公开(公告)号：EP1771878A1

公开(公告)日：2007-04-11

申请号：EP05758787.5

申请日：2005-06-13

申请人： Enthone, Inc.

发明人： YAKOBSON, Eric ,  Hurtubise, Richard ,  Witt, Christian ,  Chen, Qingyun

IPC分类号： H01L21/768 ,  H01L21/288

CPC分类号： H01L21/76846 ,  H01L21/288 ,  H01L21/76849 ,  H01L24/03 ,  H01L24/05 ,  H01L2224/05006 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/15747 ,  H05K3/107 ,  H05K3/244 ,  H05K2203/072 ,  H05K2203/1476 ,  H01L2924/00

摘要： A multilayer metal cap (18, 20) over a metal-filled interconnect feature in a dielectric layer for incorporation into a multilayer integrated circuit device, and a method for forming the cap.

公开(公告)号：EP1678991A1

公开(公告)日：2006-07-12

申请号：EP04770264.2

申请日：2004-10-15

申请人： Koninklijke Philips Electronics N.V.

发明人： CHAPMAN, Jeffrey A.

IPC分类号： H05K3/12

CPC分类号： H05K3/1258 ,  G02F2001/136295 ,  H01L27/1292 ,  H05K1/095 ,  H05K3/0023 ,  H05K3/107 ,  H05K2203/0568

摘要： A method of producing a conductive layer (5) on a substrate (1) comprises depositing an insulator such as a photodefinable insulator (2) on the substrate (1), defining a groove (3) for the conductive layer (5) in the insulator material, filling the groove (3) with a precursor material and curing the material to provide the conductive layer.

公开(公告)号：EP1469485A3

公开(公告)日：2006-03-29

申请号：EP04392019.8

申请日：2004-04-15

申请人： Integral Technologies, Inc.

发明人： Aisenbrey, Thomas

IPC分类号： H01B11/10

CPC分类号： H01B11/1066 ,  B29C45/0001 ,  B29C45/0013 ,  B29K2995/0005 ,  B29L2031/3456 ,  G06K19/07749 ,  H05K1/095 ,  H05K3/101 ,  H05K3/107 ,  H05K2201/0281 ,  H05K2201/09118 ,  H05K2203/0113

摘要： Shielded cable devices are formed of a conductive loaded resin-based material. Non-insulated conductors with shields, coaxial shielded cables, twisted pair shielded cables, and multi-wire shielded cables are described. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The ratio of the weight of the conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers to the weight of the base resin host is between about 0.20 and 0.40. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like. The conductive loaded resin-based conductive shield of the shielded cable devices can be formed using methods such as injection molding compression molding or extrusion. The conductive loaded resin-based material used to form the conductive shield of the shield cable devices can also be in the form of a thin flexible woven fabric that can readily be cut to the desired shape.

公开(公告)号：EP1633174A2

公开(公告)日：2006-03-08

申请号：EP05016395.5

申请日：2005-07-28

申请人： NITTO DENKO CORPORATION

发明人： Oda, Takashi c/o NITTO DENKO CORPORATION ,  Miyake, Yasufumi c/o NITTO DENKO CORPORATION ,  Ohkawa, Tadao c/o NITTO DENKO CORPORATION

IPC分类号： H05K3/38 ,  H05K3/24

CPC分类号： H05K3/107 ,  H05K1/117 ,  H05K3/22 ,  H05K3/244 ,  H05K2201/0769 ,  H05K2203/0278 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49153 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

摘要： A wired circuit board which even when a conductive pattern is formed in the form of fine pitch can provide improved adhesion between the conductive pattern and an insulating layer to prevent a plating solution from remaining between a metal plating layer and the insulating layer, so as to prevent ionic impurities in the plating solution from remaining as residual or ionic contamination, whereby even when electric current flows through the circuit under a high temperature and high humidity environment over a long term, a short circuit from ionic migration can be prevented to suppress insulating failure. Lower end portions of terminal portions 5 formed on an insulating base layer 2 and lower end portions of side surfaces and metal plating layers 6 covering over the terminal portions 5 are embedded in the insulating base layer 2 in a flexible wired circuit board 1 at one longitudinal end portion thereof exposed from an insulating cover layer 4. This can provide the result of preventing infiltration of the plating solution in between the metal plating layers 6 and the insulating base layer 2 when the metal plating layer 6 is formed.

摘要翻译： 即使当以细间距的形式形成导电图案时，布线电路板也可以提供导电图案与绝缘层之间的粘合性，从而防止电镀液残留在金属镀层与绝缘层之间，从而 防止电镀溶液中的离子杂质残留或残留或离子污染，由此即使长期在高温高湿环境下电流流过电路，也可以防止离子迁移的短路，从而抑制绝缘失效 。 形成在绝缘基底层2上的端部部分5的下端部分和覆盖在端子部分5上的侧面的下端部分和金属电镀层6的下端部分在柔性布线电路板1的一个纵向上嵌入绝缘基底层2中 其从绝缘覆盖层4露出。这可以提供当形成金属镀层6时防止电镀溶液浸入金属镀层6和绝缘基底层2之间的结果。

公开(公告)号：EP1261021A3

公开(公告)日：2006-02-08

申请号：EP02291236.4

申请日：2002-05-17

申请人： SHINKO ELECTRIC INDUSTRIES CO. LTD.

发明人： Mashino, Naohiro, Shinko Electric Ind. Co.Ltd

IPC分类号： H01L21/48

CPC分类号： H05K3/423 ,  H01L21/288 ,  H01L21/2885 ,  H01L21/32115 ,  H01L21/3212 ,  H01L21/4846 ,  H01L21/486 ,  H01L21/76898 ,  H01L25/0657 ,  H01L2224/16 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/15311 ,  H05K1/0306 ,  H05K3/045 ,  H05K3/107 ,  H05K3/388 ,  H05K3/4608 ,  H05K2201/0376 ,  H05K2201/09036 ,  H05K2201/09563 ,  H05K2203/0143 ,  H05K2203/1509 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2924/00

摘要： A method of production of a circuit board able to prevent peeling of a conductive layer during polishing of the conductive layer including the steps of forming at least holes in one surface of a substrate; forming a plating power supply layer on the one surface of the substrate, the other surface, the sides, and inner surfaces of the holes; forming a metal layer formed on the one surface of the substrate, the other surface, and the sides and burying the holes by electroplating through the plating power supply layer; and polishing the metal layer to form interconnect patterns comprised of the metal layer buried in the holes.

公开(公告)号：EP1618769A1

公开(公告)日：2006-01-25

申请号：EP04750429.5

申请日：2004-04-22

申请人： EASTMAN KODAK COMPANY

发明人： BRICKEY, Cheryl Jane ,  BOURDELAIS, Robert Paul ,  MAJUMDAR, Debasis

IPC分类号： H05K3/10 ,  H01B1/12

CPC分类号： H05K3/107 ,  H05K1/0274 ,  H05K3/28 ,  H05K2201/0108 ,  H05K2201/0329 ,  H05K2201/09036 ,  H05K2203/161 ,  Y10T428/24355 ,  Y10T428/24744

摘要： Disclosed is an article comprising a layer of nonconductive polymeric material (2) comprising a plurality of integral polymer conduit channels containing a substantially transparent conductive material (4).

公开(公告)号：EP1618571A1

公开(公告)日：2006-01-25

申请号：EP04760313.9

申请日：2004-04-21

申请人： EASTMAN KODAK COMPANY

发明人： BOURDELAIS, Robert Paul ,  BRICKEY, Cheryl, Jane

IPC分类号： H01B1/00

CPC分类号： H05K3/107 ,  H05K1/09 ,  H05K2201/0108 ,  H05K2201/0329 ,  H05K2201/09036 ,  Y10T428/24744

摘要： Disclosed is an article comprising a polymer sheet containing a plurality of integral polymer conduit channels containing a transparent conductive material in which two or more such channels terminate.

公开(公告)号：EP1470920A4

公开(公告)日：2005-12-14

申请号：EP03701747

申请日：2003-01-16

申请人： SHARP KK

发明人： SAGARA TOMOYUKI

IPC分类号： B41J2/045 ,  B41J2/055 ,  B41J2/14 ,  B41J2/16 ,  H05K3/04 ,  H05K3/10 ,  H05K3/36

CPC分类号： B41J2/1623 ,  B41J2/14209 ,  B41J2/1606 ,  B41J2/1609 ,  B41J2/1632 ,  B41J2002/14491 ,  B41J2202/03 ,  H05K3/045 ,  H05K3/107 ,  H05K3/361 ,  Y10T29/42 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T29/49401

摘要： In the step of forming an external connection electrode, at one end of each ink chamber (26), conductive resin (10) is applied into a plurality of ink chambers (26) and onto a plurality of protruding surfaces of a piezoelectric substrate (60) so as to form a single straight line to vertical intersect the direction of extension of the ink chambers (26). After this, abrasive finishing or grinding is performed to remove the conductive resin (10) from the protruding surfaces of the ink chamber walls. As a result, the conductive resin (10) filling inside the ink chamber (26) constitutes an electrode for an external connection. This reduces the electrostatic capacity attributed to the piezoelectric substrate. Moreover, it is possible to increase the ink jet head drive frequency. This reduces power consumption and provides an ink jet head having a high productivity and reliability and capable of high-speed printing as well as its manufacturing method.

公开(公告)号：EP1538482A1

公开(公告)日：2005-06-08

申请号：EP03445141.9

申请日：2003-12-05

申请人： Obducat AB

发明人： Heidari, Babak ,  Beck, Marc

IPC分类号： G03F7/00 ,  G03F7/20

CPC分类号： B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  G03F7/2012 ,  H05K3/0014 ,  H05K3/0023 ,  H05K3/107 ,  H05K2201/0108 ,  H05K2203/0108

摘要： Apparatus and method for transferring a pattern from a template (10) having a structured surface to a substrate (12) carrying a surface layer of a radiation polymerisable fluid (14). The apparatus comprises a first main part (101) and a second main part (102) having opposing surfaces (104;105), means for adjusting a spacing (115) between said main parts, support means (106) for supporting said template and substrate in mutual parallel engagement in said spacing with said structured surface facing said surface layer, a radiation source (110) devised to emit radiation into said spacing. A cavity (115) has a first wall comprising a flexible membrane (113) devised to engage said template or substrate, and means (114;116)are provided for applying an adjustable overpressure to a medium present in said cavity, whereby an even distribution of force is obtained over the whole of the contact surface between the substrate and the template.

摘要翻译： 用于将图案从具有结构化表面的模板（10）转移到承载可辐射聚合流体（14）的表面层的基底（12）的装置和方法。 该装置包括具有相对表面（104; 105）的第一主要部分（101）和第二主要部分（102），用于调节所述主要部分之间的间隔（115），用于支撑所述模板的支撑装置（106） 在与所述结构化表面面对所述表面层的所述间隔中相互平行接合的衬底，设计成将辐射发射到所述间隔中的辐射源（110）。 空腔（115）具有第一壁，该第一壁包括设计成接合所述模板或基底的柔性膜（113），并且提供装置（114; 116），用于将可调节的超压施加到存在于所述空腔中的介质，由此均匀分布 在基板和模板之间的整个接触表面上获得力。

公开(公告)号：EP1487018A2

公开(公告)日：2004-12-15

申请号：EP04253544.3

申请日：2004-06-14

申请人： Samsung Electronics Co., Ltd.

发明人： Choi, Kyoung-sei

IPC分类号： H01L23/498

CPC分类号： H01L21/4846 ,  H01L21/3122 ,  H01L23/3107 ,  H01L23/4985 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12044 ,  H05K1/0393 ,  H05K3/045 ,  H05K3/06 ,  H05K3/107 ,  H05K3/1258 ,  H05K3/243 ,  H05K3/28 ,  H05K3/388 ,  H05K2201/0108 ,  H05K2201/0376 ,  H05K2201/09036 ,  H05K2203/0108 ,  Y10T29/49227 ,  H01L2924/00 ,  H01L2224/0401

摘要： A flexible substrate used in a semiconductor package, a method of manufacturing the same, and a semiconductor package including the flexible substrate. A circuit pattern forming region is formed in an insulating substrate with a dented shape and a circuit pattern formed of a metallic material is formed in the circuit pattern forming region.

摘要翻译： 用于半导体封装的柔性衬底，其制造方法和包括柔性衬底的半导体封装。 电路图案形成区域形成在具有凹陷形状的绝缘基板中，并且在电路图案形成区域中形成由金属材料形成的电路图案。