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公开(公告)号：EP3089844B1
公开(公告)日：2020-02-05
申请号：EP14877119.9
申请日：2014-12-31
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公开(公告)号：EP3172739B1
公开(公告)日：2020-01-08
申请号：EP15738743.2
申请日：2015-07-14
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公开(公告)号：EP3449023A1
公开(公告)日：2019-03-06
申请号：EP17793110.2
申请日：2017-05-02
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公开(公告)号：EP2064000B1
公开(公告)日：2018-01-17
申请号：EP07842796.0
申请日：2007-09-19
CPC分类号： C09D11/52 , C09D11/30 , H05K1/097 , H05K2203/122
摘要： Solvent systems and dispersions including such solvent systems for use in compositions including metals and inks are provided. In certain examples, the solvent systems may be used with capped metal particles to provide a dispersion that may be used to print conductive lines.
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公开(公告)号：EP3234988A1
公开(公告)日：2017-10-25
申请号：EP15870960.0
申请日：2015-12-16
发明人： KHASELEV, Oscar , BOSCHMAN, Eef
IPC分类号： H01L21/324
CPC分类号： H01L24/84 , H01L21/4825 , H01L23/49524 , H01L23/49582 , H01L24/29 , H01L24/32 , H01L24/37 , H01L24/40 , H01L24/73 , H01L24/83 , H01L24/92 , H01L24/97 , H01L2224/29139 , H01L2224/29339 , H01L2224/32245 , H01L2224/37012 , H01L2224/37013 , H01L2224/40105 , H01L2224/40245 , H01L2224/40499 , H01L2224/73213 , H01L2224/73263 , H01L2224/83001 , H01L2224/83191 , H01L2224/83192 , H01L2224/83203 , H01L2224/83439 , H01L2224/83447 , H01L2224/8384 , H01L2224/83907 , H01L2224/83986 , H01L2224/84001 , H01L2224/84203 , H01L2224/8484 , H01L2224/84986 , H01L2224/9205 , H01L2224/9221 , H01L2224/97 , H01L2924/00014 , H01L2224/83 , H01L2924/00012 , H01L2224/84 , H01L2924/01047
摘要： A method of die and clip attachment includes providing a clip, a die and a substrate, laminating a sinterable silver film on the clip and the die, depositing a tack agent on the substrate, placing the die on the substrate, placing the clip on the die and the substrate to create a substrate, die and clip package, lead and sintering the substrate, die and clip package.
摘要翻译： 一种模具和夹子附着的方法包括提供夹子，模子和基底，在夹子和模子上层压可烧结银膜，在基底上沉积粘性剂，将模子放置在基底上，将夹子放置在 管芯和基板以形成基板，管芯和夹子封装，并烧结基板，管芯和夹子封装。
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公开(公告)号：EP3172739A1
公开(公告)日：2017-05-31
申请号：EP15738743.2
申请日：2015-07-14
摘要： A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.
摘要翻译： 一种导电浆料，其包含分散在有机介质中的导电颗粒，所述有机介质包含溶剂; 和包含聚酯的粘合剂。
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公开(公告)号：EP2773484B1
公开(公告)日：2017-05-24
申请号：EP13777315.6
申请日：2013-10-09
发明人： CHOUDHURY, Pritha , DE AVILA RIBAS, Morgana , MUKHERJEE, Sutapa , KUMAR, Anil , SARKAR, Siuli , PANDHER, Ranjit , BHATKAL, Ravi , SINGH, Bawa
CPC分类号： B23K35/262 , B23K1/00 , B23K1/0016 , B23K1/002 , B23K1/0056 , B23K1/012 , B23K1/085 , B23K1/19 , B23K1/203 , B23K35/0222 , B23K35/0227 , B23K35/0233 , B23K35/0244 , B23K35/025 , B23K2203/12 , C22C13/00 , C22C13/02 , H05K3/3457 , H05K3/3463 , Y10T403/479
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公开(公告)号：EP4449507A2
公开(公告)日：2024-10-23
申请号：EP22840560.1
申请日：2022-12-09
发明人： PUJARI, Narahari , KRITHIKA, P M , SARKAR, Siuli
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公开(公告)号：EP3973578A1
公开(公告)日：2022-03-30
申请号：EP20730385.0
申请日：2020-05-22
发明人： PUJARI, Narahari , SARKAR, Siuli , BILGRIEN, Carl
IPC分类号： H01L31/05
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公开(公告)号：EP3902654A1
公开(公告)日：2021-11-03
申请号：EP19832837.9
申请日：2019-12-26
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