公开(公告)号：EP1353541A4

公开(公告)日：2005-07-20

申请号：EP02729552

申请日：2002-01-11

Applicant: MATSUSHITA ELECTRIC IND CO LTD

Inventor： NISHII TOSHIHIRO

IPC: H05K1/03 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K3/4688 ,  H05K1/0366 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4626 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/0278 ,  H05K2201/029 ,  H05K2201/0293 ,  H05K2201/10378 ,  Y10T428/24917

Abstract: A production method for a circuit board, comprising an inner-layer board laminating step of laminating at least one inner-layer metal sheet (5) on an inner-layer board material (1), an inner-layer circuit (6) forming step of forming circuits on the metal sheet to provide an inner-layer circuit board, a multi-layer laminating step of laminating together at least one multi-layer metal sheet (8), at least one multi-layer board material (7) and at least one inner-layer circuit board, and an outer-layer circuit (9) forming step of forming circuits on the multi-layer metal sheet, the inner-layer board material and the multi-layer board material being formed of materials different from each other, whereby it is possible to stabilize the quality of inter-wiring-layer connections in the inner-layer circuit board and improve the mechanical strength such as bonding strength of the outer-layer circuit.

Abstract translation: 1。一种电路基板的制造方法，其特征在于，具有：在内层基板材料（1）上层叠至少一层内层金属板（5）的内层基板层叠工序，内层电路（6） 在金属片上形成电路以提供内层电路板;多层层压步骤，将至少一个多层金属片（8），至少一个多层板材（7）和至少一个 至少一个内层电路板以及在多层金属板上形成电路的外层电路（9）形成步骤，所述内层板材和所述多层板材由不同于 由此可以稳定内层电路板中的布线层连接的质量并且提高诸如外层电路的接合强度之类的机械强度。

公开(公告)号：EP1174006B1

公开(公告)日：2004-08-18

申请号：EP00921702.7

申请日：2000-04-05

Applicant: Laminating Company of America

Inventor： MILLER, James, J. ,  DINNEWETH, Paul, E. ,  VANDERVELDE, Hans ,  HEGEDUIS, James, T.

IPC: H05K3/00 ,  B23B35/00 ,  B23Q11/10

CPC classification number: H05K3/0047 ,  B23B35/005 ,  B23B2250/12 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2203/0152 ,  H05K2203/0214 ,  H05K2203/0786 ,  H05K2203/127 ,  Y10T408/03 ,  Y10T408/561 ,  Y10T408/5623

Abstract: A method and materials for drilling through-holes in printed circuit boards with a drilling tool is disclosed. The method involves the use of a lubricating entry material (10) placed on the top surface of a stack (28) of printed circuit boards (30a-30d) and a lubricating backup board (34) placed beneath the bottom surface of the stack (28) of printed circuit boards (30a-30d). The lubricating entry material (10) has a core (20) with skins (12, 14) attached on both sides by a lubricant/adhesive (16, 18). Similarly, the backup board (34) has a core with skins (36, 38) attached on both sides by a lubricant/adhesive (40, 42). The skins (12, 14, 36, 38) are hard enough to support the top and bottom surfaces of the printed circuit boards (30a-30d) and thereby reduce burring at the entry point and exit point of the through-hole. The lubricant/adhesive (16, 18, 40, 42) coats the drilling tool (22) during the drilling operation to reduce friction and thereby reduce the temperature of the drilling tool (22).

公开(公告)号：EP1423995A2

公开(公告)日：2004-06-02

申请号：EP02763569.7

申请日：2002-08-29

Applicant: E.I. DU PONT DE NEMOURS AND COMPANY

Inventor： SAMUELS, Michael, R. ,  KAHN, Subhotosh ,  MIKHAIL, Levit, R.

IPC: H05K1/00

CPC classification number: H05K1/0366 ,  B29B13/10 ,  B32B15/14 ,  B32B27/12 ,  D04H1/4374 ,  D04H1/4382 ,  H05K1/036 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/015 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/249924 ,  Y10T428/24994 ,  Y10T428/249941 ,  Y10T442/30

Abstract: A sheet comprising thermoplastic polymer (TP) (4) and short high tensile modulus fibers (3) , in which the concentration of TP (4) in the middle of the sheet is higher than at the surface of the sheet, useful for making prepregs with a thermoset resin.

公开(公告)号：EP1242236A1

公开(公告)日：2002-09-25

申请号：EP00968951.4

申请日：2000-10-13

Applicant: Polyeitan Composites Ltd.

Inventor： COHEN, Yachin ,  REIN, Dmitry ,  VAYKHANSKY, Lev

IPC: B32B3/00 ,  B32B5/06

CPC classification number: B32B27/02 ,  B32B7/12 ,  B32B2323/043 ,  B32B2323/046 ,  B32B2457/08 ,  C08J5/04 ,  H05K1/028 ,  H05K1/032 ,  H05K1/0366 ,  H05K1/0393 ,  H05K2201/0129 ,  H05K2201/0158 ,  H05K2201/0278 ,  H05K2201/0287 ,  H05K2201/0293 ,  H05K2203/1105 ,  Y10S428/901 ,  Y10T428/24628 ,  Y10T428/24917 ,  Y10T428/249941 ,  Y10T428/249942 ,  Y10T428/2938 ,  Y10T428/31649 ,  Y10T428/31681

Abstract: A polyolefin composite for a printed circuit board or an antenna base material. A base material (12) including the composite and electronic modules including the base material (12). The base material includes at least one dielectic layer including a polyolefin composite and at least one electroconductive layer (16) including an electroconductive material, the dielectric and electroconductive layers being intimately bonded to one another through an adhesive (14).

Abstract translation: 一种用于印刷电路板或天线基材的聚烯烃复合材料。 包括含有基材（12）的复合材料和电子模块的基材（12）。 基材包括至少一个包含聚烯烃复合材料的介电层和至少一个包含导电材料的导电层（16），所述介电材料和导电层通过粘合剂（14）彼此紧密结合。

公开(公告)号：EP1064421A1

公开(公告)日：2001-01-03

申请号：EP99908993.1

申请日：1999-03-19

Applicant: Ahlstrom Glassfibre OY

Inventor： RÖKMAN, Kay ,  SABEL, Hakan

IPC: D04H1/42 ,  H05K1/03

CPC classification number: B29C70/12 ,  B29K2105/128 ,  B29L2031/3425 ,  D21H13/26 ,  D21H17/36 ,  D21H17/52 ,  H05K1/0366 ,  H05K3/022 ,  H05K2201/0278 ,  H05K2201/0293

Abstract: A printed circuit board is made from at least one non-woven sheet or web layer comprising at least 10 % weight aramid fibers, with any balance substantially electrically non-conductive fibers, filler, and binder. The sheet or web is preferably made by the foam process, and at least about 10 % (e.g. at least about 60 %) of the aramid fibers utilized are aramid pulp fibers which have a number of advantages compared to the conventional straight aramid fibers. The web or sheet is preferably compressed so that it has a density of about 0.1-0.2 grams per cubic. centimeter; and the web or sheet has a basis weight of between about 20-120 grams per square meter. The web may also have a substantially electrically non-conductive binder such as PVA or an epoxy resin. A printed circuit board made using the aramid layers of non-woven webs or sheets is otherwise conventional, including a pre-preg material, electrically conductive circuit elements, and electronics.

公开(公告)号：EP1030543A1

公开(公告)日：2000-08-23

申请号：EP00103237.4

申请日：2000-02-17

Applicant: Matsushita Electric Industrial Co., Ltd.

Inventor： Echigo, Fumio ,  Kawakita, Yoshihiro

IPC: H05K1/03

CPC classification number: D21H13/20 ,  B29C70/12 ,  D04H1/587 ,  D04H1/60 ,  D04H1/64 ,  H05K1/0366 ,  H05K3/4069 ,  H05K2201/015 ,  H05K2201/0175 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/259 ,  Y10T428/27 ,  Y10T442/2861 ,  Y10T442/2902

Abstract: The present invention provides a nonwoven fabric material prepared from short fibers (1) including thermal-resistant synthetic fibers bound with an inorganic binder (2), a prepreg and a circuit board using the same. The circuit board has an excellent dimensional stability even at a high temperature, and the circuit board is prevented from warping or being damaged by moisture absorption or the like. The inorganic binder (2) is a residue formed from a low melting point glass solution or a water-dispersible colloidal solution including at least either fibers or particles of low melting point glass dispersed therein. When the binder is used, a chemical covalent bonding by a siloxane bonding is formed.

Abstract translation: 本发明提供一种由短纤维（1）制成的非织造织物材料，其包括与无机粘合剂（2）结合的耐热合成纤维，预浸料和使用其的电路板。 电路板即使在高温下也具有优异的尺寸稳定性，并且防止电路板翘曲或被吸湿等损坏。 无机粘合剂（2）是由低熔点玻璃溶液或分散在其中的至少包含纤维或低熔点玻璃颗粒的水分散性胶体溶液形成的残渣。 当使用粘合剂时，形成通过硅氧烷键合的化学共价键合。

公开(公告)号：EP1006237A1

公开(公告)日：2000-06-07

申请号：EP99122053.4

申请日：1999-11-17

Applicant: OJI PAPER CO., LTD. ,  SHIN-KOBE ELECTRIC MACHINERY CO. LTD

Inventor： Ueno, Hiroyoshi ,  Kato, Yoshihisa ,  Ichioka, Isao ,  Adachi, Takekazu ,  Murata, Mamoru ,  Hiraoka, Hirokazu ,  Ochida, Manabu ,  Noda, Masayuki

IPC: D21H21/18 ,  D21H25/06 ,  D21H27/30 ,  B32B29/00

CPC classification number: B32B5/26 ,  B32B5/022 ,  B32B15/14 ,  B32B15/20 ,  B32B37/00 ,  B32B37/10 ,  B32B38/0036 ,  B32B38/16 ,  B32B38/164 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/0269 ,  B32B2305/28 ,  B32B2309/02 ,  B32B2311/12 ,  B32B2398/10 ,  B32B2457/08 ,  D21H13/26 ,  D21H17/52 ,  D21H21/18 ,  D21H25/06 ,  D21H27/30 ,  H05K1/0366 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2203/1105 ,  Y10T428/249925 ,  Y10T428/249998 ,  Y10T428/31725 ,  Y10T428/31728 ,  Y10T442/20 ,  Y10T442/2951 ,  Y10T442/60 ,  Y10T442/696 ,  Y10T442/697 ,  Y10T442/699

Abstract: The present invention is to provide a base material for a laminate having a high strength, reduced thickness, and light weight. In the present invention, a base material is prepared by incorporating a thermosetting resin binder into a non-woven fabric of para-aramid fibers prepared by a wet type paper making, and then heating a plurality of the resultant non-woven fabric sheets under pressure. The non-woven fabric sheet comprises 95 to 70 mass % of the para-aramid fibers and 5 to 30 mass % of the thermosetting resin binder.

Abstract translation: 本发明提供一种具有高强度，厚度减薄，重量轻的层压体用基材。 在本发明中，通过将热固性树脂粘合剂结合到通过湿式造纸制备的对位芳族聚酰胺纤维的无纺织物中，然后在压力下加热多个所得的无纺布片材来制备基材 。 无纺布片包含95〜70质量％的对位芳族聚酰胺纤维和5〜30质量％的热固性树脂粘合剂。

公开(公告)号：EP0990512A1

公开(公告)日：2000-04-05

申请号：EP99118094.4

申请日：1999-09-27

Applicant: SHIN-KOBE ELECTRIC MACHINERY CO. LTD ,  OJI PAPER CO., LTD.

Inventor： Kurumatani, Shigeru ,  Hiraoka, Hirokazu ,  Noda, Masayuki ,  Terao, Tomoyuki ,  Toyoshima, Setsuo ,  Kato, Yoshihisa ,  Ueno, Hiroyoshi

IPC: B32B15/04 ,  B32B15/08 ,  H05K1/03 ,  C08J5/04 ,  C08J5/24 ,  H01L23/14 ,  D21H13/26

CPC classification number: B32B5/26 ,  B32B5/022 ,  B32B15/14 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/0269 ,  B32B2457/08 ,  C08J5/04 ,  D21H13/26 ,  D21H17/52 ,  H01L23/145 ,  H01L2924/0002 ,  H05K1/0366 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10S428/901 ,  Y10T442/2475 ,  Y10T442/60 ,  Y10T442/692 ,  Y10T442/696 ,  Y10T442/697 ,  H01L2924/00

Abstract: A non-woven fabric comprising a principal component of para-aramid fiber chops bonded with each other by a binder, the para-aramid fiber chops having a mixture of (a) poly-p-phenylene-3,4'-diphenylether-terephthalamide fibers and (b) poly-p-phenylene-terephthalamide fibers and having a blend ratio by weight of (a)/(b) = 10/90 ∼ 90/10 and preferably (a)/(b) = 30/70 ∼ 70/30 .

Abstract translation: 一种无纺布，其包含通过粘合剂彼此粘合的对位芳族聚酰胺纤维剁的主要组分，对位芳族聚酰胺纤维剁具有（a）聚对亚苯基-3,4'-二苯基醚 - 对苯二甲酰胺 纤维和（b）聚对苯二甲酰对苯二胺纤维，其重量比（a）/（b）= 10/90〜90/10，优选（a）/（b）= 30/70 70/30。

公开(公告)号：EP0790341A3

公开(公告)日：1999-08-25

申请号：EP97301038.2

申请日：1997-02-18

Applicant: TEIJIN LIMITED

Inventor： Murayama, Sadamitsu, c/o Teijin Limited

IPC: D04H1/42 ,  D04H1/60

CPC classification number: H05K1/0366 ,  D04H1/4342 ,  D04H1/60 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T442/2902 ,  Y10T442/697

Abstract: A wholly aromatic polyamide staple fiber fabric having excellent insulation and superior dimensional stability at a high temperature and/or a high humidity, includes 70 to 96 parts by weight of a staple fiber web made from a blend of 5 to 30% by weight of m-type wholly aromatic polyamide staple fibers and 70 to 95% by weight of p-type wholly aromatic polyamide staple fibers, and 4 to 30 parts by weight of an organic resin binder incorporated into the staple fiber web.

公开(公告)号：EP0792737A3

公开(公告)日：1998-07-22

申请号：EP97102705

申请日：1997-02-19

Applicant: SUMITOMO BAKELITE CO

Inventor： NAKATA TAKAHIRO ,  IIDA TAKAHISA ,  YAMAGUCHI TAKASHI ,  KANAZAWA TOSHIHIDE

IPC: B32B17/04 ,  B29C70/02 ,  B29C70/50 ,  B32B5/28 ,  B32B27/04 ,  H05K1/03 ,  B32B31/12

CPC classification number: B32B5/26 ,  B29C70/025 ,  B29C70/50 ,  B32B5/022 ,  B32B5/024 ,  B32B5/28 ,  B32B37/0038 ,  B32B38/08 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2305/20 ,  B32B2305/30 ,  B32B2457/08 ,  H05K1/036 ,  H05K1/0366 ,  H05K2201/0209 ,  H05K2201/0284 ,  H05K2201/0293

Abstract: A laminated board comprising an intermediate layer and two surface layers formed thereon, in which board the intermediate layer comprises a central layer made of a nonwoven glass fiber fabric impregnated with a resin composition containing a thermosetting resin and an inorganic filler and upper and lower layers formed on the central layer, each being made of said resin composition containing a thermosetting resin and an inorganic filler, and the two surface layers formed on the intermediate layer are made of a thermosetting resin-impregnated fiber substrate; and a process for production of the laminated board.