公开(公告)号：EP2680679A1

公开(公告)日：2014-01-01

申请号：EP13171339.8

申请日：2013-06-11

Applicant: Tellabs Oy

Inventor： Holma, Antti ,  Kokko, Peter

IPC: H05K1/02

CPC classification number: H05K3/303 ,  H05K1/02 ,  H05K3/22 ,  H05K3/222 ,  H05K3/30 ,  H05K3/306 ,  H05K2201/09972 ,  H05K2201/10189 ,  H05K2201/10303 ,  H05K2201/10363 ,  H05K2201/1059 ,  H05K2201/2018 ,  H05K2203/162 ,  Y10T29/49004 ,  Y10T29/4913

Abstract: A circuit board system comprising mechanical protection of electrical components is presented. The circuit board system comprises a circuit board (101) furnished with electrical components (103-111) and a protection element (102) attached to areas of the circuit board which are free from the electrical components. The protection element has thickness in the direction perpendicular to the circuit board and it is shaped to leave the electrical components unscreened in the direction perpendicular to the circuit board. Thus, the protection element constitutes barriers protecting the electrical components but still allows the electrical components to be accessed from the direction perpendicular to the circuit board for example in a flying probe testing. The body of the protection element can be made of same material as the electrically insulating body of the circuit board. Thus, the thermal expansion coefficient of the protection element can be substantially the same as that of the circuit board.

Abstract translation: 提出了包括电气部件的机械保护的电路板系统。 电路板系统包括配备有电气部件（103-111）的电路板（101）和附接到电路板的没有电气部件的区域的保护元件（102）。 保护元件在垂直于电路板的方向上具有厚度，并且其形状使得电子部件在垂直于电路板的方向上未被屏蔽。 因此，保护​​元件构成保护电气部件的屏障，但是仍然允许例如在飞行探针测试中从垂直于电路板的方向访问电气部件。 保护元件的主体可以由与电路板的电绝缘体相同的材料制成。 因此，保护​​元件的热膨胀系数可以与电路板的热膨胀系数基本相同。

公开(公告)号：EP2676792A1

公开(公告)日：2013-12-25

申请号：EP12747044.1

申请日：2012-02-15

Applicant: Mitsubishi Heavy Industries, Ltd.

Inventor： WAKU Hiroyuki

IPC: B32B5/28 ,  B29C70/68 ,  B64C1/00 ,  B64C3/18

CPC classification number: H05K1/115 ,  B29C70/882 ,  B29K2307/04 ,  B64C3/18 ,  B64C3/20 ,  B64C3/26 ,  B64D45/02 ,  H05K1/0366 ,  H05K3/4602 ,  H05K3/4632 ,  H05K13/00 ,  H05K2201/029 ,  H05K2201/0323 ,  H05K2201/10363 ,  Y02T50/43 ,  Y10T29/49117

Abstract: This carbon-fiber-reinforced plastic structure includes: an electroconductive layer (233) formed by being laminated on a carbon-fiber prepreg (231); and an electric-conductor-made jumper (24) that penetrates through the electroconductive layer (233) and the carbon-fiber prepreg (231).

Abstract translation: 这种碳纤维增强塑料结构包括：通过层压在碳纤维预浸料（231）上形成的导电层（233）; 以及穿过导电层（233）和碳纤维预浸料（231）的导电体制造的跨接线（24）。

公开(公告)号：EP2386791A2

公开(公告)日：2011-11-16

申请号：EP11166093.2

申请日：2011-05-13

Applicant: LG Innotek Co., Ltd

Inventor： Jin, Hong Boem ,  Kim, Han Cheol

IPC: F21K99/00

CPC classification number: H05K1/0295 ,  F21K9/00 ,  F21K9/27 ,  F21Y2103/10 ,  F21Y2115/10 ,  H05B33/0803 ,  H05K1/0209 ,  H05K1/05 ,  H05K2201/10106 ,  H05K2201/10363 ,  H05K2203/173

Abstract: A light emitting device array is provided comprising a printed circuit board on which a plurality of electrode patterns having the same width is formed, a light emitting device package disposed on a predetermined number of electrode patterns and a power supply line disposed on at least one of the remaining electrode pattern except for the predetermined number of electrode patterns.

公开(公告)号：EP2309521A1

公开(公告)日：2011-04-13

申请号：EP09171375.0

申请日：2009-09-25

Applicant: Arcus Elektrotechnik Alois Schiffmann GmbH

Inventor： Wild, Manuel ,  Lasinger, Fritz

IPC: H01C1/16 ,  H05K1/00 ,  H05K1/02 ,  H05K3/00

CPC classification number: H01C1/16 ,  H05K1/0286 ,  H05K1/141 ,  H05K1/142 ,  H05K1/167 ,  H05K3/0052 ,  H05K3/3447 ,  H05K3/368 ,  H05K2201/09263 ,  H05K2201/09963 ,  H05K2201/10303 ,  H05K2201/10363

Abstract: Es wird eine Widerstandsbaugruppe angegeben, die insbesondere für Mittelspannungs- und Hochspannungsanwendungen geeignet ist. Die Baugruppe weist einen isolierenden, langgestreckten Träger (10) mit zwei gegenüberliegenden Hauptflächen (11, 12) auf. Auf der einen Hauptfläche (11) ist eine erste Widerstandsanordnung (20) vorgesehen, während eine zweite Widerstandsanordnung (30) auf der anderen Hauptfläche (12) vorgesehen ist, die sich beide über die Länge des Trägers (10) erstrecken. Der Träger (10) besitzt eine Vielzahl von integrierten, abtrennbaren Modulen (14), die jeweils miteinander verbunden sind und miteinander verbundene Teile der beiden Widerstandsanordnungen (20) und (30) tragen. An den jeweiligen Enden der Module (14) sind Verbindungsanschlüsse (A - D) für die erste und die zweite Widerstandsanordnung (20, 30) vorgesehen.

Abstract translation: 电阻组件（100）具有隔离和细长的载体（10），其具有两个相对的相对的面。 电阻装置（20）设置在载体的一个表面上，主面在载体的长度上延伸。 载体具有多个集成和分离的模块（14）。

公开(公告)号：EP2109349B1

公开(公告)日：2011-04-06

申请号：EP08103866.3

申请日：2008-05-08

Applicant: Mediatek Inc.

Inventor： Chen, Nan-Jang ,  Lin, Hong-Chin

IPC: H05K1/02 ,  H01L23/66 ,  H05K3/46

CPC classification number: H05K1/0216 ,  H01L2924/0002 ,  H05K3/222 ,  H05K2201/0715 ,  H05K2201/093 ,  H05K2201/09336 ,  H05K2201/10363 ,  H05K2201/10515 ,  H05K2201/10689 ,  H01L2924/00

公开(公告)号：EP2209355A1

公开(公告)日：2010-07-21

申请号：EP09009936.7

申请日：2009-07-31

Applicant: Mitsubishi Electric Corporation

Inventor： Kai, Akihiro

IPC: H05K1/02 ,  H05K3/22 ,  H05K3/34

CPC classification number: H05K3/222 ,  H05K1/0263 ,  H05K3/3447 ,  H05K2201/10363

Abstract: In an electronic control device related to the present invention, a current circuit is formed on a printed circuit board 1, and an electric component with lead is soldered to the printed circuit board by a flow soldering method, the electronic control device includes: a copper foil flat pattern 28 forming a soldering surface current pattern at a soldering surface side which is flowed through by current of the current circuit at the soldering surface side of the printed circuit board and exposing copper foil; a through hole 29 formed on the copper foil flat pattern 28; and a jumper lead wire 30 to be mounted on the through hole 29 from the soldering surface side and soldered by the flow soldering method.

Abstract translation: 在本发明的电子控制装置中，在印刷电路板1上形成电流电路，通过流焊方法将具有引线的电气部件焊接到印刷电路板，电子控制装置包括：铜 在平坦图案28上形成焊接表面电流图案，该焊接表面侧在印刷电路板的焊接表面侧流过电流电路的电流并暴露铜箔; 形成在铜箔扁平图案28上的通孔29; 以及跨接引线30，其从焊接面侧安装在通孔29上，并通过流焊方式焊接。

公开(公告)号：EP2120516A1

公开(公告)日：2009-11-18

申请号：EP08711398.1

申请日：2008-02-15

Applicant: Sumitomo Electric Industries, Ltd. ,  Sumitomo Electric Printed Circuits, Inc.

Inventor： OKA, Yoshio ,  KASUGA, Takashi ,  PARK, Jinjoo ,  NAKAMA, Kouki

IPC: H05K1/11

CPC classification number: H05K3/4685 ,  H05K1/0393 ,  H05K1/095 ,  H05K1/118 ,  H05K3/281 ,  H05K3/4069 ,  H05K3/4664 ,  H05K2201/0394 ,  H05K2201/10363 ,  H05K2203/1581

Abstract: A flexible printed wiring board 1 includes a substrate 2, conductor wirings 3 and 4, a coverlay film 5, a jumper wiring 11, and through holes 9 and 10. The conductor wirings 3 and 4 are disposed on a first surface 2a of the substrate 2. The coverlay film 5 covers at least part of the conductor wirings 3 and 4. The jumper wiring 11 electrically connects the conductor wirings 3 and 4 to each other. The through holes 9 and 10 are formed in the substrate 2 and respectively open to the surfaces of the conductor wirings 3 and 4. The jumper wiring 11 is composed of a hardened material of a conductive paste and is formed so that a second surface 2b of the substrate 2 is continuous with respective surfaces 3a and 4a of the conductor wirings 3 and 4 to which the through holes 9 and 10 open.

Abstract translation: 柔性印刷布线板1包括基板2，导体布线3和4，覆盖膜5，跨接布线11以及通孔9和10.导体布线3和4布置在基板的第一表面2a上 覆盖膜5覆盖导体布线3和4的至少一部分。跳线布线11将导体布线3和4彼此电连接。 通孔9和10形成在衬底2中并分别在导体布线3和4的表面开口。跨接布线11由导电浆料的硬化材料构成，并且形成为使得第二表面2b 基板2与通孔9和10打开的导体布线3和4的相应表面3a和4a连续。

公开(公告)号：EP2109141A1

公开(公告)日：2009-10-14

申请号：EP08168852.5

申请日：2008-11-11

Applicant: MediaTek Inc.

Inventor： Chen, Nan-Jang

IPC: H01L23/66 ,  H05K1/02 ,  H05K3/46

CPC classification number: H05K3/222 ,  H01L2924/0002 ,  H05K1/0216 ,  H05K2201/0715 ,  H05K2201/093 ,  H05K2201/09336 ,  H05K2201/10363 ,  H05K2201/10515 ,  H05K2201/10689 ,  H01L2924/00

Abstract: A printed circuit board (500a-d) is disclosed. The printed circuit board comprises a substrate (200) having a top surface (202) and a bottom surface (203). A ground plane (228) is on the bottom surface. A signal trace (212c) is on the top surface along a first direction. At least two isolated power planes (208,210) are on the top surface adjacent to opposite sides of the signal trace, respectively. A conductive connection (330) along a second direction couples to the two power planes, across the signal trace without electrically connecting to the signal trace, wherein the signal trace doesn't directly pass over any split of the ground plane.

Abstract translation: 公开了一种印刷电路板（500a-d）。 印刷电路板包括具有顶面（202）和底面（203）的基板（200）。 接地平面（228）在底面上。 信号迹线（212c）沿着第一方向在顶面上。 至少两个隔离的电源层（208,210）分别位于与信号迹线的相对侧相邻的顶表面上。 沿第二方向的导电连接（330）耦合到两个电源平面，穿过信号迹线而不电连接到信号迹线，其中信号迹线不直接通过接地平面的任何分裂。

公开(公告)号：EP1645015A1

公开(公告)日：2006-04-12

申请号：EP04767723.2

申请日：2004-07-16

Applicant: Brandt Industries

Inventor： CORNEC, René ,  FOURNIER, Dominique ,  MARLIOT, Eric

IPC: H01R12/34 ,  H05K3/40

CPC classification number: H01R12/526 ,  H01R31/08 ,  H05K3/3415 ,  H05K3/3447 ,  H05K3/4046 ,  H05K2201/10363

Abstract: The invention concerns a component for a double-sided printed circuit with non-plated vias, consisting of a part (10) made of electrically conductive material including two elongated pins (12) adapted to pass respectively through two vias of the printed circuit and integral with a flat enlarged portion (11) extending perpendicularly to the elongated pins (12). The invention is useful for electrical connection between two strip conductors of a double-sided printed circuit.

Abstract translation: 该组件（10）具有由导电材料制成的一部分，并且包括延长销（12），用于通过一印刷电路板的孔穿过的非金属化。 扁平扩展板（11）垂直地延伸至所述销，并具有矩形形状。该组件为U形，并且所述部件的膨胀plateforms基座。 膨胀板对称地由销延长。 因此独立claimsoft包括用于布置在印刷电路板的两个respectivement侧上的两个导电轨迹之间的电连接的实现的方法。

公开(公告)号：EP0997060A1

公开(公告)日：2000-05-03

申请号：EP98933992.4

申请日：1998-06-26

Applicant: TELEFONAKTIEBOLAGET L M ERICSSON (publ)

Inventor： BERGSTEDT, Leif, Roland ,  CARLBERG, Bo

IPC: H05K3/32 ,  H01P3/08

CPC classification number: H05K3/222 ,  H05K1/024 ,  H05K3/3442 ,  H05K2201/09036 ,  H05K2201/09781 ,  H05K2201/10363 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49144 ,  Y10T29/49169

Abstract: The present invention relates to a device and a method at a printed board for obtaining good transmission qualities in transmission conductors on a predetermined area (10) of the printed board (11). A separate component (1) for signal transmission comprises a conductor (5). The component (1) is mounted, with the conductor facing the printed board (11), over the area (10) of the printed board, which requires good transmissions qualities, whereby an air gap (L) is obtained between the conductor (5) and the printed board (11). Soldering joints (21) connect each one of the outer parts (7a, 7b) of the conductor (5) of the component (1) to corresponding pattern conductors (17a, 17b) on the printed board (11). The thickness of the soldering connections and the thickness of the pattern conductors form the air gap (L) between the conductor (5) and the printed board (11). In an alternative embodiment according to the invention, a groove (23) is milled out of the printed board (11) under the conductor (5), obtaining an enlarged air gap between the conductor (5) and the printed board (11).