公开(公告)号：EP2577721A2

公开(公告)日：2013-04-10

申请号：EP11729389.4

申请日：2011-06-01

申请人： KUKA Systems GmbH ,  Albrecht, Dirk

发明人： ALBRECHT, Dirk ,  LIEPERT, Jürgen ,  BÜCHLER, Michael ,  HUBER, Rudolf ,  KUGLER, Thomas ,  KIEMSTEDT, Peter

IPC分类号： H01L21/67 ,  H01L31/18

CPC分类号： H01L31/048 ,  B32B17/10036 ,  B32B17/10798 ,  B32B17/10816 ,  H01L21/67092 ,  H01L21/67132 ,  Y02E10/50

摘要： The invention relates to a production device (2) and a method for forming multilayered (3, 4, 5, 6, 7) modules, in particular solar modules (1), which have at least one translucent sheet-like layer (3, 6) and at least one solar- or light-active element. The production device (2) forms the layer structure and has an applicator (33) for a connecting layer (5, 7) for the aforementioned layers (3, 4, 6). Furthermore, it has a controllable curve-forming device (17) for bending and rolling a sheet-like layer (3, 6) while the layers are being applied.

公开(公告)号：EP0962960B1

公开(公告)日：2012-12-19

申请号：EP99303874.4

申请日：1999-05-18

申请人： LUCENT TECHNOLOGIES INC.

发明人： Dudderar, Thomas Dixon ,  Gutentag, Charles

IPC分类号： H01L21/683 ,  H01L21/67

CPC分类号： H01L21/67132 ,  H01L21/6838 ,  H01L2224/75 ,  H01L2224/753 ,  H01L2224/75745 ,  Y10T29/53191

公开(公告)号：EP2523209A1

公开(公告)日：2012-11-14

申请号：EP12179539.7

申请日：2010-04-23

申请人： EV Group GmbH

发明人： Lindner, Friedrich Paul ,  Burggraf, Jürgen

IPC分类号： H01L21/00 ,  H01L21/67

CPC分类号： B32B38/10 ,  B32B37/025 ,  B32B43/006 ,  B32B2038/0052 ,  B32B2307/546 ,  B32B2310/0418 ,  H01L21/67092 ,  H01L21/67132 ,  H01L21/6715 ,  H01L21/67346 ,  H01L21/68721 ,  H01L21/68771 ,  H01L2221/68386 ,  Y10T156/1111 ,  Y10T156/1168 ,  Y10T156/1179 ,  Y10T156/19 ,  Y10T156/1922 ,  Y10T156/1928 ,  Y10T156/1978 ,  Y10T156/1983

摘要： Die vorliegende Erfindung betrifft eine zum Ablösen eines Produktsubstrats (4) von einem mit dem Produktsubstrat (4) durch eine Verbindungsschicht (6) verbundenen Trägersubstrat (2), wobei das
Produktsubstrat (4) auf einem flexiblen Film (3) aufgenommen ist, der eine Klebeschicht (3s) zur Aufnahme des Produktsubstrats (4) in einem Kontaktierungsflächenabschnitt (3k) des Films (3) aufweist, und wobei der Film (3) in einem den Kontaktierungsflächenabschnitt (3k) umgebenden Befestigungsabschnitt (3b) des Films (3) mit dem Filmrahmen (1) verbunden ist, mit:
- Ablösemitteln zur Ablösung des Produktsubstrats (4) vom Trägersubstrat (2) durch eine auf das Trägersubstrat (2) wirkende Kraft Fs und eine entgegen der Kraft Fs gerichtete, auf den

Filmrahmen (1) wirkenden Kraft Ff.
Weiterhin betrifft die vorliegende Erfindung ein korrespondierendes Verfahren sowie eine Kombination aus einem Trägersubstrat (2) und einem mit dem Trägersubstrat (2) über eine, insbesondere mehrere, vorzugsweise selektiv auflösbare, Verbindungsschicht (6) verbundenen Produktsubstrat (4).

摘要翻译： 该装置具有在一个固定区段的膜框架（1）连接的柔性薄膜 - （3）并围绕的接触表面部分。 电影具有粘合部保留在表面部分中的产物的底物（4）。 甲分离单元通过作用于作用于所述框架相反的作用在载体衬底上的力的载体基底和力（FF1，FF2）力Fs从分离的载体基板（2）的产物的底物。 甲分离部的部分之间设置，并从产品的基材，以所述框架的内周的圆周延伸。 因此独立权利要求中包括了以下内容：一种用于从载体衬底分离的产物的底物（1）的方法（2）的载体基板和产物底物的组合。

公开(公告)号：EP2321848A4

公开(公告)日：2012-11-07

申请号：EP08782947

申请日：2008-08-19

申请人： SILVERBROOK RES PTY LTD

发明人： BURKE DAVID OLIVER ,  WASZCZUK JAN ,  BOYTON DESMOND BRUCE ,  STRUDWICKE CRAIG DONALD ,  SOBEY PETER JOHN MORLEY ,  GRANGER WILLIAM ,  THELANDER JASON MARK ,  O'DONNELL ERIC PATRICK

IPC分类号： H01L21/67 ,  H05K13/04

CPC分类号： H01L21/67144 ,  H01L21/67132 ,  H01L24/75 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/14 ,  H05K13/021

公开(公告)号：EP2469585A3

公开(公告)日：2012-10-03

申请号：EP11010019.5

申请日：2011-12-20

申请人： Hitachi High-Tech Instruments Co., Ltd.

发明人： Imoto, Takuya ,  Iida, Shigeru ,  Izuhara, Koiti

IPC分类号： H05K13/08 ,  H05K13/04 ,  H01L21/67

CPC分类号： H01L21/67144 ,  H01L21/67132 ,  H05K13/0452 ,  H05K13/08

摘要： When the remaining number of pats supplied from all parts supply units is greater than or equal to a predetermined threshold value where parts mounting for loading panels as cells on a mother board is performed or parts are mounted on a divided substrate, an electronic parts mounting apparatus performs a parts attraction-mounting operation in an optimization mode in which the time taken for the parts attraction-mounting operation is minimized over the entire substrate. On the other hand, when the remaining number of parts supplied from any parts supply unit reaches less than a predetermined threshold value, the electronic parts mounting apparatus performs a parts attraction-mounting operation in a sequence mode in which a parts attraction-mounting operation at a given substrate portion is continuously performed from the start thereof to its end. Thus, wastes of panels, a divided substrate and parts at their production are eliminated and production efficiency is improved.

摘要翻译： 当从所有部件供应单元供应的剩余轻拍数量大于或等于预定阈值时，其中执行用于将面板装载为母板上的单元的部件或部件安装在分开的基板上，电子部件安装装置 在优化模式下执行部件吸引安装操作，其中在整个基板上部件吸引安装操作所花费的时间被最小化。 另一方面，当从任何部件供应单元供应的零件的剩余数量达到小于预定阈值时，电子部件安装设备以顺序模式执行部件吸引安装操作，其中在 从其开始到结束连续执行给定的衬底部分。 因此，消除了面板的浪费，分开的基板和其生产部件，并提高了生产效率。

公开(公告)号：EP2368824A4

公开(公告)日：2012-09-05

申请号：EP09834758

申请日：2009-12-17

申请人： FUJI ELECTRIC CO LTD

发明人： YAMADA TAKANORI ,  YOKOYAMA SHOJI ,  FUNO HIDEKAZU ,  TSUKAHARA YUJI

IPC分类号： B65H23/032 ,  B65H23/038 ,  C23C14/56 ,  C23C16/54 ,  H01L21/67 ,  H01L21/677 ,  H01L21/68 ,  H01L31/18

CPC分类号： B65H23/038 ,  B65H23/0322 ,  B65H2301/3113 ,  B65H2301/323 ,  B65H2301/51145 ,  B65H2404/15212 ,  B65H2601/2532 ,  B65H2701/1752 ,  C23C14/562 ,  C23C16/545 ,  H01L21/67132 ,  H01L21/67706 ,  H01L21/67721 ,  H01L21/68 ,  H01L31/1876 ,  Y02E10/50 ,  Y02P70/521

公开(公告)号：EP2192611B9

公开(公告)日：2012-08-15

申请号：EP08791179.8

申请日：2008-07-16

申请人： Furukawa Electric Co., Ltd.

发明人： MARUYAMA, Hiromitsu ,  TAGUCHI, Shuzo ,  SAKUMA, Noboru ,  MORISHIMA, Yasumasa ,  ISHIWATA, Shinichi

IPC分类号： H01L21/683 ,  C09J7/02 ,  H01L21/301 ,  H01L21/67 ,  H01L21/68

CPC分类号： H01L21/67132 ,  C09J7/20 ,  C09J7/40 ,  C09J2203/326 ,  H01L21/6836 ,  H01L2221/68327 ,  Y10T428/1467 ,  Y10T428/28 ,  Y10T428/2878

摘要： The present invention relates to a tape for processing a semiconductor wafer including: a release film having a relatively long length; an adhesive layer formed on a first surface of the release film and having a predetermined plane shape; a pressure-sensitive adhesive film having a label portion having a predetermined plane shape and formed to cover the adhesive layer in such a manner as to be brought into contact with the release film around the adhesive layer and a surrounding portion adapted to surround the outside of the label portion; and a support member formed at the both end portions of the release film in a short direction of the release film, on a second surface of the release film opposite to the first surface of the release film on which the adhesive layer and the pressure-sensitive adhesive film are formed, the support member having a coefficient of linear expansion of 300ppm/°C or less.

公开(公告)号：EP1596422B1

公开(公告)日：2012-08-01

申请号：EP05076097.4

申请日：2005-05-10

申请人： ASM Assembly Automation Ltd.

发明人： Cheung, Yiu Ming ,  Liu, Chou Kee, Peter ,  Yiu, Ching Hong ,  Chong, Chi Ming

IPC分类号： H01L21/00 ,  H01L21/68

CPC分类号： H01L21/6838 ,  H01L21/67132 ,  H01L21/67144 ,  H01L2221/68322 ,  Y10S156/943 ,  Y10T29/4913 ,  Y10T29/49815 ,  Y10T29/53091 ,  Y10T29/53191 ,  Y10T29/53274 ,  Y10T156/1978 ,  Y10T156/1983

公开(公告)号：EP2469585A2

公开(公告)日：2012-06-27

申请号：EP11010019.5

申请日：2011-12-20

申请人： Hitachi High-Tech Instruments Co., Ltd.

发明人： Imoto, Takuya ,  Iida, Shigeru ,  Izuhara, Koiti

IPC分类号： H01L21/67

CPC分类号： H01L21/67144 ,  H01L21/67132 ,  H05K13/0452 ,  H05K13/08

摘要： When the remaining number of pats supplied from all parts supply units is greater than or equal to a predetermined threshold value where parts mounting for loading panels as cells on a mother board is performed or parts are mounted on a divided substrate, an electronic parts mounting apparatus performs a parts attraction-mounting operation in an optimization mode in which the time taken for the parts attraction-mounting operation is minimized over the entire substrate. On the other hand, when the remaining number of parts supplied from any parts supply unit reaches less than a predetermined threshold value, the electronic parts mounting apparatus performs a parts attraction-mounting operation in a sequence mode in which a parts attraction-mounting operation at a given substrate portion is continuously performed from the start thereof to its end. Thus, wastes of panels, a divided substrate and parts at their production are eliminated and production efficiency is improved.

摘要翻译： 当从所有部件供应单元供应的剩余数量大于或等于预定阈值时，其中执行将用于装载面板作为单元的部件安装在母板上的部件或部件安装在分割的基板上，电子部件安装设备 在优化模式中执行部件吸引安装操作，其中部件吸引安装操作所花费的时间在整个基板上被最小化。 另一方面，当从任何部件供给单元供给的剩余零件数量达到小于预定阈值时，电子部件安装装置以顺序模式执行部件吸引安装操作，其中在 从一开始就连续进行给定的基板部分的结束。 因此，消除了板，分开的基板和其生产部件的废物，并提高了生产效率。

公开(公告)号：EP2102902B1

公开(公告)日：2012-04-25

申请号：EP07847737.9

申请日：2007-12-04

申请人： Robert Bosch GmbH

发明人： STOPPEL, Klaus

IPC分类号： H01L21/683 ,  H01L21/687 ,  H01L21/67

CPC分类号： H01L21/6838 ,  H01L21/67132 ,  H01L21/67144 ,  H01L2224/75304 ,  H01L2924/01068 ,  Y10T29/53191

摘要： The invention relates to a handling tool (1) for components (2), in particular electronic components (2), having a holding opening (18), to which reduced pressure (PU) can be applied and at which components to be handled can be held by reduced pressure (PU). It is provided that at least one counter-holding device (8) which projects outwards beyond the opening plane (20) in an operating position is arranged in the holding opening (18). The invention furthermore relates to a method for handling components, in particular electronic components, comprising the following steps: - sucking up a component by reduced pressure and holding the component by the reduced pressure; - supporting the component held by reduced pressure in the region of its area to which reduced pressure is applied, in such a way that said area, in particular the component, flexes concavely as seen from the reduced pressure side.