公开(公告)号：EP2798687A1

公开(公告)日：2014-11-05

申请号：EP12863032.4

申请日：2012-12-26

Applicant: Shenzhen BYD Auto R&D Company Limited ,  BYD Company Limited

Inventor： GONG, Qing ,  LIN, Xinping ,  ZHANG, Xu ,  LIN, Yongzhao ,  XU, Shurong

IPC: H01M2/08 ,  H01M2/30

CPC classification number: H01M2/08 ,  B23K1/008 ,  B23K1/19 ,  B23K2201/38 ,  C04B37/026 ,  C04B2237/121 ,  C04B2237/122 ,  C04B2237/123 ,  C04B2237/124 ,  C04B2237/343 ,  C04B2237/348 ,  C04B2237/402 ,  C04B2237/403 ,  C04B2237/405 ,  C04B2237/407 ,  C04B2237/52 ,  H01G9/2077 ,  H01M2/065 ,  H01M2/307 ,  Y10T29/4911

Abstract: A sealing assembly, a method of preparing the sealing assembly and a battery are provided. The sealing assembly comprises a metal ring (1) having a mounting hole therein; a ceramic ring (2) having a connecting hole therein and disposed in the mounting hole; and a core column (3) disposed in the connecting hole, wherein at least one of an inner circumferential wall surface of the metal ring, an outer circumferential wall surface of the ceramic ring, an inner circumferential wall surface of the ceramic ring and an outer circumferential wall surface of the core column is configured as an inclined surface, and an inclination angle of the inclined surface relative to a vertical plane is about 1 degree to about 45 degrees.

公开(公告)号：EP2798097A1

公开(公告)日：2014-11-05

申请号：EP12863579.4

申请日：2012-12-26

Applicant: Shenzhen BYD Auto R&D Company Limited ,  BYD Company Limited

Inventor： MIAO, Weifeng

IPC: C23C18/18 ,  C25D5/24 ,  C25D5/02 ,  C09D11/02 ,  H05K3/14

CPC classification number: C23C18/1882 ,  C09D11/037 ,  C09D11/322 ,  C09D11/52 ,  C23C18/1608 ,  C23C18/1639 ,  C23C18/165 ,  C23C18/1865 ,  C23C18/1879 ,  C23C18/2033 ,  C23C18/206 ,  C23C28/00 ,  C25D5/02 ,  H05K1/097 ,  H05K3/18 ,  H05K3/246 ,  H05K2203/1105

Abstract: A mthod of metalizing a surface of an insulation substrate includes: applying an ink composition onto the surface to form an ink layer; subjecting the insulation substrate to heat treatment at a temperature of about 500 to 1000 degrees Celsius in a non-reactive atmosphere; plating a metal layer on the ink layer. The ink composition comprises a metal compound and an ink vehicle. The metal compound includes at least one selected from a group consisting of a nano-copper oxide, a nano-cuprous oxide, a compound of formula I, and a compound of formula II, TiO2-σ(I), M1M2pOq (II), 0.05≦σ

公开(公告)号：EP2783406A1

公开(公告)日：2014-10-01

申请号：EP12851772.9

申请日：2012-11-23

Applicant: Shenzhen BYD Auto R&D Company Limited ,  BYD Company Limited

Inventor： HE, Yuanyuan ,  ZHENG, Weixin

IPC: H01M2/26 ,  H01M10/0587

CPC classification number: H01M2/263 ,  H01M2/24 ,  H01M2/30 ,  H01M10/0525 ,  H01M10/0587 ,  H01M2220/20 ,  H01M2220/30 ,  H01R4/48 ,  Y02E60/122

Abstract: An electric connector and a battery comprising the same may be provided. The electric connector (3) may comprise a core fixing part and an extension part (32) connected to the core fixing part. The core fixing part may include at least two hosting portions (31) each configured to hold an electrode tab of a winding core of a battery, respectively, and a connection portion (33) configured to connect the two adjacent hosting portions.

公开(公告)号：EP2782784A1

公开(公告)日：2014-10-01

申请号：EP12852324.8

申请日：2012-11-22

Applicant: Shenzhen BYD Auto R&D Company Limited ,  BYD Company Limited

Inventor： ZHONG, Yilin ,  BAI, Junming ,  DAI, Jun ,  FANG, Lei ,  GAO, Jingjing

IPC: B60R7/06 ,  B65D43/26 ,  B65D43/16

CPC classification number: F16H21/40 ,  B60R11/00 ,  B60R11/0258 ,  B60R2011/0005 ,  B60R2011/0082 ,  B60R2011/0084 ,  B60R2011/0092 ,  B60R2011/0094 ,  Y10T74/188

Abstract: A lifting device for vehicle-mounted equipment and a vehicle having the same are provide. The lifting device comprises: a housing (1) adapted to disposed in a dashboard having an opening; a cover-flipping mechanism (6) disposed pivotably in the housing (1) and having a first end with a cover plate (7) for opening and closing the opening; and a lifting-box assembly (3), onto which the vehicle-mounted equipment is adapted to be mounted, the lifting-box assembly (3) being disposed in the housing (1), connected to a second end of the cover-flipping mechanism (6), and configured to be vertically movable between an extended position, in which the cover plate (7) opens the opening and the vehicle-mounted equipment is extended out of the dashboard through the opening, and a retracted position, in which the vehicle-mounted equipment is retracted into the dashboard through the opening and the cover plate (7) closes the opening.

公开(公告)号：EP2727166A1

公开(公告)日：2014-05-07

申请号：EP12804665.3

申请日：2012-06-27

Applicant: Shenzhen BYD Auto R&D Company Limited ,  BYD Company Limited

Inventor： DENG, Qisi ,  WANG, Lujian ,  HE, Yuchen ,  WU, Qiang

IPC: H01M2/04 ,  H01M10/00

CPC classification number: H01M2/30 ,  H01M2/0404 ,  H01M2/043 ,  H01M2/0456 ,  H01M2/065 ,  H01M2/08

Abstract: A cover assembly and a battery comprising the same are provided. The cover assembly comprises: a cover plate body (1) formed with at least a via hole (11) penetrating therethrough; a cover plate connecting member (2) hermetically connected with the cover plate body (1) at the via hole (11), which is formed with an electrode receiving hole (21) therein; and an electrode terminal (3) penetrating through the electrode receiving hole (21) to be hermetically connected with and insulated from the cover plate connecting member (2) for leading out a current.

公开(公告)号：EP2721651A1

公开(公告)日：2014-04-23

申请号：EP12800673.1

申请日：2012-06-15

Applicant: Shenzhen BYD Auto R&D Company Limited ,  BYD Company Limited

Inventor： CHEN, Wanshi ,  ZHANG, Wang

IPC: H01L33/00

CPC classification number: H01L33/42 ,  C23C14/086 ,  C23C14/30 ,  H01L21/02104 ,  H01L31/022466 ,  H01L31/022475 ,  H01L31/022483 ,  H01L33/22 ,  H01L2251/308 ,  H01L2933/0016

Abstract: A method for forming a current diffusion layer in a semiconductor light emitting device comprises steps of: heating and evaporating an ITO source on an epitaxial wafer by a direct current electron gun to form an ITO layer (16); after a part of the ITO layer (16) which accounts for 85%-90% of the thickness of the ITO layer (16) is deposited, heating and evaporating a doped ZnO source by a pulse current electron gun, and controlling a duty ratio of the pulse current of the pulse current electron gun to deposit a discontinuously arranged doped ZnO layer (17) on the part of the ITO layer (16) during the process of depositing the ITO layer (16); and further heating and evaporating the ITO source by the direct current electron gun to continue depositing a continuously deposited ITO layer (16) which buries the doped ZnO layer (17). Further, a method for fabricating a semiconductor light emitting device is also provided.

公开(公告)号：EP2689484A1

公开(公告)日：2014-01-29

申请号：EP12796088.8

申请日：2012-06-06

Applicant: Shenzhen BYD Auto R&D Company Limited ,  BYD Company Limited

Inventor： LIN, Miaoyun ,  YOU, Zhen ,  YU, Weicheng ,  LUO, Mingjun ,  LIU, Huiquan

IPC: H01M2/16

CPC classification number: H01M2/162 ,  H01M2/1653 ,  H01M2/1686 ,  H01M10/0525

Abstract: A battery separator and a method for preparing the same are provided. The battery separator comprises: a substrate which is a polyvinylidene fluoride non-woven fabric; and a coating layer formed on each surface of the substrate, in which the material of the coating layer comprises an ultra-high molecular weight polyethylene and a linear low density polyethylene.

公开(公告)号：EP2628204A1

公开(公告)日：2013-08-21

申请号：EP11832049.8

申请日：2011-10-13

Applicant: Shenzhen BYD Auto R&D Company Limited ,  BYD Company Limited

Inventor： WU, Guanglin ,  SUN, Huajun ,  PAN, Liying

IPC: H01M10/0525 ,  H01M2/30 ,  H01M2/20

CPC classification number: H01M2/06 ,  H01M2/30 ,  H01M2/32 ,  H01M10/0525 ,  H01M2200/103 ,  H01M2200/106

Abstract: A battery comprise: a housing made by a metal or a metal alloy; a battery core in the housing comprising a positive plate, a separator and a negative plate; an electrolyte in the housing; a cover assembly having a positive terminal electrically connected with the positive plate and a negative terminal electrically connected with the negative plate; and a protection component to prevent the housing from being corroded by the electrolyte.

Abstract translation: 电池包括：由金属或金属合金制成的壳体; 壳体中的电池芯，其包括正极板，隔板和负极板; 壳体中的电解质; 盖组件，其具有与正极板电连接的正极端子和与负极板电连接的负极端子; 以及防止壳体被电解质腐蚀的保护部件。

公开(公告)号：EP2606509A1

公开(公告)日：2013-06-26

申请号：EP11819399.4

申请日：2011-08-16

Applicant: BYD Company Limited ,  Shenzhen BYD Auto R&D Company Limited

Inventor： LIU, Yingce ,  HUO, Dongming ,  SUN, Tianbao

IPC: H01L21/58 ,  H01L33/48

CPC classification number: H01L33/40 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L33/0079 ,  H01L33/641 ,  H01L2224/04026 ,  H01L2224/05073 ,  H01L2224/05138 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/27472 ,  H01L2224/27622 ,  H01L2224/27831 ,  H01L2224/29011 ,  H01L2224/2908 ,  H01L2224/29082 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29116 ,  H01L2224/29138 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/83345 ,  H01L2224/83805 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29018 ,  H01L2924/00012 ,  H01L2924/01014 ,  H01L2924/01048 ,  H01L2924/01034

Abstract: A semiconductor chip assembly and a method for forming the same are provided. The semiconductor chip assembly comprises: a semiconductor chip (20), a substrate (10), a first layer (203) formed on a surface of the substrate (10), in which one of the first layer (203) and the second layer (204) has an opening (205) therein; and a second layer (204) formed on a surface of the semiconductor chip (20) and connected to the first layer (203) by eutectic bonding.

公开(公告)号：EP2529605A1

公开(公告)日：2012-12-05

申请号：EP11736612.0

申请日：2011-01-17

Applicant: BYD Company Limited ,  Shenzhen BYD Auto R&D Company Limited

Inventor： XIE, Bingbin ,  PANG, Daocheng

IPC: H05K1/11

CPC classification number: H05K1/117 ,  H01R13/03 ,  H01R13/04 ,  H01R13/113 ,  H05K2201/09381 ,  H05K2201/09409 ,  H05K2201/09709

Abstract: A contact piece of a gold finger comprises: a first main body segment; a second main body segment; and a transition segment connected to the first main body segment and the second main body segment, respectively, in a vertical direction, in which an upper edge and a lower edge of the transition segment are inclined with respect to a lateral direction respectively. A gold finger and a connector comprising the same are also provided.