公开(公告)号：EP0908559B8

公开(公告)日：2009-12-09

申请号：EP98118922.8

申请日：1998-10-07

Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.

Inventor： Gaku, Morio c/o Mitsubishi Gas Chemical Co., Inc. ,  Nozaki, Mitsuru c/o Mitsubishi Gas Chem. Co., Inc. ,  Saimen, Kenji c/o Kuraray Co., Ltd. ,  Esaki, Tamemaru c/o Kuraray Co., Ltd.

IPC: D21H13/24 ,  D21H17/53 ,  D21H25/06 ,  H05K1/00

CPC classification number: D21H13/24 ,  D21H17/53 ,  D21H25/06 ,  H05K1/0366 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0166 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10T428/24322 ,  Y10T442/2475

公开(公告)号：EP1616995A4

公开(公告)日：2009-09-23

申请号：EP04728681

申请日：2004-04-21

Applicant: OJI PAPER CO

Inventor： NISHIKORI YOSHIHARU ,  TERAO TOMOYUKI

IPC: D21H13/40 ,  B29B11/16 ,  D21H17/37 ,  D21H17/42 ,  D21H17/43 ,  D21H17/44 ,  D21H17/45 ,  D21H17/56 ,  D21H21/08 ,  D21H21/24 ,  D21H23/76 ,  H05K1/03

CPC classification number: D21H13/40 ,  D21H17/375 ,  D21H17/42 ,  D21H17/43 ,  D21H17/44 ,  D21H17/455 ,  D21H17/56 ,  D21H21/24 ,  D21H23/765 ,  H05K1/0366 ,  H05K2201/0293 ,  Y10T442/60 ,  Y10T442/623 ,  Y10T442/653

公开(公告)号：EP1500743B1

公开(公告)日：2009-04-22

申请号：EP03719225.9

申请日：2003-04-25

Applicant: Teijin Techno Products Limited

Inventor： FUJIMORI, Tatsushi C/O Teijin Techno Products ,  MURAYAMA, Sadamitsu C/O Teijin Techno Products

IPC: D21H13/26 ,  D21H13/24 ,  B29C70/88 ,  H05K3/46

CPC classification number: B32B15/14 ,  B29C70/10 ,  B29C70/12 ,  B29C70/202 ,  B32B15/20 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2305/076 ,  B32B2307/306 ,  B32B2457/08 ,  D21H13/24 ,  D21H13/26 ,  D21H21/18 ,  H05K1/0366 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2203/0594 ,  Y10T428/24116 ,  Y10T428/24124 ,  Y10T428/2419 ,  Y10T428/24264 ,  Y10T428/24994 ,  Y10T428/25 ,  Y10T428/254 ,  Y10T428/26 ,  Y10T442/2008 ,  Y10T442/696

Abstract: A heat-resistant synthetic fiber sheet which comprises 40 to 97 mass % of heat-resistant organic synthetic polymer short fibers and 3 to 60 mass % of a heat-resistant organic synthetic polymer fibrid and/or an organic resin binder for binding them, wherein at least a part of the short fibers has both end surfaces having an angle of inclination of 10 degree or more to the plane intersecting orthogonally to the fiber axis thereof. The heat-resistant synthetic fiber sheet is useful as a substrate for a laminate for an electric circuit board.

公开(公告)号：EP1780323A3

公开(公告)日：2008-09-17

申请号：EP07001390.9

申请日：1998-12-01

Applicant: NITTO BOSEKI CO., LTD.

Inventor： Konno, Michio ,  Saito, Shoichi ,  Miura, Yasushi c/o NITTO BOSEKI CO., LTD. ,  Kasai, Shin

IPC: D04H1/42 ,  D01D5/253 ,  C03B37/075 ,  D04H13/00

CPC classification number: H05K1/0366 ,  C03B37/083 ,  D04H1/4218 ,  D04H1/4226 ,  D04H1/4382 ,  D04H1/4391 ,  D04H3/00 ,  H05K2201/0293 ,  H05K2201/0296 ,  Y02P40/57

Abstract: A nonwoven fabric is constructed of a highly flat glass fiber which is a glass fiber whose section is flat and has a flatness ratio of 2.0 to 10 and which has such a section that the packing fraction is at least 85%, preferably at least 90%. In this nonwoven fabric, the glass fiber section has a shape near rectangle, and hence, the glass fibers can be arranged very densely to form a thin nonwoven fabric having a high bulk density, and when it is used as a laminate material, the glass fiber content can be increased and the surface smoothness can simultaneously be enhanced and can be used appropriately as a reinforcing material for a printed wiring board. Moreover, the above flat glass fiber can be produced by use of, for example, a nozzle having such a shape that one side of the major axis walls of a nozzle chip having a flat nozzle hole is partly notched.

公开(公告)号：EP1353541B1

公开(公告)日：2008-05-07

申请号：EP02729552.6

申请日：2002-01-11

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD

Inventor： NISHII, Toshihiro

IPC: H05K3/46

CPC classification number: H05K3/4688 ,  H05K1/0366 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4626 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/0278 ,  H05K2201/029 ,  H05K2201/0293 ,  H05K2201/10378 ,  Y10T428/24917

Abstract: A production method for a circuit board, comprising an inner-layer board laminating step of laminating at least one inner-layer metal sheet (5) on an inner-layer board material (1), an inner-layer circuit (6) forming step of forming circuits on the metal sheet to provide an inner-layer circuit board, a multi-layer laminating step of laminating together at least one multi-layer metal sheet (8), at least one multi-layer board material (7) and at least one inner-layer circuit board, and an outer-layer circuit (9) forming step of forming circuits on the multi-layer metal sheet, the inner-layer board material and the multi-layer board material being formed of materials different from each other, whereby it is possible to stabilize the quality of inter-wiring-layer connections in the inner-layer circuit board and improve the mechanical strength such as bonding strength of the outer-layer circuit.

Abstract translation: 1。一种电路基板的制造方法，其特征在于，具有：在内层基板材料（1）上层叠至少一层内层金属板（5）的内层基板层叠工序，内层电路（6） 在金属片上形成电路以提供内层电路板;多层层压步骤，将至少一个多层金属片（8），至少一个多层板材（7）和至少一个 至少一个内层电路板以及在多层金属板上形成电路的外层电路（9）形成步骤，所述内层板材和所述多层板材由不同于 由此可以稳定内层电路板中的布线层连接的质量并且提高诸如外层电路的接合强度之类的机械强度。

公开(公告)号：EP1911127A1

公开(公告)日：2008-04-16

申请号：EP06762886.7

申请日：2006-07-28

Applicant: AMPHENOL-TUCHEL ELECTRONICS GmbH

Inventor： BERTSCH, Michael, Steffen ,  GRIMM, Michael

IPC: H01R12/08

CPC classification number: H05K3/363 ,  H01R4/58 ,  H01R12/592 ,  H01R13/506 ,  H05K1/00 ,  H05K2201/0281 ,  H05K2201/0293 ,  H05K2201/10393 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: Method for electrically connecting conductive threads (conducting threads) (40) to any desired number of connection points on a textile semifinished product (5) using a connection element which is preferably in the form of a printed circuit board, wherein the following steps are provided: insertion of the printed circuit board in a correspondingly shaped cutout in a supporting plate of a tool having upwardly pointing connection points (122) of the printed circuit board (12); arranging the semifinished product (5) on the printed circuit board (12) such that a connection point, to be connected, on the semifinished product (5) comes to lie in the region of the connection points of the printed circuit board (12); fixing, preferably by means of fixedly clamping, the semifinished product adjacent to and on one side of the connection points of the printed circuit board; preferably extending the semifinished product (5) in the longitudinal direction or in the direction of the profile of the conducting threads; fixedly clamping the semifinished product in a region opposite the first fixed clamping region and adjacent to the desired connection point; soldering the exposed conducting threads (40) to the connection points on the printed circuit board (12).

公开(公告)号：EP1423995B1

公开(公告)日：2006-10-04

申请号：EP02763569.7

申请日：2002-08-29

Applicant: E.I. DU PONT DE NEMOURS AND COMPANY

Inventor： SAMUELS, Michael, R. ,  KAHN, Subhotosh ,  MIKHAIL, Levit, R.

IPC: H05K1/00

CPC classification number: H05K1/0366 ,  B29B13/10 ,  B32B15/14 ,  B32B27/12 ,  D04H1/4374 ,  D04H1/4382 ,  H05K1/036 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/015 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/249924 ,  Y10T428/24994 ,  Y10T428/249941 ,  Y10T442/30

Abstract: A sheet comprising thermoplastic polymer (TP) (4) and short high tensile modulus fibers (3) , in which the concentration of TP (4) in the middle of the sheet is higher than at the surface of the sheet, useful for making prepregs with a thermoset resin.

公开(公告)号：EP1577274A2

公开(公告)日：2005-09-21

申请号：EP05012735.6

申请日：2002-06-07

Applicant: JAPAN VILENE COMPANY, LTD.

Inventor： Kawabe, Masaaki ,  Tarao, Takashi ,  Kimura, Kouji

IPC: C03B37/01 ,  H05K1/03

CPC classification number: D01D5/0038 ,  C03B37/011 ,  D01F9/08 ,  D04H1/4209 ,  D04H1/4382 ,  H05K1/0366 ,  H05K2201/0293 ,  Y10T428/249924 ,  Y10T428/249928 ,  Y10T442/60

Abstract: An inorganic material-based article comprising inorganic material-based ultra-fine long fibers having an average fiber diameter of 2 µm or less, and composed mainly of an inorganic component, wherein the inorganic material-based ultra-fine long fibers are collected and contacting surfaces of the inorganic material-based ultra-fine long fibers are bonded to each other not via an adhesive is disclosed.

Abstract translation: 一种无机材料制品，其包含平均纤维直径为2μm以下的无机材料的超细长纤维，主要由无机成分构成，其中收集无机材料的超细长纤维， 公开了无机材料的超细长纤维的接触表面彼此不经由粘合剂彼此结合。

公开(公告)号：EP1310593A4

公开(公告)日：2005-04-20

申请号：EP00950005

申请日：2000-08-04

Applicant: TEIJIN LTD

Inventor： MURAYAMA SADAMITSU ,  MATSUI MICHIKAGE ,  WADA MASANORI ,  ISHIHARA SHIGERU

IPC: D21H13/26 ,  D04H1/42 ,  D04H1/4334 ,  D04H1/4342 ,  D04H1/54 ,  D04H1/549 ,  D04H1/58 ,  D04H1/64 ,  D21H13/24 ,  H05K1/03

CPC classification number: D04H1/4334 ,  D04H1/4342 ,  D04H1/549 ,  D04H1/64 ,  D21H13/24 ,  D21H13/26 ,  H05K1/0366 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10T428/249921 ,  Y10T428/249924 ,  Y10T428/2904 ,  Y10T428/2969 ,  Y10T442/609 ,  Y10T442/61 ,  Y10T442/611 ,  Y10T442/69

Abstract: A heat-resistant fibrous paper which is formed mainly from short fibers made of a heat-resistant organic polymer, short fibers made of an unstretched or lowly stretched para-aromatic polyamide, and an organic resin binder and/or fibrids made of a heat-resistant organic polymer, wherein the amount of the short fibers is 45 to 97 wt.% based on the whole paper, the amount of the organic resin binder and/or the fibrids is 3 to 55 wt.%, and the organic resin binder has been cured and/or the short fibers of an unstretched or lowly stretched para-aromatic polyamide and the fibrids were partly softened and/or deformed and melted to make them serve as a binder. This heat-resistant fibrous paper is excellent in heat resistance, thermal dimensional stability, interlaminar peel strength, electrical insulating properties in a high-humidity atmosphere, etc. and can be satisfactorily impregnated with a resin despite its high bulk density. It is especially suitable for use as a substrate for electrical insulating materials or a substrate for layered products for electrical circuits.

公开(公告)号：EP0994215B1

公开(公告)日：2003-06-04

申请号：EP99307943.3

申请日：1999-10-08

Applicant: TEIJIN LIMITED

Inventor： Wada, Masanori, c/o Teijin Limited ,  Murayama, Sadamitsu, c/o Teijin Limited ,  Matsui, Michikage c/o Teijin Limited

IPC: D21H13/26 ,  H01B3/52

CPC classification number: H01B3/52 ,  D21H13/24 ,  D21H13/26 ,  D21H15/02 ,  D21H15/06 ,  D21H17/52 ,  H05K1/0366 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10T428/2973 ,  Y10T428/2976 ,  Y10T428/2978 ,  Y10T442/609 ,  Y10T442/61 ,  Y10T442/611 ,  Y10T442/69 ,  Y10T442/697