Abstract:
The invention is for the formation of multilayer circuit boards where layers are formed sequentially using selective plating techniques and photoimaging of permanent dielectric materials to achieve fine line resolution and interconnections between circuits. The invention permits the sequential formation of multilayers of higher density using photoimaging techniques.
Abstract:
A composition for stripping a photoresist from a substrate comprising a mixture of lactams where a first Lactam comprises at least 60% of the stripping solution and a second, different lactam comprises the balance. The use of the mixed lactam solution enhances the rate of removal of the resist from a substrate. The preferred lactams are pyrrolidones.
Abstract:
An aqueous metal ion containing developer composition for developing photoresists comprising a metal ion-free alkali and a metal ion-free surfactant that is a quaternary ammonium compound. The developer permits a reduction of from 20 to 50% in the energy necessary to expose the photoresist without deleterious effect on image quality and image resolution.
Abstract:
An aqueous metal ion containing developer composition for developing photoresists comprising a metal ion-free alkali and a metal ion-free surfactant that is a quaternary ammonium compound. The developer permits a reduction of from 20 to 50% in the energy necessary to expose the photoresist without deleterious effect on image quality and image resolution.
Abstract:
Antihalation compositions and methods for reducing the reflection of exposure radiation of a photoresist overcoated said compositions. The antihalation compositions of the invention comprise a resin binder and material capable of causing a thermally induced crosslinking reaction of the resin binder.
Abstract:
Antihalation compositions and methods for reducing the reflection of exposure radiation of a photoresist overcoated said compositions. The antihalation compositions of the invention comprise a resin binder and material capable of causing a thermally induced crosslinking reaction of the resin binder.