公开(公告)号：EP3195704A1

公开(公告)日：2017-07-26

申请号：EP15747797.7

申请日：2015-08-04

Applicant: AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

Inventor： KREUTZWIESNER, Elisabeth ,  SCHULZ, Gernot

IPC: H05K1/02 ,  H05K3/46

CPC classification number: H05K1/0271 ,  H05K1/0207 ,  H05K3/12 ,  H05K3/146 ,  H05K3/16 ,  H05K3/4602 ,  H05K3/4608 ,  H05K3/4688 ,  H05K2201/0195 ,  H05K2201/0323 ,  H05K2201/068 ,  H05K2201/09136

Abstract: A mounting device for mounting electronic components, wherein the mounting device comprises an electrically conductive structure having a first value of thermal expansion in at least one pre-defined spatial direction, an electrically insulating structure having a second value of thermal expansion in the at least one pre-defined spatial direction being different from the first value and being arranged on the electrically conductive structure, and a thermal expansion adjustment structure having a third value of thermal expansion in the at least one pre-defined spatial direction, wherein the third value is selected and the thermal expansion adjustment structure is located so that thermally induced warpage of the mounting device resulting from a difference between the first value and the second value is at least partially compensated by the thermal expansion adjustment structure.

Abstract translation: 1。一种用于安装电子部件的安装装置（100），其中所述安装装置（100）包括在至少一个预定空间方向上具有第一热膨胀值的导电结构（102），电绝缘结构（104） 在所述至少一个预定义的空间方向上具有第二热膨胀值，所述第二热膨胀值不同于所述第一值并且尤其小于所述第一值并且被布置在所述导电结构（102）上;以及热膨胀调节结构（106） ，特别是在所述导电结构（102）中和/或之上，在所述至少一个预定空间方向上具有第三热膨胀值，其中选择所述第三值并且所述热膨胀调节结构（106）为 其位置使得由所述第一值与所述第二值之间的差引起的所述安装装置（100）的热诱导翘曲至少部分地由所述第 不适当的膨胀调节结构（106）。

公开(公告)号：EP3157606A1

公开(公告)日：2017-04-26

申请号：EP15809576.0

申请日：2015-06-17

Applicant: Cathprint AB

Inventor： KÄLLBÄCK, Bengt ,  BAGAIAN, Tiberiu ,  ROKOSCH, Tobias

IPC: A61M25/00 ,  G01L7/00 ,  H05K1/02

CPC classification number: A61M25/00 ,  A61B5/0215 ,  A61B5/6852 ,  A61B2562/166 ,  A61M2025/0002 ,  G01L19/06 ,  G01L19/147 ,  G01L19/148 ,  G01L19/149 ,  H05K1/189 ,  H05K3/28 ,  H05K2201/0162 ,  H05K2201/09136 ,  H05K2201/10151 ,  H05K2201/2009

Abstract: The invention relates to a conductor assembly comprising a resilient tubular outer casing (1) with a flexible printed circuit board (6) in the outer casing's interior. On the circuit board a sensor (3) is arranged. A cavity (8a-c) in the outer casing adjacent to the sensor is filled with a rigid filling material (9). Where the rigid filling material extends in the lengthwise direction of the tubular outer casing (1) at least from one side of the sensor to the opposite side of the sensor. This means that the sensor will not be affected when the conductor assembly is bent or otherwise affected mechanically. The conductor assembly's outer casing (1) comprises an opening (7a-c) to a cavity (8a-c) in the outer casing in connection to the sensor, through which a filling material can be supplied in liquid form. Typically the conductor assembly includes two cavities (8a-b) in the outer casing on the side of the flexible circuit board (6) where the sensor is mounted, the two cavities being on either side of the sensor, and a third cavity (8c) in the outer casing on the side of the flexible circuit board (6) which is opposite to the sensor. In an advantageous embodiment the extension of at least one cavity (8a-c) in the outer casing is limited by bumps (4a-f) on either side of the cavity thus defining the cavity. Injected filler material propagation is governed by these bumps to the relevant space. Typically, the conductor assembly is a catheter or part of a catheter.

Abstract translation: 本发明涉及一种导体组件，该导体组件包括在外壳内部具有柔性印刷电路板（6）的弹性管状外壳（1）。 在电路板上布置传感器（3）。 与传感器相邻的外壳中的空腔（8a-c）填充有刚性填充材料（9）。 在刚性填充材料沿管状外壳（1）的纵向方向至少从传感器的一侧延伸到传感器的相对侧的情况下。 这意味着当导体组件弯曲或受到机械影响时，传感器不会受到影响。 导体组件的外壳（1）包括与外壳中的空腔（8a-c）连接的传感器的开口（7a-c），通过该开口可以以液体形式供应填充材料。 典型地，导体组件在柔性电路板（6）的安装有传感器的一侧上的外壳中包括两个空腔（8a-b），两个空腔位于传感器的任一侧，第三空腔（8c ）位于柔性电路板（6）的与传感器相对的一侧上的外壳中。 在有利的实施例中，外壳中的至少一个空腔（8a-c）的延伸由空腔任一侧上的凸块（4a-f）限制，从而限定了空腔。 注入填充材料的传播是由这些颠簸所控制的相关空间。 通常，导体组件是导管或导管的一部分。

公开(公告)号：EP3094162A1

公开(公告)日：2016-11-16

申请号：EP15735428.3

申请日：2015-01-06

Applicant: Mitsubishi Gas Chemical Company, Inc.

Inventor： TOMIZAWA, Katsuya ,  CHIBA, Tomo ,  ITO, Meguru ,  SHIGA, Eisuke

IPC: H05K1/03 ,  B32B15/08 ,  C08J5/24 ,  H01B3/00 ,  H01B17/56

CPC classification number: H05K1/0271 ,  B32B15/08 ,  C08J5/043 ,  C08J5/24 ,  C08J2379/08 ,  C08J2465/00 ,  C08J2479/04 ,  H05K1/0298 ,  H05K1/036 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/0393 ,  H05K3/022 ,  H05K3/4644 ,  H05K2201/0355 ,  H05K2201/09136

Abstract: The present invention provides an insulating layer for printed circuit boards having a difference of within 20% between the flexural modulus at 25°C and the flexural modulus under heat at 250°C.

Abstract translation: 本发明提供了一种用于印刷电路板的绝缘层，其在25℃下的弯曲模量与在250℃的加热下的挠曲模量之间的差异在20％以内。

公开(公告)号：EP2940727A1

公开(公告)日：2015-11-04

申请号：EP13866760.5

申请日：2013-12-20

Applicant: Mitsubishi Materials Corporation

Inventor： NISHIMOTO, Shuji ,  NAGATOMO, Yoshiyuki

IPC: H01L23/36 ,  H01L23/40 ,  H05K1/02

CPC classification number: H05K1/0271 ,  C04B37/021 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/402 ,  C04B2237/407 ,  C04B2237/86 ,  H01L23/3735 ,  H01L23/42 ,  H01L23/473 ,  H01L2224/32225 ,  H05K1/0203 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/09 ,  H05K3/0061 ,  H05K3/248 ,  H05K3/32 ,  H05K3/465 ,  H05K7/14 ,  H05K2201/066 ,  H05K2201/09136

Abstract: A power module substrate includes an insulating layer (11), a circuit layer (12) that is formed on a first surface of the insulating layer, and a metal layer (13) that is formed on a second surface of the insulating layer, in which a first base layer (20) is laminated on a surface of the metal layer on the opposite side of the surface to which the insulating layer is provided, and the first base layer has: a first glass layer that is formed at the interface with the metal layer; and a first Ag layer that is laminated on the first glass layer.

公开(公告)号：EP2460393A4

公开(公告)日：2015-03-04

申请号：EP10803777

申请日：2010-07-28

Applicant: ATI TECHNOLOGIES ULC

Inventor： LEUNG ANDREW ,  TOPACIO RODEN ,  MARTINEZ LIANE ,  LOW YIP SENG

IPC: H05K3/00 ,  H01L23/12 ,  H01L23/488 ,  H05K1/02 ,  H05K3/10

CPC classification number: H01L23/49822 ,  B32B37/02 ,  B32B2309/105 ,  B32B2310/0843 ,  B32B2457/00 ,  H01L21/4857 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K3/0035 ,  H05K3/0055 ,  H05K3/4602 ,  H05K3/4644 ,  H05K2201/09136 ,  Y10T29/49117 ,  Y10T156/10 ,  H01L2224/05599

公开(公告)号：EP2816589A2

公开(公告)日：2014-12-24

申请号：EP14181484.8

申请日：2009-03-19

Applicant: ATI Technologies ULC

Inventor： Topacio, Roden ,  Zbrzezny, Adam

IPC: H01L23/00 ,  H01L23/16 ,  H01L23/31 ,  H05K1/02 ,  H05K3/34

CPC classification number: H01L23/3128 ,  H01L23/16 ,  H01L23/562 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81815 ,  H01L2224/92125 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K3/3452 ,  H05K3/3457 ,  H05K2201/09136 ,  H05K2201/09781 ,  H05K2203/043 ,  H01L2924/014 ,  H01L2924/00014

Abstract: Various semiconductor chip package substrates with reinforcement and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes providing a package substrate that has a first side and a second side opposite to the first side. The first side has a central area adapted to receive a semiconductor chip. A solder reinforcement structure is formed on the first side of the package substrate outside of the central area to resist bending of the package substrate.

Abstract translation: 公开了具有增强的各种半导体芯片封装基板及其制造方法。 一方面，提供了一种制造方法，其包括提供具有第一侧和与第一侧相对的第二侧的封装衬底。 第一侧具有适于接收半导体芯片的中心区域。 在中心区域外的封装基板的第一侧上形成焊料加强结构，以抵抗封装基板的弯曲。

公开(公告)号：EP2811271A1

公开(公告)日：2014-12-10

申请号：EP13743471.8

申请日：2013-01-29

Applicant: Mitsubishi Materials Corporation

Inventor： TARI, Kazuyoshi ,  ISHIKAWA, Mototaka ,  SHIRATA, Keiji ,  NAKAMURA, Kenzo

IPC: G01J1/02 ,  G01J5/10 ,  G01J5/20 ,  H01L35/10 ,  H01L35/30 ,  H01L37/02

CPC classification number: G01J5/10 ,  G01J5/0022 ,  G01J5/06 ,  G01J5/0803 ,  G01J2005/103 ,  G01J2005/206 ,  G03G15/2039 ,  G03G2215/00772 ,  H01L27/144 ,  H01L37/02 ,  H05K1/0271 ,  H05K1/189 ,  H05K2201/068 ,  H05K2201/09136 ,  H05K2201/09781

Abstract: Provided is an infrared sensor which is capable of measuring a temperature of an object to be measured with high accuracy even when lead wires are connected to one side thereof. The infrared sensor includes an insulating film; a first and a second heat sensitive element which are provided on one face of the insulating film; a first and a second wiring film that are respectively connected to the first and the second heat sensitive element; an infrared reflecting film; a plurality of terminal electrodes; and a thermal resistance adjusting film which is provided on the other face of the insulating film, is in opposition to at least a portion of the longer one of the first or the second wiring film in wiring distance from the terminal electrodes, and is formed of a material with greater heat dissipation than the insulating film.

Abstract translation: 提供一种红外线传感器，其即使在将导线连接到其一侧时也能够以高精度测量被测量物体的温度。 红外传感器包括绝缘膜; 第一和第二热敏元件，设置在绝缘膜的一个面上; 分别连接到第一和第二热敏元件的第一和第二布线膜; 红外反射膜; 多个端子电极; 并且设置在所述绝缘膜的另一面上的热电阻调节膜与所述端子电极的布线距离处于与所述第一或第二布线膜中较长的一个的至少一部分相对，并且由所述热电阻调节膜形成为 具有比绝缘膜更大散热的材料。

公开(公告)号：EP2447993A4

公开(公告)日：2014-10-01

申请号：EP10809474

申请日：2010-05-07

Applicant: HUAWEI DEVICE CO LTD

Inventor： QIAO JITAO

IPC: H01L23/48 ,  H01L23/12 ,  H01L23/13 ,  H01L25/00

CPC classification number: H01L23/49805 ,  H01L23/13 ,  H01L25/105 ,  H01L25/16 ,  H01L2924/15162 ,  H01L2924/15323 ,  H05K1/141 ,  H05K3/3436 ,  H05K3/3442 ,  H05K2201/09136 ,  H05K2201/10727

Abstract: Embodiments of the present invention provide an electronic module and a packaging structure of the electronic module. The electronic module includes: a substrate; at least one electronic component, arranged on an upper surface of the substrate; and a first conductive part and a second conductive part, configured to connect the electronic module to an external printed circuit board; the first conductive part is arranged at a lower surface of the substrate and is electrically connected to the electronic component; and the second conductive part is arranged across a lateral surface of the substrate and the lower surface of the substrate. The electronic module is packaged with the printed circuit board by arranging a second conductive part across the lateral surface of the substrate and the lower surface of the substrate, which improves the quality of welding between the electronic module and the printed circuit board.

Abstract translation: 本发明的实施例提供了电子模块和电子模块的包装结构。 电子模块包括：基板; 至少一个电子部件，布置在所述基板的上表面上; 以及第一导电部和第二导电部，被配置为将所述电子模块连接到外部印刷电路板; 第一导电部件布置在基板的下表面处并且电连接到电子部件; 并且第二导电部分跨越衬底的侧表面和衬底的下表面布置。 电子模块通过在基板的侧表面和基板的下表面上布置第二导电部件而与印刷电路板封装，这提高了电子模块和印刷电路板之间的焊接质量。

公开(公告)号：EP2634480A4

公开(公告)日：2014-08-13

申请号：EP12834577

申请日：2012-10-18

Applicant: PANASONIC CORP

Inventor： UENOYAMA KOJI ,  OOTUBO ATUSI ,  MATSUMOTO HIROYUKI

IPC: F21V29/00 ,  F21S2/00 ,  F21V19/00 ,  F21V23/00 ,  F21Y101/02 ,  H01L33/00 ,  H05K1/02

CPC classification number: F21V29/004 ,  F21K9/23 ,  F21K9/27 ,  F21S8/04 ,  F21V3/00 ,  F21V29/508 ,  F21Y2103/33 ,  F21Y2105/10 ,  F21Y2115/10 ,  H05B33/0821 ,  H05K1/0201 ,  H05K1/0209 ,  H05K1/0271 ,  H05K1/181 ,  H05K2201/09136 ,  H05K2201/09781 ,  H05K2201/10106

Abstract: A light-emitting device includes: a board (18); light-emitting elements (60a and 60b) interconnected in parallel and provided above a top face (65) of the board (18); light-emitting elements (60e and 60f), one of which is connected in series with the light-emitting element (60a) and the other of which is connected in series with the light-emitting element (60b), the light-emitting elements (60e and 60f) being interconnected in parallel; a metal pattern (67a) provided continuously under the light-emitting elements (60a and 60b), on an undersurface (28) of the board (18); and a metal pattern (67b) provided continuously under the light-emitting elements (60e and 60f), and isolated from the first metal pattern (67a).

公开(公告)号：EP2315284A3

公开(公告)日：2013-03-27

申请号：EP10188267.8

申请日：2010-10-20

Applicant: Toshiba Lighting & Technology Corporation

Inventor： Betsuda, Nobuhiko ,  Ogawa, Kozo ,  Matsuda, Shuhei ,  Nishimura, Kiyoshi ,  Shibano, Nobuo

IPC: H01L33/64 ,  H05K1/02 ,  H05K1/03 ,  F21V17/12 ,  F21V23/00 ,  F21Y101/02

CPC classification number: H01L33/641 ,  F21K9/00 ,  F21S8/02 ,  F21V17/12 ,  F21V23/00 ,  F21V29/75 ,  F21V29/76 ,  F21Y2107/90 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/01322 ,  H05K1/0209 ,  H05K1/0306 ,  H05K2201/09136 ,  H05K2201/09781 ,  H01L2924/00014 ,  H01L2924/00

Abstract: According to one embodiment, a light-emitting apparatus (10) includes an insulating base made of ceramics, an obverse metallic component (12) dividedly arranged on the front surface (11A) of the insulating base (11), semiconductor light-emitting elements (13) mounted on the obverse metallic component, and a reverse metallic component (14) arranged on a back surface (11B) of the insulating base (11) and having a thickness the same as or smaller than a thickness of the obverse metallic component (12) a volume equal to 50% or larger of a volume of the obverse metallic component (12).

Abstract translation: 根据一个实施例，发光装置（10）包括由陶瓷制成的绝缘基底，分隔地布置在绝缘基底（11）的前表面（11A）上的正面金属部件（12），半导体发光元件 （13），以及设置在所述绝缘基座（11）的背面（11B）上并且具有与所述正面金属部件的厚度相同或更小的厚度的反向金属部件（14） （12）体积等于正面金属部件（12）的体积的50％或更大的体积。