Abstract:
The micro-electro-mechanical device (20) is formed in a first wafer (40) overlying and bonded to a second wafer (70). A fixed part (91), a movable part (92), and elastic elements, elastically coupling the movable part and the fixed part, are formed in the first wafer. The movable part carries actuation elements (60) configured to control a relative movement, such as a rotation, of the movable part with respect to the fixed part. The second wafer is bonded to the first wafer through projections (66) of the first wafer, formed by selectively removing part of a semiconductor layer (43). The composite wafer formed by the first and second wafers is cut to form a plurality of MEMS devices.
Abstract:
Provided is a polymer actuator element that can maintain satisfactory durability and has a great displacement amount or a great generating force, and excellent responsiveness. A polymer actuator element 1 includes an electrolyte layer 2 and electrode layers 3 and 4, in which the electrode layers 3 and 4 include an activated carbon nanofiber and a carbon nanohorn.
Abstract:
A light deflector (2, 30) is provided including a mirror unit (4) having a light reflection plane, a movable frame (6) to support the mirror unit (4), a support frame (8) disposed to surround the movable frame (6), and a pair of serpentine beams (10, 12). In the light deflector (2, 30), the serpentine beam has one end attached to the support frame (8), and another end attached to the movable frame (6), the mirror unit (4) oscillates as deformation of the serpentine beams (10, 12) caused by application of voltage is transferred to the mirror unit (4) through the movable frame (6), and a portion that moves due to the deformation of the serpentine beams (10, 12) is provided with a vibration damper (16) which reduces vibration for the mirror unit (4).
Abstract:
A micro or nano electromechanical transducer device (200) formed on a semiconductor substrate (210) comprises a movable structure (203) which is arranged to be movable in response to actuation of an actuating structure. First (206) and second (207) compensation layers are arranged to compensate a thermal effect produced by the different first and second thermal response characteristics of the mechanical structure and the at least one layer (202) of the actuating structure such that movement of the movable structure (203) is substantially independent of variations in temperature and to adjust a stress effect produced by the different first and second stress response characteristics of the mechanical structure and the at least one layer (202) of the actuating structure such that the movable structure is deflected a predetermined amount relative to the substrate when the electromechanical transducer device (200) is in an inactive state.
Abstract:
A micro or nano electromechanical transducer device (200) formed on a semiconductor substrate comprises a movable structure (203) which is arranged to be movable in response to actuation of an actuating structure. The movable structure comprises a mechanical structure having at least one mechanical layer (204) having a first thermal response characteristic, at least one layer (202) of the actuating structure having a second thermal response characteristic different to the first thermal response characteristic, and a thermal compensation structure having at least one thermal compensation layer (206). The thermal compensation layer is different to the at least one layer (202) and is arranged to compensate a thermal effect produced by the mechanical layer and the at least one layer of the actuating structure such that the movement of the movable structure is substantially independent of variations in temperature.
Abstract:
A display apparatus comprises a modulator for selectively interacting with light in an optical path to form an image on the display apparatus. A controllable first electrostatic actuator provides a first mechanical support for the modulator, the first mechanical support providing a supportive connection from a first location on the modulator to a surface over which the modulator is supported. A second mechanical support provides a supportive connection from a second location on the modulator to the surface. The first electrostatic actuator drives the modulator in a plane substantially parallel to the surface.
Abstract:
A thermal isolation structure for use in passively regulating the temperature of a microdevice is disclosed. The thermal isolation structure can include a substrate wafer and a cap wafer defining an interior cavity, and a number of double-ended or single-ended thermal bimorphs coupled to the substrate wafer and thermally actustable between an initial position and a deformed position. The thermal bimorphs can be configured to deform and make contact with the cap wafer at different temperatures, creating various thermal shorts depending on the temperature of the substrate wafer. When attached to a microdevice such as a MEMS device, the thermal isolation structure can be configured to maintain the attached device at a constant temperature or within a particular temperature range.