公开(公告)号：EP1783842B1

公开(公告)日：2008-03-05

申请号：EP05256852.4

申请日：2005-11-04

Applicant: Delphi Technologies, Inc.

Inventor： Bosch, Russell ,  Cooke, Michael ,  Goat, Christopher

IPC: H01L41/053 ,  F02M59/46 ,  F02M51/06

CPC classification number: H01L41/23 ,  F02M51/0603 ,  F02M63/0026 ,  F02M2200/22 ,  H01L41/0533

公开(公告)号：EP1619730A1

公开(公告)日：2006-01-25

申请号：EP04017194.4

申请日：2004-07-21

Applicant: SIEMENS AKTIENGESELLSCHAFT

Inventor： Denzler, Michael ,  Kohn, Stefan ,  Neumaier, Martin, Dr. ,  Niefanger, Roland ,  Plecher, Klaus ,  Voigt, Andreas, Dr. ,  Zumstrull, Claus

IPC: H01L41/053

CPC classification number: H01L41/0533 ,  F02M51/0603 ,  H01L41/23

Abstract: Es wird ein Verfahren zum Verbessern der Langzeitstabilität eines piezoelektrischen Aktors (1) beschrieben, der mit einer Vergussmasse (2) umgeben ist, die Wasserstoffatome enthält oder bildet. In der piezoelektrischen Keramik des piezoelektrischen Aktors ist Sauerstoff enthalten. Damit ungesättigte Bindungen des Wasserstoffs der Vergussmasse weniger Sauerstoff aus der piezoelektrischen Keramik lösen, werden entsprechende Mittel eingesetzt. Ein Mittel besteht darin, die Konzentration des Wasserstoffs in der Vergussmasse zu senken. Dabei werden nach dem Vergießen des piezoelektrischen Aktors mit der Vergussmasse entsprechende Wärmeprozesse durchgeführt, mit denen die Konzentration des Wasserstoffs unter eine vorgegebene Schwelle gesenkt wird. In weiteren Ausführungsformen sind Mittel vorgesehen, die Bindungen mit dem Wasserstoff der Vergussmasse bilden oder Sauerstoff der Vergussmasse zuführen.

Abstract translation: 压电致动器（1）包括通过铸造组合物（2）围成的压电陶瓷含有化学还原物质，特别是氢。 在浇铸组合物中的还原物质的浓度低于位于规定的阈值。 因此独立claimsoft包含用于改进的压电致动器的长期稳定性的方法。

公开(公告)号：EP1588782A1

公开(公告)日：2005-10-26

申请号：EP05102986.6

申请日：2005-04-15

Applicant: Elliptec Resonant Actuator AG

Inventor： Magnussen, Bjorn B. ,  Varadi, Peter C.

IPC: B06B1/06

CPC classification number: H01L41/0536 ,  H01L41/0906 ,  H01L41/23 ,  Y10T29/42

Abstract: A piezoelectric apparatus comprising a piezoelectric element (1) that is held in static compression is manufactured using moldable materials and a molding process, e.g., injection molding or die casting. The static compression is caused by an intrinsic urge of the moldable material to expand, contract, or deform otherwise, which develops in the material during the hardening phase of the molding process. To enhance the usefulness of the device, a variety of inserts can be connected to the device and various features can be formed by the moldable material at the same time as the molding process takes place. Static preloads may also be caused by mechanically preloaded elements that are introduced during the molding process or by elements that concurrently introduced but that are permanently deformed thereafter.

Abstract translation: 包括保持静止压缩的压电元件（1）的压电装置使用可模制材料和模制工艺（例如注模或压铸）制造。 静态压缩是由于可模塑材料在模制过程的硬化阶段期间在材料中产生的膨胀，收缩或变形的内在冲动引起的。 为了提高装置的有用性，可以将多种插入物连接到装置，并且可以在模制过程发生的同时由可模制材料形成各种特征。 静态预载荷也可能是由在模制过程中引入的机械预加载元件引起的，或者由同时引入的但随后会永久变形的元素引起的。

公开(公告)号：EP1356529A1

公开(公告)日：2003-10-29

申请号：EP02710121.1

申请日：2002-01-29

Applicant: Delphi Technologies, Inc.

Inventor： HARDY, Martin P. ,  HARGREAVES, Andrew J. ,  COOKE, Michael P.

IPC: H01L41/053 ,  F02M47/02

CPC classification number: H01L41/23 ,  F02M47/027 ,  F02M63/0026 ,  H01L41/0533 ,  Y10T29/42 ,  Y10T29/49126 ,  Y10T29/49139 ,  Y10T29/49146 ,  Y10T29/49165 ,  Y10T29/49195 ,  Y10T29/49202 ,  Y10T29/49229

Abstract: A method of assembling a piezoelectric actuator arrangement (10) comprises the steps of providing a piezoelectric element (12) having first and second ends and arranging the piezoelectric element (12) within a sleeve member (20) such that the inner surface of the sleeve member (20) defines, together with the outer surface of the piezoelectric element (12), a chamber (24) for receiving a first filler material (30). The first filler material (30) is injected into the chamber (24) and a heating effect is applied to the sleeve member (20) such that the sleeve member (20) deforms to seal against the first filler material (30). The invention also relates to a piezoelectric actuator arrangement (10) arranged within a sleeve member (20), an inner surface of the sleeve member (20) and an outer surface of the piezoelectric element (12) together defining, at least in part, a chamber (24) containing a filler material (30) such that, when the actuator arrangement (10) is in use, a force due to fuel pressure within an injector accumulator volume is applied to the piezoelectric element (12) through the sleeve member (20) and the filler material (30).

公开(公告)号：EP0651449B1

公开(公告)日：2002-02-13

申请号：EP94117186.0

申请日：1994-10-31

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Eda, Kazuo ,  Tomita, Yoshihiro ,  Kanaboshi, Akihiro ,  Sugimoto, Masato

IPC: H01L41/22 ,  H03H3/02

CPC classification number: H03H9/0595 ,  H01L41/053 ,  H01L41/094 ,  H01L41/23 ,  H01L41/312 ,  H03H3/02 ,  H03H3/08 ,  H03H9/1035 ,  Y10T29/42

Abstract: An electronic component of the present invention includes a first substrate, a second substrate, a first conductive layer constituting a terminal electrode on a first surface of the first substrate, and a first insulating layer formed on the first conductive layer, wherein the first insulating layer and the second substrate are directly bonded to each other by at least one bond selected from the group consisting of a hydrogen bond and a covalent bond.

公开(公告)号：EP0418360A1

公开(公告)日：1991-03-27

申请号：EP90905382.0

申请日：1990-04-09

Applicant: AVL Gesellschaft für Verbrennungskraftmaschinen und Messtechnik mbH.Prof.Dr.Dr.h.c. Hans List

Inventor： SARACOGLU, Ibrahim, Adnan

IPC: H01L27 ,  H01L21 ,  H01L23 ,  H01L41

CPC classification number: H01L23/293 ,  H01L21/3121 ,  H01L41/0533 ,  H01L41/23 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Il s'agit d'abaisser et de stabiliser de manière durable, résistante aux solvants et aux changements de température la conductibilité électrique superficielle de substrats à structure cristalline, polycristalline ou amorphe. A cet effet, on purifie chimiquement la surface du substrat que l'on met en contact avec du chlorotriméthylsilane ((CH3)3ClSi) dissous dans au moins un solvant, de préférence des hydrocarbures légèrement chlorés (par exemple du chloroforme ou du dichlorométhane). On laisse ensuite évaporer le solvant ainsi que les substances liquides ou gazeuses résultant de la réaction chimique. Les valences entrant en ligne de compte pour les réactions chimiques sur la surface du substrat sont saturées après passivation par des radicaux (CH3)3Si.

公开(公告)号：EP3341979A1

公开(公告)日：2018-07-04

申请号：EP16757642.0

申请日：2016-08-26

Applicant: CeramTec GmbH

Inventor： SCHREINER, Hans-Jürgen ,  EINHELLINGER-MÜLLER, Tanja ,  SCHMIDT, Tobias ,  MOOS, Ralf ,  SCHUBERT, Michael ,  BINDIG, Reiner

IPC: H01L41/053 ,  H01L41/23

CPC classification number: H01L41/0533 ,  H01L41/083 ,  H01L41/0986 ,  H01L41/1876 ,  H01L41/23

Abstract: The invention relates to a piezoceramic multi-layered actuator having a moisture-repellent protective layer, and to a method for producing same.

公开(公告)号：EP3339854A1

公开(公告)日：2018-06-27

申请号：EP17206856.1

申请日：2017-12-12

Applicant: Honeywell International Inc.

Inventor： GRANT, Michael ,  CUTLER, Jeffrey ,  WATTS, Rodney Royston

IPC: G01N29/22 ,  G01H11/08 ,  G01N29/34 ,  G01N29/36 ,  H01L41/053

CPC classification number: G01D3/08 ,  B06B1/0644 ,  B06B1/0666 ,  G01H11/08 ,  G01M3/243 ,  G01N29/223 ,  G01N29/34 ,  G01N29/36 ,  H01L41/0475 ,  H01L41/053 ,  H01L41/0533 ,  H01L41/1132 ,  H01L41/23 ,  H01L41/29 ,  H01L41/313

Abstract: Embodiments relate generally to an explosion proof ultrasonic detector. The explosion proof ultrasonic detector comprises a metal enclosure configured to face ultrasound pressure waves, a sense element, wherein the sense element is attached to the metal enclosure via solder, a compression element configured to contact the sense element, and a printed circuit board configured to compress the compression element and to connect electrically to the sense element.

公开(公告)号：EP2381575A4

公开(公告)日：2018-03-28

申请号：EP09834925

申请日：2009-12-24

Applicant: DAISHINKU CORP

Inventor： KOHDA NAOKI ,  YOSHIOKA HIROKI

IPC: H03H9/02 ,  H01L23/02 ,  H03H3/02

CPC classification number: H01L41/332 ,  B01D2325/02 ,  C23C8/40 ,  C23C12/00 ,  H01L23/3731 ,  H01L23/3732 ,  H01L23/3733 ,  H01L31/18 ,  H01L31/1804 ,  H01L41/23 ,  H01L41/25 ,  H01L41/29 ,  H01L41/33 ,  H01L2924/0002 ,  H03H3/02 ,  H03H9/0547 ,  H03H9/0552 ,  H03H9/1035 ,  H03H9/19 ,  H03H2003/045 ,  H03H2003/0457 ,  Y10T29/42 ,  H01L2924/00

Abstract: A piezoelectric resonator device includes a piezoelectric resonator plate where an excitation electrode is formed, and an upper lid member and a lower lid member that hermetically seal the excitation electrode, the piezoelectric resonator plate having a joining region where the upper lid member is joined and a joining region where the lower lid member is joined, on front and back main surfaces, the upper lid member having a joining region on one main surface where the piezoelectric resonator plate is joined, and the lower lid member having a joining region on one main surface where the piezoelectric resonator plate is joined. A joining material is formed on each of the joining region of the piezoelectric resonator plate, the joining region of the upper lid member, and the joining region of the lower lid member. The joining region of the piezoelectric resonator plate and the joining region of the upper lid member are joined to each other via a joining material, and the joining region of the piezoelectric resonator plate and the joining region of the lower lid member are joined to each other via a joining material. At least one of a substrate of the joining region of the piezoelectric resonator plate, a substrate of the joining region of the upper lid member, and a substrate of the joining region of the lower lid member has a roughened surface.

公开(公告)号：EP3262755A1

公开(公告)日：2018-01-03

申请号：EP15813073.2

申请日：2015-12-18

Applicant: SnapTrack, Inc.

Inventor： METZGER, Thomas ,  PORTMANN, Jürgen

IPC: H03H9/05 ,  H03H9/10 ,  B81C1/00 ,  B81B7/02

CPC classification number: H01L41/053 ,  B81B7/02 ,  B81B2207/012 ,  B81B2207/095 ,  B81C2203/0118 ,  B81C2203/0136 ,  B81C2203/0145 ,  B81C2203/0154 ,  H01L41/047 ,  H01L41/0533 ,  H01L41/081 ,  H01L41/23 ,  H01L2221/00 ,  H01L2224/11 ,  H03H9/0547

Abstract: The invention relates to a MEMS component having an increased integration density, and to a method for producing such a component. The component comprises a base wafer and a cover wafer arranged over this. A first cavity is arranged between said base wafer and cover wafer. A second cavity is arranged over said cover wafer and beneath a thin-film cover. Said cavities contain component structures.