的芯片层压制件形成的半导体装置中，防止过度的压力施加至这两个半导体芯片的接合点。通过在支撑衬底之上装配具有大直径的第一半导体芯片，然后在所述第一半导体芯片之上装配具有小直径的第二半导体芯片，可以：抑制装配在所述第一半导体芯片之上的第二半导体芯片的倾斜和不稳定；从而阻止过度的压力施加至所述第一半导体芯片和第二半导体芯片的接合点。

5.

发明授权
使用顶部后钝化技术和底部结构技术的集成电路芯片失效

公开(公告)号：CN105140136B

公开(公告)日：2018-02-13

申请号：CN201510438605.3

申请日：2010-03-11

申请人： 高通股份有限公司

发明人： 林茂雄 , 李进源 , 罗心荣 , 杨秉荣 , 刘德笙

IPC分类号： H01L21/56 , H01L21/60 , H01L23/31 , H01L23/48 , H01L23/522 , H01L25/065 , H01L25/18

CPC分类号： G06F1/16 , G11C5/147 , H01L21/563 , H01L23/3128 , H01L23/3171 , H01L23/3192 , H01L23/481 , H01L23/5223 , H01L23/5227 , H01L23/60 , H01L23/66 , H01L24/02 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/50 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/85 , H01L24/92 , H01L24/94 , H01L24/97 , H01L25/0657 , H01L25/16 , H01L25/18 , H01L25/50 , H01L2223/6611 , H01L2223/6666 , H01L2224/02166 , H01L2224/02311 , H01L2224/02313 , H01L2224/02321 , H01L2224/0233 , H01L2224/02331 , H01L2224/0235 , H01L2224/0237 , H01L2224/02371 , H01L2224/02375 , H01L2224/02381 , H01L2224/0239 , H01L2224/024 , H01L2224/0345 , H01L2224/03462 , H01L2224/03464 , H01L2224/03612 , H01L2224/03614 , H01L2224/03912 , H01L2224/0392 , H01L2224/0401 , H01L2224/04042 , H01L2224/05024 , H01L2224/05027 , H01L2224/05155 , H01L2224/05166 , H01L2224/05171 , H01L2224/05176 , H01L2224/05181 , H01L2224/05187 , H01L2224/05541 , H01L2224/05548 , H01L2224/05554 , H01L2224/0556 , H01L2224/05567 , H01L2224/05572 , H01L2224/056 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05669 , H01L2224/05673 , H01L2224/05676 , H01L2224/11 , H01L2224/11009 , H01L2224/1132 , H01L2224/11334 , H01L2224/11462 , H01L2224/11464 , H01L2224/1147 , H01L2224/11849 , H01L2224/119 , H01L2224/1191 , H01L2224/13 , H01L2224/13006 , H01L2224/1302 , H01L2224/13022 , H01L2224/13024 , H01L2224/13082 , H01L2224/13083 , H01L2224/13084 , H01L2224/13099 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/13113 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/13169 , H01L2224/13294 , H01L2224/133 , H01L2224/13311 , H01L2224/13609 , H01L2224/1403 , H01L2224/1411 , H01L2224/14181 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/16245 , H01L2224/16265 , H01L2224/17181 , H01L2224/2919 , H01L2224/2929 , H01L2224/29294 , H01L2224/293 , H01L2224/29339 , H01L2224/32105 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/33181 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48111 , H01L2224/48145 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/48624 , H01L2224/48644 , H01L2224/48647 , H01L2224/48664 , H01L2224/48669 , H01L2224/48764 , H01L2224/48769 , H01L2224/48824 , H01L2224/48844 , H01L2224/48847 , H01L2224/48864 , H01L2224/4911 , H01L2224/49175 , H01L2224/4918 , H01L2224/73203 , H01L2224/73204 , H01L2224/73207 , H01L2224/73215 , H01L2224/73253 , H01L2224/73257 , H01L2224/73265 , H01L2224/81191 , H01L2224/81411 , H01L2224/81444 , H01L2224/81801 , H01L2224/81815 , H01L2224/8185 , H01L2224/81895 , H01L2224/81903 , H01L2224/83101 , H01L2224/83104 , H01L2224/83851 , H01L2224/92 , H01L2224/9202 , H01L2224/92125 , H01L2224/92127 , H01L2224/92147 , H01L2224/92225 , H01L2224/92247 , H01L2224/94 , H01L2224/97 , H01L2225/06506 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06562 , H01L2225/06589 , H01L2225/1023 , H01L2225/1029 , H01L2225/1058 , H01L2225/107 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01031 , H01L2924/01032 , H01L2924/01033 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01059 , H01L2924/01068 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/1305 , H01L2924/13091 , H01L2924/14 , H01L2924/1421 , H01L2924/1433 , H01L2924/15311 , H01L2924/15787 , H01L2924/15788 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19104 , H01L2924/19105 , H01L2924/30105 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2224/48869 , H01L2224/48744 , H01L2924/00012 , H01L2224/03 , H01L2224/0361 , H01L2924/0665 , H01L2224/81 , H01L2224/83 , H01L24/78 , H01L2224/85 , H01L21/56 , H01L21/78 , H01L2924/0635 , H01L2924/07025 , H01L21/304 , H01L21/76898 , H01L2224/0231

摘要： 本申请涉及使用顶部后钝化技术和底部结构技术的集成电路芯片。本发明揭示集成电路芯片和芯片封装，其包含所述集成电路芯片的顶部处的过钝化方案和所述集成电路芯片的底部处的底部方案，所述过钝化方案和底部方案使用顶部后钝化技术和底部结构技术。所述集成电路芯片可通过所述过钝化方案或所述底部方案连接到外部电路或结构，例如球栅格阵列(BGA)衬底、印刷电路板、半导体芯片、金属衬底、玻璃衬底或陶瓷衬底。还描述相关的制造技术。

6.

发明授权
半导体装置及其制造和运行方法和制造半导体组件的方法有权

公开(公告)号：CN104425413B

公开(公告)日：2017-09-15

申请号：CN201410450708.7

申请日：2014-09-05

申请人： 英飞凌科技股份有限公司

发明人： G.比尔 , I.埃舍尔-珀佩尔 , J.赫格尔 , O.霍尔费尔德 , P.坎沙特

IPC分类号： H01L23/48 , H01L21/60 , H01L23/10 , H01L23/28 , H01L21/58 , H01L25/07

CPC分类号： H01L23/562 , H01L21/56 , H01L21/561 , H01L21/566 , H01L21/568 , H01L23/051 , H01L23/3107 , H01L23/5226 , H01L23/528 , H01L24/24 , H01L24/33 , H01L24/72 , H01L24/82 , H01L24/90 , H01L24/96 , H01L24/97 , H01L25/072 , H01L25/50 , H01L2224/03002 , H01L2224/06181 , H01L2224/24137 , H01L2224/24195 , H01L2224/29011 , H01L2224/33181 , H01L2224/82039 , H01L2224/96 , H01L2924/12042 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/35 , H01L2924/00

摘要： 本发明涉及半导体装置及其制造和运行方法和制造半导体组件的方法。该半导体装置包括上和下接触板以及多个芯片组件。每个芯片组件具有半导体芯片，其具有半导体本体，半导体本体具有上侧和与上侧对置的在垂直方向上隔开的下侧。在上侧上分别布置有单独的上主电极和控制电极。芯片组件分别具有独立的布置在有关的芯片组件的半导体芯片的下侧上的下主电极或在每个芯片组件中布置在该芯片组件的半导体本体的下侧上的共同的下主电极。在每个芯片组件中借助其控制电极能够控制在上主电极与下主电极之间的电流。芯片组件通过介电填料以材料决定的方式彼此连接成固定复合体。嵌入复合体中的控制电极互连结构将芯片组件的控制电极彼此导电连接。

7.

发明授权
在一个面上具有两层金属层的功率半导体芯片失效

公开(公告)号：CN102903694B

公开(公告)日：2017-09-08

申请号：CN201210263016.2

申请日：2012-07-26

申请人： 英飞凌科技股份有限公司

发明人： 约瑟夫·赫格劳尔 , 拉尔夫·奥特伦巴 , 克萨韦尔·施勒格尔 , 于尔根·施雷德尔

IPC分类号： H01L23/495 , H01L21/60 , H01L29/40

CPC分类号： H01L24/73 , H01L23/3107 , H01L23/49524 , H01L23/49562 , H01L23/49575 , H01L24/05 , H01L24/06 , H01L24/27 , H01L24/32 , H01L24/33 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/83 , H01L24/85 , H01L24/92 , H01L24/97 , H01L2224/02166 , H01L2224/04026 , H01L2224/04034 , H01L2224/04042 , H01L2224/05147 , H01L2224/05155 , H01L2224/05553 , H01L2224/05567 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05666 , H01L2224/05669 , H01L2224/05671 , H01L2224/0603 , H01L2224/2732 , H01L2224/2745 , H01L2224/29111 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/2929 , H01L2224/29291 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/32014 , H01L2224/32145 , H01L2224/32245 , H01L2224/33181 , H01L2224/37147 , H01L2224/3716 , H01L2224/40095 , H01L2224/40245 , H01L2224/40247 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48247 , H01L2224/48463 , H01L2224/4847 , H01L2224/48599 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48647 , H01L2224/48655 , H01L2224/4866 , H01L2224/48664 , H01L2224/48666 , H01L2224/48669 , H01L2224/48671 , H01L2224/48699 , H01L2224/48724 , H01L2224/48739 , H01L2224/48744 , H01L2224/48747 , H01L2224/48755 , H01L2224/4876 , H01L2224/48764 , H01L2224/48766 , H01L2224/48769 , H01L2224/48771 , H01L2224/48799 , H01L2224/48824 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/48855 , H01L2224/4886 , H01L2224/48864 , H01L2224/48866 , H01L2224/48869 , H01L2224/48871 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/83191 , H01L2224/83801 , H01L2224/8381 , H01L2224/8382 , H01L2224/85439 , H01L2224/85447 , H01L2224/85455 , H01L2224/8546 , H01L2224/92246 , H01L2224/92247 , H01L2224/94 , H01L2224/97 , H01L2924/00011 , H01L2924/00014 , H01L2924/01015 , H01L2924/01029 , H01L2924/01047 , H01L2924/01327 , H01L2924/014 , H01L2924/12042 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/1461 , H01L2924/181 , H01L2924/30107 , H01L2924/01028 , H01L2224/27 , H01L2924/0105 , H01L2924/01049 , H01L2924/01014 , H01L2924/00012 , H01L2924/01023 , H01L2224/85 , H01L2224/83 , H01L2224/84 , H01L2924/00 , H01L2224/05552 , H01L2924/01005

摘要： 本发明涉及在一个面上具有两层金属层的功率半导体芯片。该半导体芯片包括具有多个有源晶体管元件的功率晶体管电路。第一负载电极和控制电极布置在半导体芯片的第一面上，其中，第一负载电极包括第一金属层。第二负载电极布置在半导体芯片的第二面上。第二金属层布置在第一金属层上方，其中第二金属层与功率晶体管电路电绝缘，第二金属层布置在功率晶体管电路的包括多个有源晶体管元件中的至少一个的区域的上方。

8.

发明公开
半导体模块以及半导体装置无效

公开(公告)号：CN106972001A

公开(公告)日：2017-07-21

申请号：CN201611144609.1

申请日：2016-12-13

申请人： 株式会社东芝

发明人： 井口知洋 , 佐佐木阳光 , 山本哲也 , 栂嵜隆

IPC分类号： H01L23/528

CPC分类号： H01L25/072 , H01L23/051 , H01L23/142 , H01L23/145 , H01L23/15 , H01L23/3107 , H01L23/3121 , H01L23/367 , H01L23/492 , H01L23/49805 , H01L23/49861 , H01L23/50 , H01L24/29 , H01L24/30 , H01L24/32 , H01L24/33 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/291 , H01L2224/29139 , H01L2224/29294 , H01L2224/29339 , H01L2224/30181 , H01L2224/32227 , H01L2224/32245 , H01L2224/33181 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48245 , H01L2224/73215 , H01L2224/73265 , H01L2224/83424 , H01L2224/83447 , H01L2224/83455 , H01L2924/014 , H01L2924/00014 , H01L2924/00012 , H01L23/528

摘要： 一实施方式的半导体模块具有第一和第二布线部、多个第一半导体装置以及多个第二半导体装置。上述第二布线部与上述第一布线部对置地设置。上述第三布线部与上述第一布线部对置地设置。各个第一半导体装置设置在上述第一布线部与上述第二布线部之间，具有第一开关元件，该第一开关元件的输入端子或输出端子与上述第一布线部电连接。各个第二半导体装置设置在上述第一布线部与上述第三布线部之间，具有第二开关元件，上述第二开关元件的输出端子或输入端子与上述第一开关元件相反地电连接于上述第一布线部。