公开(公告)号：EP4386851A1

公开(公告)日：2024-06-19

申请号：EP23200754.2

申请日：2023-09-29

申请人： INTEL Corporation

发明人： JUN, Hwichan

IPC分类号： H01L29/06 ,  H01L29/08 ,  H01L29/417 ,  H01L29/423 ,  H01L29/66 ,  H01L29/775 ,  H01L29/10 ,  H01L29/161

CPC分类号： H01L29/0847 ,  H01L29/0673 ,  H01L29/41725 ,  H01L29/161 ,  B82Y10/00 ,  H01L29/66439 ,  H01L29/775 ,  H01L29/1079 ,  H01L29/42392 ,  H01L29/66545 ,  H01L21/28518

摘要： Techniques are provided herein to form semiconductor devices having one or more epitaxial source or drain regions wrapped by a conductive contact to form an improved ohmic contact. A first semiconductor device includes a first semiconductor region extending between a first source or drain region and a second source or drain region, and a second semiconductor device includes a second semiconductor region extending between the first source or drain region and a third source or drain region. The first and second semiconductor devices include a subfin region adjacent to a dielectric layer. A conductive layer extends around the first source or drain region such that the conductive layer at least contacts the sidewalls of the first source or drain region and both upper and lower surfaces of the source or drain region. A dielectric layer is also present between the conductive contact and the subfin region.

公开(公告)号：EP4386827A1

公开(公告)日：2024-06-19

申请号：EP23199562.2

申请日：2023-09-25

申请人： INTEL Corporation

发明人： DUAN, Gang ,  MANEPALLI, Rahul ,  PIETAMBARAM, Srinivas ,  MARIN, Brandon ,  NAD, Suddhasattwa ,  ECTON, Jeremy

IPC分类号： H01L23/00 ,  H01L25/065 ,  H01L25/00

CPC分类号： H01L24/19 ,  H01L24/20 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/50 ,  H01L24/16 ,  H01L24/17

摘要： An integrated circuit (IC) package comprises a first IC die having first metallization features, a second IC die having second metallization features, and a third IC die having third metallization features. A glass layer is between the third IC die and both of the first IC die and the second IC die. A plurality of first through vias extend through the glass layer, coupling the third metallization features with first ones of the first metallization features and with first ones of the second metallization features. A plurality of second through vias extend through the glass layer. A dielectric material is around the third die and a package metallization is within the dielectric material. The package metallization is coupled to at least one of the first, second, or third IC die, and terminating at a plurality of package interconnect interfaces.

公开(公告)号：EP4095696B1

公开(公告)日：2024-06-19

申请号：EP20934264.1

申请日：2020-11-02

IPC分类号： G06F11/30 ,  G06F13/40

CPC分类号： G06F13/4072 ,  G06F11/3027

公开(公告)号：EP4340023A3

公开(公告)日：2024-06-12

申请号：EP23220590.6

申请日：2020-02-03

申请人： INTEL Corporation

发明人： MAHAJAN, Ravindranath Vithal ,  MALLIK, Debendra ,  SHARAN, Sujit ,  RAORANE, Digvijay

IPC分类号： H01L23/38 ,  H01L23/538

CPC分类号： H01L23/5389 ,  H01L23/38 ,  H01L23/49827 ,  H01L23/49816 ,  H01L23/49811 ,  H01L25/0652 ,  H01L2225/0651720130101 ,  H01L2225/0654820130101 ,  H01L2225/0657220130101 ,  H01L2225/0652720130101 ,  H01L2225/0655520130101 ,  H01L2225/0654120130101 ,  H01L2225/0651320130101 ,  H01L25/18 ,  H01L2224/8120320130101 ,  H01L2224/8181520130101 ,  H01L2224/7320420130101 ,  H01L2224/1626520130101 ,  H01L2224/1718120130101 ,  H01L2924/1015820130101 ,  H01L2224/1623820130101 ,  H01L2924/1515320130101 ,  H01L2924/1816120130101 ,  H01L24/16 ,  H01L2224/1614520130101 ,  H01L2224/13120130101 ,  H01L2224/1302520130101 ,  H01L23/147 ,  H01L21/486 ,  H01L23/5385

摘要： Embodiments disclosed herein include electronic packages and methods of forming such electronic packages. In an embodiment, the electronic package comprises a base substrate. The base substrate may have a plurality of through substrate vias. In an embodiment, a first die is over the base substrate. In an embodiment a first cavity is disposed into the base substrate. In an embodiment, the first cavity is at least partially within a footprint of the first die. In an embodiment, a first component is in the first cavity.

公开(公告)号：EP3893478B1

公开(公告)日：2024-06-12

申请号：EP21172033.9

申请日：2014-05-05

IPC分类号： H04M11/06 ,  H04B3/32

CPC分类号： H04M11/062 ,  H04W76/28 ,  H04B3/32

公开(公告)号：EP3918376B1

公开(公告)日：2024-06-05

申请号：EP19835427.6

申请日：2019-12-30

IPC分类号： G01V1/38

CPC分类号： G01V1/3843

公开(公告)号：EP4373134A1

公开(公告)日：2024-05-22

申请号：EP22841676.4

申请日：2022-03-02

申请人： Sony Group Corporation

发明人： OSAKO, Keiichi ,  MATSUI, Takeshi ,  HAYASHI, Hiroaki ,  FUKUI, Takao

IPC分类号： H04R3/04 ,  H03G5/16

CPC分类号： H04R3/04 ,  H03G5/16

摘要： For example, it becomes possible to suppress an increase in hardware scale and costs and to perform signal processing according to an input signal.
Provided is an information processing apparatus including a filter processing unit that performs filtering on an input signal, and a filter setting unit that makes a setting of the filtering such that a sound of a target audio source type in the input signal is controlled and the setting is determined using an estimation result obtained from the input signal by an estimation algorithm.

公开(公告)号：EP4373079A1

公开(公告)日：2024-05-22

申请号：EP22208534.2

申请日：2022-11-21

申请人： Leica Instruments (Singapore) Pte Ltd

发明人： HENDARGO, Hansford ,  YANG, Gao

IPC分类号： H04N13/183 ,  G06T11/60 ,  H04N13/271 ,  H04N13/00

CPC分类号： H04N13/183 ,  G06T11/60 ,  H04N13/271 ,  H04N2013/009220130101

摘要： Examples relate to a system, to a method and to a computer program for an optical imaging system, such as a microscope, and to an optical imaging system comprising such a system. The system is configured to obtain stereoscopic image data of a scene from a stereoscopic imaging device of the optical imaging system. The system is configured to determine depth information on at least a portion of the scene. The system is configured to determine a scaling factor of an information overlay to be overlaid over the stereoscopic image data based on the depth information. The system is configured to generate a stereoscopic composite view of the stereoscopic image data and the information overlay, with the information overlay being scaled according to the scaling factor. The system is configured to provide a display signal comprising the stereoscopic composite view to a stereoscopic display device.

公开(公告)号：EP3835962B1

公开(公告)日：2024-05-15

申请号：EP19847211.0

申请日：2019-07-26

IPC分类号： H04L67/12

CPC分类号： H04Q9/00 ,  H04L67/12

公开(公告)号：EP4365897A1

公开(公告)日：2024-05-08

申请号：EP22832403.4

申请日：2022-02-09

申请人： Sony Group Corporation

发明人： OSAKO, Keiichi ,  MITSUFUJI, Yuhki ,  SAWATA, Ryosuke

IPC分类号： G10L21/0272 ,  G10L25/30

CPC分类号： G10L25/30 ,  G10L21/0272

摘要： For example, the number of operations is reduced without a deterioration in sound source separation performance.
A program according to the present disclosure causes a computer to execute an information processing method, the information processing method including generating, by a neural network unit, sound source separation information for separating a predetermined sound source signal from a mixed sound signal containing a plurality of sound source signals, transforming, by an encoder included in the neural network unit, a feature extracted from the mixed sound signal, inputting a process result from the encoder to each of a plurality of sub-neural network units included in the neural network unit, and inputting the process result from the encoder and a process result from each of the plurality of sub-neural network units to a decoder included in the neural network unit.