SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
    25.
    发明公开
    SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE 审中-公开
    VORRICHTUNG MIT EINER INTEGRIERTEN HALBLEITERSCHALTUNG

    公开(公告)号:EP3032540A4

    公开(公告)日:2017-03-15

    申请号:EP13891121

    申请日:2013-08-06

    发明人: NII KOJI

    摘要: In a chip that processes image information or the like, a multi-port SRAM is mixed together with a logic circuit such as a digital signal processing circuit. In that case, for example, in case that the 3 port is used, the 1 port may serve as a differential write and readout port, and the 2 port may serve as a single ended readout dedicated port. However, in this configuration, it is obvious that there is a problem, in that while the occupied area of an embedded SRAM is reduced, the number of write and readout ports is limited to only one, and readout characteristics as fast as differential readout cannot be expected in single ended readout. The outline of the present application is that three differential write and readout ports are included in a memory cell structure of the embedded SRAM, an N-well region, for example, is arranged at the center of a cell, and a P-well region is arranged on both sides thereof.

    摘要翻译: 在处理图像信息等的芯片中,多端口SRAM与诸如数字信号处理电路的逻辑电路混合在一起。 在这种情况下,例如,在使用3端口的情况下,1端口可以用作差分写入和读出端口,并且2端口可以用作单端读出专用端口。 然而,在这种配置中,显然存在一个问题,即当嵌入式SRAM的占用面积减小时,写入和读出端口的数量仅限于一个,并且与差分读出一样快的读出特性不能 预计在单端读出。 本申请的概述是三个差分写入和读出端口包括在嵌入式SRAM的存储单元结构中,例如,N阱区域被布置在单元的中心,并且P阱区域 布置在其两侧。

    LEVEL SHIFT CIRCUIT, SEMICONDUCTOR DEVICE
    27.
    发明公开
    LEVEL SHIFT CIRCUIT, SEMICONDUCTOR DEVICE 审中-公开
    层滑动电路,半导体元件

    公开(公告)号:EP2882104A4

    公开(公告)日:2016-05-25

    申请号:EP12882294

    申请日:2012-08-01

    发明人: KAWASAKI YOICHI

    摘要: A level shift circuit includes: a latch circuit (Q5, Q6, Q7, Q8) including first (Q5, Q7) and second (Q6, Q8) inverter circuits; a first input MOS transistor (Q1) operating in accordance with an input signal; a second input MOS transistor (Q2) operating in accordance with an inversion signal of the input signal; and a current-voltage control MOS transistor (Q9). The latch circuit (Q5, Q6, Q7, Q8) outputs a voltage having been converted from the input voltage in level. Each of the first and second input MOS transistors (Q1, Q2) receives the input signal at its gate terminal, and drives the latch circuit (Q5, Q6, Q7, Q8) in accordance with the input signal. The current-voltage control MOS transistor (Q9) is provided between the input MOS transistor (Q1, Q2) and the latch circuit (Q5, Q6, Q7, Q8), and is driven in accordance with an inversion operation of the latch circuit by receiving an input of the control voltage at its gate terminal.

    SEMICONDUCTOR DEVICE
    29.
    发明公开

    公开(公告)号:EP2892054A4

    公开(公告)日:2016-03-30

    申请号:EP12883828

    申请日:2012-08-29

    IPC分类号: G11C16/06 G11C16/02 G11C16/14

    摘要: In a nonvolatile memory device (4) provided in a semiconductor device, when data is erased based on a band-to-band tunneling scheme, supply of a boosted voltage to a memory cell (MC) to be erased is ended when a condition that an output voltage (VUCP) of a charge pump circuit (52) has recovered to a predetermined reference voltage is satisfied and additionally a condition that a predetermined reference time has elapsed since start of supply of the boosted voltage (VUCP) to the memory cell (MC) to be erased is satisfied.