公开(公告)号：EP3071002A4

公开(公告)日：2016-12-07

申请号：EP14876888

申请日：2014-12-29

Applicant: KUNSHAN VISIONOX DISPLAY CO LTD

Inventor： AN LEPING ,  WANG LONG ,  GAO MING ,  HONG YAO ,  PU BIN

IPC: H05K1/02

CPC classification number: H05K1/028 ,  G06F3/041 ,  G06F2203/04107 ,  H05K1/0213 ,  H05K1/0215 ,  H05K2201/053 ,  H05K2201/09009

公开(公告)号：EP3072682A1

公开(公告)日：2016-09-28

申请号：EP16166102.0

申请日：2013-03-26

Applicant: JX Nippon Mining & Metals Corporation

Inventor： NAGAURA, Tomota ,  KOHIKI, Michiya ,  MORIYAMA, Terumasa

IPC: B32B15/01 ,  B32B3/30 ,  H05K1/09 ,  H05K3/06 ,  H05K3/24

CPC classification number: H05K1/09 ,  B32B3/30 ,  B32B15/01 ,  B32B15/08 ,  B32B15/20 ,  B32B2307/306 ,  B32B2307/714 ,  B32B2457/08 ,  C22C9/00 ,  C25D1/04 ,  C25D3/12 ,  C25D3/38 ,  C25D5/12 ,  C25D9/08 ,  H05K1/0313 ,  H05K3/022 ,  H05K3/025 ,  H05K3/06 ,  H05K3/181 ,  H05K3/188 ,  H05K3/381 ,  H05K3/383 ,  H05K3/388 ,  H05K2201/09009 ,  Y10T428/12549 ,  Y10T428/12569 ,  Y10T428/12611 ,  Y10T428/12792 ,  Y10T428/12847 ,  Y10T428/12903 ,  Y10T428/1291

Abstract: Provided is a printed wiring board including a copper foil having a roughened layer on at least one surface thereof. In the roughened layer, the average diameter D1 at the particle bottom being apart from the bottom of each particle by 10% of the particle length is 0.2 to 1.0 µm, and the ratio L1/D1 of the particle length L1 to the average diameter D1 at the particle bottom is 15 or less. In the copper foil for printed wiring board, when a copper foil for printed wiring having a roughened layer is laminated to a resin and then the copper layer is removed by etching, the sum of areas of holes accounting for the resin roughened surface having unevenness is 20% or more. The present invention involves the development of a copper foil for a semiconductor package substrate that can avoid circuit erosion without causing deterioration in other properties of the copper foil. In particular, the object of the present invention is to provide a printed wiring board and a method of producing the printed circuit board, in which the adhesion strength between the copper foil and the resin can be enhanced by improvement of the roughened layer of the copper foil.

Abstract translation: 提供一种印刷线路板，其包括在其至少一个表面上具有粗糙层的铜箔。 在粗糙层中，粒子底部的距离粒子的底部的平均粒径D1的粒子长度的10％为0.2〜1.0μm，粒子长度L1与平均直径D1的比L1 / D1 在颗粒底部为15或更小。 在印刷电路板用铜箔中，当将具有粗糙层的印刷布线用铜箔层压到树脂上，然后通过蚀刻除去铜层时，占据具有不平坦度的树脂粗糙面的孔的面积之和为 20％以上。 本发明涉及开发用于半导体封装基板的铜箔，其可以避免电路侵蚀而不会导致铜箔的其它性能的劣化。 特别地，本发明的目的在于提供一种印刷电路板和印刷电路板的制造方法，其中通过改善铜的粗糙层，可以提高铜箔和树脂之间的粘合强度 挫败。

公开(公告)号：EP2958408A1

公开(公告)日：2015-12-23

申请号：EP13874923.9

申请日：2013-02-12

Applicant: Meiko Electronics Co., Ltd.

Inventor： SHIMADA, Hiroshi ,  TODA, Mitsuaki ,  MATSUMOTO, Tohru

IPC: H05K3/46

CPC classification number: H05K3/20 ,  C23F1/00 ,  H05K1/0298 ,  H05K1/185 ,  H05K1/188 ,  H05K3/22 ,  H05K3/4611 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/09009 ,  H05K2201/10636 ,  H05K2203/11 ,  Y02P70/611

Abstract: A device embedded substrate (15) includes an insulating layer (12) including an insulating resin material, an electric or electronic device (4) embedded in the insulating layer (12), a metal film (9) coating at least one face of the device (4), and a roughened portion (10) formed by roughening at least part of the surface of the metal film (9). Preferably, the device embedded substrate (15) further includes: a conductive layer (6) pattern-formed at least on a bottom face (7), the bottom face (7) being one face of the insulating layer (12); and a bonding agent (3) made of a material different from the insulating layer (12) and joining the conductive layer (6) and a mounting face (8), the mounting face (8) being one face of the device (4). The metal film (9) is formed only on a face opposite to the mounting face (8), and the bonding agent (3) has a thickness smaller than a thickness from the metal film (9) to a top face (11), the top face (11) being the other face of the insulating layer (12).

Abstract translation: 一种器件嵌入式衬底（15）包括绝缘层（12），其包括绝缘树脂材料，嵌入在绝缘层（12）中的电子或电子器件（4），金属膜（9） 以及通过使金属膜（9）的至少一部分表面粗糙化而形成的粗糙部（10）。 优选地，所述器件嵌入式衬底（15）还包括：至少在底面（7）上图案形成的导电层（6），所述底面（7）是所述绝缘层（12）的一个面; 以及由与所述绝缘层（12）不同的材料制成并且将所述导电层（6）和安装面（8）接合的接合剂（3），所述安装面（8）是所述装置（4）的一个面， 。 金属膜（9）仅形成在与安装面（8）相反的面上，粘接剂（3）的厚度比从金属膜（9）到顶面（11）的厚度小， 所述顶面（11）是所述绝缘层（12）的另一面。

公开(公告)号：EP3113586B1

公开(公告)日：2018-11-28

申请号：EP15754711.8

申请日：2015-02-20

Applicant: NGK Insulators, Ltd.

Inventor： TAKAGAKI, Tatsuro ,  IWASAKI, Yasunori ,  MIYAZAWA, Sugio ,  IDE, Akiyoshi ,  NAKANISHI, Hirokazu

IPC: H05K1/03 ,  C04B35/111 ,  H05K3/00

CPC classification number: H05K1/115 ,  C04B35/111 ,  C04B35/119 ,  C04B35/634 ,  C04B2235/3206 ,  C04B2235/3217 ,  C04B2235/3225 ,  C04B2235/3244 ,  C04B2235/3281 ,  C04B2235/3418 ,  C04B2235/6023 ,  C04B2235/606 ,  C04B2235/612 ,  C04B2235/6582 ,  C04B2235/662 ,  C04B2235/72 ,  C04B2235/77 ,  C04B2235/786 ,  C04B2235/95 ,  H01B3/12 ,  H01B17/56 ,  H05K1/03 ,  H05K1/0306 ,  H05K3/00 ,  H05K3/0014 ,  H05K3/0029 ,  H05K2201/09009 ,  Y10T428/24273

Abstract: It is provided an insulating substrate including through holes for conductors arranged in the insulating substrate. A thickness of the insulating substrate is 25 to 100 µ m, and a diameter of the through hole is 20 to 100 µ m. The insulating substrate includes a main body part and exposed regions exposed to the through holes and is composed an alumina sintered body. A relative density of the alumina sintered body is 99.5 percent or higher. The alumina sintered body has a purity of 99.9 percent or higher, and has an average grain size of 3 to 6 µ m in said main body part. Alumina grains are plate-shaped in the exposed region and the plate-shaped alumina grains have an average length of 8 to 25 µ m.

公开(公告)号：EP3160215B1

公开(公告)日：2018-06-13

申请号：EP16193702.4

申请日：2016-10-13

Applicant: VALEO VISION

Inventor： BADIA, Olivier

IPC: H05K1/02 ,  B60Q1/00

CPC classification number: H05K1/0281 ,  B60Q1/0088 ,  B60Q1/04 ,  B60Q1/076 ,  H05K1/0393 ,  H05K2201/0154 ,  H05K2201/046 ,  H05K2201/09009 ,  H05K2201/10121 ,  H05K2201/2009

公开(公告)号：EP3113585A4

公开(公告)日：2017-10-25

申请号：EP15750613

申请日：2015-02-24

Applicant: NGK INSULATORS LTD

Inventor： TAKAGAKI TATSURO ,  IWASAKI YASUNORI ,  MIYAZAWA SUGIO ,  IDE AKIYOSHI ,  NAKANISHI HIROKAZU

IPC: H05K1/03 ,  C04B35/111 ,  H05K3/00

CPC classification number: H05K1/115 ,  C04B35/111 ,  C04B35/119 ,  C04B35/634 ,  C04B2235/3206 ,  C04B2235/3217 ,  C04B2235/3225 ,  C04B2235/3244 ,  C04B2235/3281 ,  C04B2235/3418 ,  C04B2235/6023 ,  C04B2235/606 ,  C04B2235/612 ,  C04B2235/6582 ,  C04B2235/662 ,  C04B2235/72 ,  C04B2235/77 ,  C04B2235/786 ,  C04B2235/95 ,  H01B3/12 ,  H01B17/56 ,  H05K1/03 ,  H05K1/0306 ,  H05K3/00 ,  H05K3/0014 ,  H05K3/0029 ,  H05K2201/09009 ,  Y10T428/24273

Abstract: It is provided an insulating substrate including through holes for conductors arranged in the insulating substrate. A thickness of the insulating substrate is 25 to 100 µ m, and a diameter of the through hole is 20 to 100 µ m. The insulating substrate includes a main body part and exposed regions exposed to the through holes and is composed an alumina sintered body. A relative density of the alumina sintered body is 99.5 percent or higher. The alumina sintered body has a purity of 99.9 percent or higher, and has an average grain size of 3 to 6 µ m in said main body part. Alumina grains are plate-shaped in the exposed region and the plate-shaped alumina grains have an average length of 8 to 25 µ m.

公开(公告)号：EP3160215A1

公开(公告)日：2017-04-26

申请号：EP16193702.4

申请日：2016-10-13

Applicant: VALEO VISION

Inventor： BADIA, Olivier

IPC: H05K1/02 ,  B60Q1/00

CPC classification number: H05K1/0281 ,  B60Q1/0088 ,  B60Q1/04 ,  B60Q1/076 ,  H05K1/0393 ,  H05K2201/0154 ,  H05K2201/046 ,  H05K2201/09009 ,  H05K2201/10121 ,  H05K2201/2009

Abstract: Carte de circuit imprimé flexible, configurée pour recevoir des composants électroniques, comportant un élément flexible (10), électriquement isolant, configuré pour porter des pistes conductrices de connexion des composants, l'élément flexible étant en outre configuré pour être courbé selon une courbure (11), la carte comportant en outre un élément de renforcement (22), électriquement isolant, solidaire mécaniquement de l'élément flexible (10), s'étendant d'un côté de la courbure, et comportant deux parties :
- une première partie (220) étant sensiblement plane,
- une deuxième partie (221) présentant une courbure prédéfinie, disposée du côté de la courbure (11) de l'élément flexible (10),
l'élément de renforcement (22) étant disposé de sorte à laisser une partie libre (11) pour l'élément flexible (10) pour être courbée selon ladite courbure.

Abstract translation: 增强元件被布置以便留下一个自由部分柔性元件被弯曲gemäß到曲率。

公开(公告)号：EP3032548A4

公开(公告)日：2017-02-08

申请号：EP14834164

申请日：2014-07-24

Applicant: LG CHEMICAL LTD

Inventor： KIM JAE HYUN ,  KIM JAE JIN ,  PARK CHEOL-HEE ,  PARK CHEE-SUNG ,  JUN SHIN HEE ,  JUNG SANG YUN ,  JEONG HAN NAH

IPC: H01B13/00 ,  C08J7/06 ,  C23C18/16 ,  C23C18/20 ,  C23C18/22 ,  C23C18/30 ,  C25D5/02 ,  C25D5/56 ,  H01B5/14 ,  H05K3/02 ,  H05K3/18

CPC classification number: C23C18/31 ,  C09D5/24 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/1689 ,  C23C18/204 ,  C23C18/2053 ,  C23C18/22 ,  C23C18/30 ,  C23C18/32 ,  C23C18/38 ,  C25D5/02 ,  C25D5/56 ,  H05K1/0296 ,  H05K1/09 ,  H05K3/02 ,  H05K3/181 ,  H05K2201/09009

公开(公告)号：EP2958408A4

公开(公告)日：2016-11-30

申请号：EP13874923

申请日：2013-02-12

Applicant: MEIKO ELECTRONICS CO LTD

Inventor： SHIMADA HIROSHI ,  TODA MITSUAKI ,  MATSUMOTO TOHRU

IPC: H05K3/46

CPC classification number: H05K3/20 ,  C23F1/00 ,  H05K1/0298 ,  H05K1/185 ,  H05K1/188 ,  H05K3/22 ,  H05K3/4611 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/09009 ,  H05K2201/10636 ,  H05K2203/11 ,  Y02P70/611

Abstract: A device embedded substrate (15) includes an insulating layer (12) including an insulating resin material, an electric or electronic device (4) embedded in the insulating layer (12), a metal film (9) coating at least one face of the device (4), and a roughened portion (10) formed by roughening at least part of the surface of the metal film (9). Preferably, the device embedded substrate (15) further includes: a conductive layer (6) pattern-formed at least on a bottom face (7), the bottom face (7) being one face of the insulating layer (12); and a bonding agent (3) made of a material different from the insulating layer (12) and joining the conductive layer (6) and a mounting face (8), the mounting face (8) being one face of the device (4). The metal film (9) is formed only on a face opposite to the mounting face (8), and the bonding agent (3) has a thickness smaller than a thickness from the metal film (9) to a top face (11), the top face (11) being the other face of the insulating layer (12).

公开(公告)号：EP3007183A1

公开(公告)日：2016-04-13

申请号：EP14834338.7

申请日：2014-08-07

Applicant: LG Chem, Ltd.

Inventor： KIM, Jae Hyun ,  SEONG, Eun Kyu ,  LEE, Su Jeong ,  KIM, Jae Jin ,  PARK, Cheol-Hee ,  PARK, Chee-Sung ,  JUN, Shin Hee ,  JUNG, Sang Yun ,  JEONG, Han Nah

IPC: H01B13/00 ,  C08J7/04

CPC classification number: C23C18/31 ,  C09D5/24 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/1689 ,  C23C18/204 ,  C23C18/2053 ,  C23C18/2073 ,  C23C18/22 ,  C23C18/30 ,  C23C18/32 ,  C23C18/38 ,  C25D5/02 ,  C25D5/56 ,  H05K1/0296 ,  H05K1/09 ,  H05K3/02 ,  H05K3/181 ,  H05K2201/09009

Abstract: Provided are a method for forming conductive pattern by direct radiation of an electromagnetic wave capable of forming fine conductive patterns on various kinds of polymer resin products or resin layers under a relatively low power by a simplified process, even without containing specific inorganic additives in the polymer resin itself, and a resin structure having the conductive pattern formed thereon.
The method for forming the conductive pattern by direct radiation of the electromagnetic wave includes: forming a first region having a predetermined surface roughness by selectively radiating the electromagnetic wave on a polymer resin substrate containing carbon-based black pigment; forming a conductive seed on the polymer resin substrate; forming a metal layer by plating the polymer resin substrate having the conductive seed formed thereon; and removing the conductive seed and the metal layer from a second region of the polymer resin substrate, wherein the second region has surface roughness smaller than that of the first region.

Abstract translation: 本发明提供一种即使在聚合物中不含有特定的无机添加剂的情况下，也能够通过简单的工序以较低的功率在各种聚合物树脂制品或树脂层上直接照射能够形成微细的导电图案的电磁波而形成导电图案的方法 树脂本身以及其上形成有导电图案的树脂结构。 通过电磁波的直接辐射来形成导电图案的方法包括：通过在包含碳基黑色颜料的聚合物树脂基板上选择性地辐射电磁波来形成具有预定表面粗糙度的第一区域; 在聚合物树脂基底上形成导电种子; 通过电镀形成有导电晶种的聚合物树脂基板形成金属层; 以及从聚合物树脂基板的第二区域去除导电种子和金属层，其中第二区域的表面粗糙度小于第一区域的表面粗糙度。