公开(公告)号：EP2716404A4

公开(公告)日：2015-04-29

申请号：EP11866102

申请日：2011-10-07

申请人： HARIMA CHEMICALS INC

发明人： HAMAGAWA TERUYOSHI ,  KUKIMOTO YOUICHI ,  HASEGAWA TAKU ,  SAKURAI HITOSHI

IPC分类号： B23K35/363 ,  B23K35/02 ,  B23K35/26 ,  B23K35/36 ,  B23K35/362 ,  C08K5/09 ,  C08K5/29 ,  C22C12/00

CPC分类号： B23K35/025 ,  B23K35/02 ,  B23K35/26 ,  B23K35/262 ,  B23K35/264 ,  B23K35/36 ,  B23K35/3612 ,  B23K35/3613 ,  B23K35/3618 ,  B23K35/362 ,  C08G59/38 ,  C08K3/08 ,  C08K5/09 ,  C08K5/29 ,  C08L63/00 ,  C08L79/04 ,  C22C12/00

摘要： The present invention relates to a soldering paste flux, and the soldering paste flux includes (A) a thermosetting prepolymer, (B) a polyfunctional epoxy monomer or oligomer having three or more functional groups in a molecule, (C) a carboxylic acid having a melting point of 80 to 170°C, and (D) a cyanate ester having two or more cyanato groups in a molecule.

公开(公告)号：EP2221140B1

公开(公告)日：2013-09-25

申请号：EP08854783.1

申请日：2008-11-25

申请人： Harima Chemicals, Inc.

发明人： ISHIKAWA, Shunsuke ,  SHINOZUKA, Akira ,  AIHARA, Masami

IPC分类号： B23K35/363 ,  H05K3/34 ,  B23K35/36 ,  B23K35/362 ,  B23K35/02

CPC分类号： B23K35/362 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/36 ,  B23K35/3612 ,  B23K35/3613 ,  B23K35/3618 ,  H05K3/3489

公开(公告)号：EP1533070B1

公开(公告)日：2013-05-01

申请号：EP03733433.1

申请日：2003-06-16

申请人： SUMITOMO LIGHT METAL INDUSTRIES, LTD. ,  HARIMA CHEMICALS, INC.

发明人： TOYAMA, Taketoshi ,  SANADA, Ryoichi ,  HATORI, Takashi ,  HASEGAWA, Yoshiharu ,  HISATOMI, Yuji, c/o Sumitomo Light Metal Industries, Ltd. ,  TANINAKA, Ichiro

IPC分类号： B23K35/363 ,  B23K1/19

CPC分类号： F28F21/084 ,  B23K1/0012 ,  B23K35/288 ,  B23K35/3605 ,  B23K35/3612 ,  B23K35/3613 ,  B23K2201/006 ,  B23K2201/14 ,  B23K2203/10 ,  F28F1/126

公开(公告)号：EP1339073B1

公开(公告)日：2011-09-21

申请号：EP01970208.3

申请日：2001-09-26

申请人： HARIMA CHEMICALS, INC. ,  ULVAC, INC.

发明人： MATSUBA, Yorishige, Tsukuba Research Laboratory ,  MISAWA, Yoshihisa, Tsukuba Research Laboratory ,  GOTO, Hideyuki, Tsukuba Research Laboratory ,  UEDA, Masayuki, Tsukuba Research Laboratory ,  OOSAKO, Katsuhisa, Tsukuba Research Laboratory ,  ODA, Masaaki ,  SAITO, Norimichi ,  SUZUKI, Toshihiro ,  ABE, Noriyuki

IPC分类号： H01B1/22 ,  H01B1/00 ,  H01B13/00 ,  C09J9/02 ,  C09J201/00 ,  B22F1/02

CPC分类号： B22F1/0062 ,  B22F2998/00 ,  C09J9/02 ,  H01B1/22 ,  H05K1/092 ,  Y10T428/29 ,  B22F1/0018

摘要： [purpose] The provision of an electroconductive metal paste of low temperature sintering type for use in printing a high density circuit, which exhibits good adhesion and a smooth surface when applied on a substrate and burned, and thus can be used for forming a fine circuit exhibiting a low resistance. [constitution] An electroconductive metal paste which comprises a resin composition comprising a thermosetting resin component, an organic acid anhydride or a derivative thereof or an organic acid, and one or more organic solvents and, dispersed homogeneously therein, as an electroconductive medium, ultra-fine metal particles having an average particle diameter of 100 nm or less and being surface-coated with one or more compounds having a group capable of forming a coordinate-type bonding with a metal element contained in said ultra-fine metal particle through a lone electron pair of N, O or S, optionally in combination with a metal filler having an average particle diameter of 0.5 to 20 νm. The electroconductive metal paste can undergo low temperature sintering between ultra-fine metal particles contained therein when the paste is subjected to a low temperature heat treatment.

公开(公告)号：EP1683592A4

公开(公告)日：2010-11-10

申请号：EP04792641

申请日：2004-10-20

申请人： HARIMA CHEMICALS INC

发明人： ITOH D ,  UEDA M ,  HATA N ,  MATSUBA Y

IPC分类号： B22F1/02 ,  B22F1/00 ,  H05K3/10

CPC分类号： B22F1/02 ,  B22F1/0003 ,  B22F1/0018 ,  B22F1/0062 ,  B22F2998/00 ,  B82Y30/00 ,  C01P2004/64 ,  C01P2006/10 ,  C04B35/6264 ,  C04B35/628 ,  C04B35/62805 ,  C04B35/62884 ,  C04B35/632 ,  C04B2235/40 ,  C04B2235/407 ,  C04B2235/5454 ,  C09C1/62 ,  C09C1/627 ,  H05K3/1266 ,  H05K3/1283 ,  H05K2203/1131 ,  H05K2203/1157 ,  H05K2203/122 ,  B22F1/0022

公开(公告)号：EP1666175A4

公开(公告)日：2010-10-27

申请号：EP04787869

申请日：2004-09-10

申请人： NAT INST OF ADVANCED IND SCIEN ,  HARIMA CHEMICALS INC

发明人： ITOH DAISUKE ,  IZUMITANI AKIHITO ,  HATA NORIAKI ,  MATSUBA YORISHIGE ,  MURATA K ,  YOKOYAMA H

IPC分类号： B22F9/00 ,  C09D5/24 ,  C09D17/00 ,  H01B1/02 ,  H01B1/22 ,  H01B13/00 ,  H05K3/12

CPC分类号： H05K3/125 ,  C09D5/24 ,  C09D17/006 ,  H01B1/02 ,  H01B1/22 ,  H05K2201/0257 ,  H05K2203/013

摘要： The present invention provides a dispersion usable for forming an electroconductive layer having an extremely fine pattern and a high thickness/minimum width ratio in the cross-section, and which has a high fluidity enabling application of inkjet to draw a fine pattern at high accuracy and contains only metal nanoparticles as a conductive medium. According to the present invention, a metal nanoparticle dispersion suitable to multiple layered coating by jetting in the form of fine droplets is prepared by dispersing metal nanoparticles having an average particle size of 1 to 100 nm in a dispersion solvent having a boiling point of 80° C or higher in such a manner that the volume percentage of the dispersion solvent is selected in the range of 55 to 80% by volume and the fluid viscosity (20°C) of the dispersion is chosen in the range of 2 mPa·s to 30 mPa·s, and then when the dispersion is discharged in the form of fine droplets by inkjet method or the like, the dispersion is concentrated by evaporation of the dispersion solvent in the droplets in the course of flight, coming to be a viscous dispersion which can be applicable to multi-layered coating.

公开(公告)号：EP1672971A4

公开(公告)日：2009-08-19

申请号：EP04773225

申请日：2004-09-10

申请人： NAT INST OF ADVANCED IND SCIEN ,  HARIMA CHEMICALS INC

发明人： MURATA KAZUHIRO ,  YOKOYAMA HIROSHI ,  ITOH DAISUKE ,  IZUMITANI A ,  HATA NORIAKI ,  MATSUBA Y

IPC分类号： H05K3/10 ,  H05K3/40 ,  H01L21/48 ,  H01L21/60 ,  H01L23/12 ,  H05K3/12 ,  H05K3/46

CPC分类号： B05D1/007 ,  B32B3/266 ,  B32B15/08 ,  H01L21/4867 ,  H01L2924/0002 ,  H05K3/125 ,  H05K3/245 ,  H05K3/4061 ,  H05K3/4647 ,  H05K2201/0367 ,  H05K2203/013 ,  H05K2203/105 ,  H05K2203/1131 ,  H05K2203/1476 ,  Y10T428/24322 ,  H01L2924/00

摘要： Disclosed is a method for manufacturing a substrate which comprises a step wherein metal particles are deposited on a certain position of a substrate (1) by a fine inkjet method and then sintered, thereby forming a metal column (2).

摘要翻译： 一种制备基板的方法，包括以下步骤：通过使用精细喷墨方法将基板（1）的规定位置处的金属颗粒沉积成柱状，然后烧结所述金属柱（2）。

公开(公告)号：EP1757400A3

公开(公告)日：2008-07-23

申请号：EP06119550.9

申请日：2006-08-25

申请人： HARIMA CHEMICALS, INC.

发明人： Matsubara, Eiichiro 18-506, Takano Daisan Jyuutaku ,  Ichitsubo, Tetsu ,  Anada, Takaaki ,  Kumamoto, Seishi ,  Irie, Hisao

IPC分类号： B23K35/02 ,  B23K35/26 ,  B22F9/08

CPC分类号： B22F9/082 ,  B22F1/0003

摘要： The present invention is a method to manufacture the SnZnNiCu solder powder through liquid quenching atomizing method, and an atomizing temperature is not less than 500°C, in particular, not less than 900°C. The raw material metal used as raw material of the solder powder comprises 3 to 12 % by weight of Zn, 1.0 to 15 % by weight of the sum of Cu and Ni, and Sn and inevitable impurities for the rest, to the total amount of raw material. The powder may further contain one or more of Bi, In, Sb, Mg, Ag, Au, in a total amount of up to 5% by weight. Thereby, high joint strength is achieved and the SnZnNiCu solder powder which can improve joint reliability of solder joint part is provided. The solder powder has a mean particle size from 5 to 100 microns.

公开(公告)号：EP1029630B1

公开(公告)日：2007-02-14

申请号：EP98961431.8

申请日：1998-12-18

申请人： HARIMA CHEMICALS, INC. ,  DENSO CORPORATION

发明人： TANINAKA, Ichiro Harima Chem., Inc. Ctr. Res. Lab. ,  SHIBATA, Hikaru Harima Chem., Inc. Ctr. Res. Lab. ,  HASEGAWA, Yoshiharu Denso Corporation ,  TESHIMA, Shoei Denso Corporation

IPC分类号： B23K35/363 ,  B23K1/19 ,  B23K35/36 ,  C08F220/18

CPC分类号： B23K35/3613 ,  B23K35/286 ,  B23K35/3605 ,  B23K35/3612

摘要： A water-base binder for use in brazing in producing brazed aluminum products such as radiators for engines and condensers for car air conditioners. The water-base binder is obtained by saponifying a methacrylate polymer having an acid value and a glass transition temperature respectively in specific ranges and combines solubility in water with volatility. A brazing composition obtained by mixing the binder with a flux, etc. in the presence of an alcohol having a flash point not lower than a specific temperature has no fear of taking fire or exploding. It further has so high wetting ability that it can be evenly applied to an aluminum material. The use of a binder obtained by adding polyoxirane or polyoxazoline as a minor ingredient to the methacrylate polymer as the main ingredient enables the brazing composition to have improved ordinary-temperature tight adhesion to aluminum materials and to be prevented from suffering a viscosity increase during application or storage.

公开(公告)号：EP1672971A1

公开(公告)日：2006-06-21

申请号：EP04773225.0

申请日：2004-09-10

申请人： National Institute of Advanced Industrial Science and Technology ,  HARIMA CHEMICALS, INC.

发明人： MURATA, Kazuhiro; c/o N.I.A.I.S.T. ,  YOKOYAMA, Hiroshi; c/o N.I.A.I.S.T. ,  ITOH, Daisuke; c/o Tsukuba Research Laboratory ,  IZUMITANI, A.; c/o Tsukuba Research Laboratory ,  HATA, Noriaki; c/o Tsukuba Research Laboratory ,  MATSUBA, Y.; c/o Tsukuba Research Laboratory

IPC分类号： H05K3/10 ,  H01L23/12

CPC分类号： B05D1/007 ,  B32B3/266 ,  B32B15/08 ,  H01L21/4867 ,  H01L2924/0002 ,  H05K3/125 ,  H05K3/245 ,  H05K3/4061 ,  H05K3/4647 ,  H05K2201/0367 ,  H05K2203/013 ,  H05K2203/105 ,  H05K2203/1131 ,  H05K2203/1476 ,  Y10T428/24322 ,  H01L2924/00

摘要： A method of preparing substrates, including the steps of depositing metal particulates into a pillar form at a prescribed position of a substrate (1) by the use of a fine inkjet method, and then sintering the resultant to form a metal pillar (2).

摘要翻译： 一种制备基板的方法，包括以下步骤：通过使用精细喷墨方法将基板（1）的规定位置处的金属颗粒沉积成柱状，然后烧结所述金属柱（2）。