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    Procede de realisation de motifs resonnants adaptes a la realisation de fonctions passives RF
    32.
    发明公开
    Procede de realisation de motifs resonnants adaptes a la realisation de fonctions passives RF 审中-公开
    共振设计方案，这是适合于生产的无源RF功能的制造方法

    公开(公告)号：EP2744311A1

    公开(公告)日：2014-06-18

    申请号：EP13196272.2

    申请日：2013-12-09

    Applicant: Thales

    Inventor： Guern, Pierre

    IPC: H05K1/16 ,  H01L23/64 ,  H01L23/66 ,  H05K3/00

    CPC classification number: H05K3/4038 ,  H01L2924/0002 ,  H05K1/16 ,  H05K1/165 ,  H05K3/0044 ,  H05K2201/09063 ,  H05K2203/0228 ,  Y10T29/49155 ,  H01L2924/00

    Abstract: Procédé pour réaliser un ou plusieurs motifs résonants (10) radio fréquence sur un circuit imprimé (11) caractérisé en ce qu'il comporte une étape de découpe d'un ou de plusieurs motifs résonants (10) directement dans le circuit imprimé (11) tout en conservant des moyens de maintien mécanique (13) des motifs résonnants audit circuit imprimé (11).
    Application à la réalisation de filtres

    Abstract translation: 该方法包括在印刷电路（11），即切割谐振图案（10）直接 多层印刷电路中，并维持由谐振图案的凸榫（13）而形成在印刷电路，其中，所述多层印刷电路内层是化学蚀刻和加压的机械支撑单元。 用于金属化通孔形成。 印刷电路的外部层是化学蚀刻。 因此独立claimsoft被包括用于在印刷电路上制造射频谐振模式的方法。

    ANORDNUNG ZUM KÜHLEN VON BAUGRUPPEN EINES AUTOMATISIERUNGS- ODER STEUERUNGSSYSTEMS
    34.
    发明公开
    ANORDNUNG ZUM KÜHLEN VON BAUGRUPPEN EINES AUTOMATISIERUNGS- ODER STEUERUNGSSYSTEMS 审中-公开
    安排自动化和控制系统的散热组件

    公开(公告)号：EP2730153A1

    公开(公告)日：2014-05-14

    申请号：EP12735785.3

    申请日：2012-07-05

    Applicant: ABB AG

    Inventor： GUTERMUTH, Stefan

    IPC: H05K1/02

    CPC classification number: H05K1/021 ,  H05K1/0201 ,  H05K1/0203 ,  H05K2201/062 ,  H05K2201/09063 ,  H05K2201/09972

    Abstract: The invention relates to an arrangement for cooling subassemblies of an automation or control system, wherein the subassemblies each comprise at least one printed circuit board (LP) having electronic components (5, 6, 7, 8) of different temperature sensitivity arranged thereon. The printed circuit board (LP) has at least one first portion for temperature-sensitive components (6 8) and at least one second portion for temperature-insensitive components that generate waste heat. Interspaces are arranged between the first portion and the second portion, the interspaces each forming a thermally insulated trench. Furthermore, means are provided which keep away the heat over the temperature-sensitive components (6, 8) in a suitable manner and dissipate the waste heat from the printed circuit board (LP) before said heat reaches the temperature-sensitive components (6, 8).

    Connecting structure between circuit boards and battery pack having the same
    35.
    发明公开
    Connecting structure between circuit boards and battery pack having the same 审中-公开
    Verbindungsstrukur zwischen Leiterplatten und Batteriepack damit

    公开(公告)号：EP2728981A2

    公开(公告)日：2014-05-07

    申请号：EP13163000.6

    申请日：2013-04-09

    Applicant: Samsung SDI Co., Ltd.

    Inventor： Shin, Kyungjae ,  Kim, Kiwoong

    IPC: H05K3/36 ,  H05K3/32

    CPC classification number: H01M10/425 ,  H01R43/0256 ,  H05K1/118 ,  H05K3/323 ,  H05K3/363 ,  H05K2201/09063 ,  Y10T29/49213

    Abstract: Connecting structure between circuit boards, comprising a first circuit board (200) having at least one first circuit pattern, a second circuit board (300) having at least one second circuit pattern (320) electrically connected to the first circuit pattern (220) of the first circuit board (200), and a conductive connecting member (400) interposed between the first circuit pattern (220) and the second circuit pattern (320), wherein the first circuit pattern (220) has a first surface making a contact with the conductive connecting member (400) and a second surface attached to a first base insulating layer (210) in the first circuit board (200), and at least one hole (211) is formed in a region of the first base insulating layer (210) corresponding to the first circuit pattern (220), said at least one hole being closed at one end by the second surface of the first circuit pattern (220) and opened to the exterior at the opposite end.
    A battery pack having such a structure and a method for making it are also provided.

    Abstract translation: 电路板之间的连接结构，包括具有至少一个第一电路图案的第一电路板（200），具有至少一个电连接到第一电路图案（220）的第二电路图案（320）的第二电路板（300） 第一电路板（200）和介于第一电路图案（220）和第二电路图案（320）之间的导电连接构件（400），其中第一电路图案（220）具有与 所述导电连接构件（400）和附接到所述第一电路板（200）中的第一基底绝缘层（210）的第二表面，以及在所述第一基底绝缘层（102）的区域中形成至少一个孔（211） 210），所述至少一个孔在一端被第一电路图案（220）的第二表面封闭，并在相对端向外开放。 还提供了具有这种结构的电池组及其制造方法。

    LIGHT
    36.
    发明公开
    LIGHT 有权
    光

    公开(公告)号：EP2711605A1

    公开(公告)日：2014-03-26

    申请号：EP12789149.7

    申请日：2012-01-31

    Applicant: Panasonic Corporation

    Inventor： UEDA, Yasuhisa ,  KAWABATA, Kazuhiro ,  MIKI, Masahiro ,  UEMOTO, Takaari

    IPC: F21S2/00 ,  F21V23/00 ,  F21Y101/02

    CPC classification number: F21K9/1355 ,  F21K9/23 ,  F21K9/238 ,  F21K9/27 ,  F21K9/60 ,  F21K9/65 ,  F21V3/00 ,  F21V23/001 ,  F21V23/002 ,  F21V23/02 ,  F21Y2103/10 ,  F21Y2115/10 ,  H05K3/3447 ,  H05K2201/09063 ,  H05K2201/10106 ,  H05K2201/10287 ,  H05K2201/10492 ,  H05K2201/10962

    Abstract: A lamp (1) includes an LED module (20), a drive unit (80) supplying power to the LED module (20), and a base (30) via which power is fed from an external power supply to the drive unit (80). The drive unit (80) is located between the LED module (20) and the base (30). The drive unit (80) includes a circuit board (80a) having a main surface on which lead-type electronic components (80b) are mounted, lead wires (first lead wires) (70a, 70b) extending from the main surface of the circuit board (80a) and connected to the LED module (20), and lead wires (second lead wires) (71a, 71b) extending from the main surface of the circuit board (80a) and connected to the base (30). The circuit board (80a) has a through-hole (80a1) extending from the main surface to an opposite surface thereof. The lead wires (70a, 70b) pass through the through-hole (80a1).

    Abstract translation: 灯（1）包括LED模块（20），向LED模块（20）供电的驱动单元（80）和基座（30），通过该基座（30）将电力从外部电源馈送到驱动单元 80）。 驱动单元（80）位于LED模块（20）和基座（30）之间。 驱动单元（80）包括：电路板（80a），其具有其上安装有引线型电子部件（80b）的主表面;引线（第一引线）（70a，70b），其从电路的主表面 （80a），与LED模块（20）连接;以及引线（第二引线）（71a，71b），从电路基板（80a）的主面延伸并与基座（30）连接。 电路板（80a）具有从主表面延伸到其相反表面的通孔（80a1）。 引线（70a，70b）穿过通孔（80a1）。

    System for mechanical and electronic protection of safe equipment
    39.
    发明公开
    System for mechanical and electronic protection of safe equipment 审中-公开
    系统zum mechanischen und elektronischen Schutz von sichererAusrüstung

    公开(公告)号：EP2661158A1

    公开(公告)日：2013-11-06

    申请号：EP13002161.1

    申请日：2013-04-24

    Applicant: Tecvan Informática LTDA.

    Inventor： Pereira, Jorge Ribeiro

    IPC: H05K1/02 ,  H05K1/14

    CPC classification number: G06F21/554 ,  G06F21/87 ,  H05K1/0275 ,  H05K1/144 ,  H05K2201/041 ,  H05K2201/09063 ,  H05K2201/09681

    Abstract: To avoid an action to attempt to invade or violate Safe Equipment, it is suggested the implementation of a region completely surrounded by mechanical positioning of electronic circuits, mounted on rigid printed circuit boards or flexible circuits protection circuits and sensors with alarm devices, so that an invasion action will trigger the alarm, which will turn off the security keys and locks the Safe Equipment, disabling any action and preventing confidential data from being accessed; so, the security of information is enhanced by placing protection circuits mounted so that the mechanical arrangement of the parts of the equipment is considered to create a completely protected region, surrounded on all sides so that the access to this internal part is impossible.

    Abstract translation: 为了避免企图入侵或违反安全设备的行为，建议将电子电路的机械定位完全包围的区域的实施，安装在刚性印刷电路板或柔性电路保护电路和具有报警装置的传感器上，使得 入侵行动将触发警报，这将关闭安全密钥并锁定安全设备，禁用任何操作并防止机密数据被访问; 因此，通过安装保护电路来增强信息的安全性，使得设备的部件的机械布置被认为创建完全保护的区域，被包围在所有方面，使得不可能访问该内部部件。

    SINGLE BOARD AND COMMUNICATION EQUIPMENT
    40.
    发明公开
    SINGLE BOARD AND COMMUNICATION EQUIPMENT 审中-公开
    EINZELPLATINE UND KOMMUNIKATIONSVORRICHTUNG

    公开(公告)号：EP2661157A1

    公开(公告)日：2013-11-06

    申请号：EP11859163.5

    申请日：2011-09-22

    Applicant: Huawei Technologies Co., Ltd.

    Inventor： LI, Yutao ,  SHU, Qi

    IPC: H05K1/02 ,  H05K1/18 ,  H05K5/03 ,  H05K7/08

    CPC classification number: H05K1/182 ,  H05K1/18 ,  H05K7/1487 ,  H05K2201/09063 ,  H05K2201/10189 ,  H05K2201/10446

    Abstract: Embodiments of the present invention provide a board and a communication device, where the board includes a printed circuit board PCB, a side of the printed circuit board PCB is set with a dent, a bottom of the dent is set with a connector, the side of the PCB is further set with a panel, the panel shrinks into a groove at a position corresponding to the connector, so as to make the groove be embedded into the dent, and a bottom of the groove and an interface of the connector are correspondingly opened with a through hole. In the embodiments of the present invention, the PCB forms the dent at a position where the connector is set, the panel shrinks into the groove at the position corresponding to the connector, and the bottom of the groove and the interface of the connector are correspondingly opened with the through hole, which can avoid a problem of decrease in depth of the PCB and layout space for components on the PCB caused by a long RJ45 connector and plastic jacket of a cable and a large diameter and bend radius of the cable, thereby improving an integration level of the PCB.

    Abstract translation: 本发明的实施例提供了一种板和通信装置，其中板包括印刷电路板PCB，印刷电路板PCB的一侧设置有凹陷，凹陷的底部设置有连接器，侧面 PCB进一步设置有面板，面板在对应于连接器的位置处收缩成凹槽，以使凹槽嵌入凹部中，并且凹槽的底部和连接器的界面相应地 用通孔打开。 在本发明的实施例中，PCB在连接器被设置的位置处形成凹陷，面板在与连接器相对应的位置处收缩到凹槽中，并且凹槽的底部和连接器的接口相应地 用通孔打开，这可以避免PCB的深度减小和PCB上部件的布局空间的问题，由长的RJ45连接器和电缆的塑料护​​套以及电缆的大直径和弯曲半径引起，从而 提高PCB的集成度。

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