公开(公告)号：EP0742962B1

公开(公告)日：1999-04-07

申请号：EP95906973.3

申请日：1995-01-18

Applicant: HOLLANDSE SIGNAALAPPARATEN B.V.

Inventor： TEUNISSE, Petrus, Johannus, Stephanus

IPC: H01P3/08

CPC classification number: H01P3/085 ,  H05K1/024 ,  H05K2201/0116 ,  H05K2201/064 ,  H05K2201/0715

Abstract: The invention relates to a transmission-line network of the foam stripline type. To reduce dielectric losses in the foam (6, 7), at least a part of the foam in the region of the stripline (1) is removed such that the wave properties of the transmission-line network are not impaired. Moreover the ducts (9, 10) that are formed may be used for the forced cooling of the stripline (1) using air or another cooling agent.

公开(公告)号：EP0844808A3

公开(公告)日：1998-12-09

申请号：EP97120236.1

申请日：1997-11-19

Applicant: ILFA Industrieelektronik und Leiterplattenfertigung aller Art GmbH

Inventor： Süllau,Walter ,  Ilgen,Hermann ,  Schütze,Jörg

IPC: H05K1/02 ,  H05K7/20

CPC classification number: H05K7/20254 ,  H05K1/0272 ,  H05K2201/064

Abstract: Eine Leiterplattenanordnung mit mindestens zwei Leiterplatten, die mit elektrischen Leiterbahnen versehen und mit Wärme erzeugenden Bauelementen bestückt sind, umfaßt als integrierten Bestandteil der Leiterplattenanordnung eine Kühlplatte (18) die mit Kühlkanälen (24) versehen ist. Die Kühlplatte umfaßt eine auf einer Trägerschicht (26) angeordnete wärmeleitende Kühlschicht (22), wobei die Kühlkanäle als einseitig offene Kanäle in der Kühlschicht verlaufen und durch eine zur Kühlplatte gehörende Isolierplatte (20) abgedeckt sind.

公开(公告)号：EP0611068B1

公开(公告)日：1997-03-26

申请号：EP94300586.8

申请日：1994-01-26

Applicant: AT&T Corp.

Inventor： Nordin, Ronald Alex

IPC: H05K7/20

CPC classification number: H05K1/0204 ,  H05K2201/064 ,  H05K2201/09054 ,  H05K2201/10689

公开(公告)号：EP0238915A1

公开(公告)日：1987-09-30

申请号：EP87103231.4

申请日：1987-03-06

Applicant: Dyconex AG

Inventor： Schmidt, Walter, Dr.

IPC: H05K1/14 ,  H05K1/18 ,  H05K7/10

CPC classification number: H05K1/147 ,  H05K1/0204 ,  H05K1/0272 ,  H05K1/0393 ,  H05K1/141 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/325 ,  H05K3/365 ,  H05K7/1053 ,  H05K2201/056 ,  H05K2201/064

Abstract: Es wird eine mehrschichtige Verbindungs- und Schaltungs­anordnung mit integrierten Halbleiter- und Hybridbauele­menten vorgeschlagen.
Auf einem mindestens auf einer Seite mit einer Leiter­platte (21,23) versehenen Trägerelement (30,30ʹ) sind in mehreren, matrixartig in der Leiterplatte (21,23) ange­ordneten Ausnehmungen (22,24) Modul-Baueinheiten (10, 10ʹ;110,110ʹ) angeordnet und lösbar auf dem Trägerele­ment befestigt.
Die einzelne, elektrisch mit der Leiterplatte (21,23) des Trägerelements (30,30ʹ) wirkverbundene Modul-Bauein­heit (10,10ʹ;110,110ʹ) umfasst eine mehrlagige Leiter­platte (17), auf welcher mehrere passive und/oder aktive elektrische Komponenten (11 bis 15) angeordnet und elek­trisch mit der auf einer Bodenplatte (16) auflamierten Leiterplatte (17) wirkverbunden sind.

Abstract translation: 提出了具有集成的半导体和混合部件的多层连接和电路装置。 模块化部件（10,10'; 110,110'）布置和可拆卸地安装在支撑元件（30,30'）上，在支撑元件（30,30'）上设置有至少一个侧面上的印刷电路板（21,23） （22,24），以矩阵的形式布置在印刷电路板（21,23）中。 可操作地连接到支撑元件（30,30'）的印刷电路板（21,303）的单个模块化部件（10,10'; 110,110'）包括多层印刷电路板 多个被动和/或有源电气部件（11至15）布置在其上并且电连接到层压到基板（16）上的印刷电路板（17）上。

公开(公告)号：EP3335529A1

公开(公告)日：2018-06-20

申请号：EP16822551.4

申请日：2016-11-04

Applicant: Ozyegin Universitesi ,  Farba Otomotiv Aydinlatma ve Plastik Fabrikalari Anonim Sirketi

Inventor： ARIK, Mehmet ,  SAATI KHOSROSHAHI, Ferina

IPC: H05K1/02 ,  F21K9/00 ,  H05K1/05

CPC classification number: H05K1/0209 ,  F21V23/005 ,  F21V29/51 ,  F21Y2105/18 ,  F21Y2115/10 ,  H05K1/0203 ,  H05K1/056 ,  H05K2201/064 ,  H05K2201/09027 ,  H05K2201/09781 ,  H05K2201/10106

Abstract: Disclosed is a PCB used in multifunctional LED applications, having an electronic side with circuit components and a LED side with lighting components; which has at least one metal surface coated on the ground of the mentioned electronic side, at least one metal surface coated on the ground of the mentioned LED surface, or at least one pipe located in the inner cross-section of the mentioned PCB in order to reduce the heating generated on the mentioned PCB by dissipating it over the surface of board.

公开(公告)号：EP2532216A4

公开(公告)日：2018-04-11

申请号：EP11740411

申请日：2011-02-04

Applicant: BLACK TANK LLC

Inventor： KODADEK III ROBERT E

IPC: H05K1/02 ,  F21V29/67 ,  F21Y115/10

CPC classification number: F21V29/67 ,  F21V29/02 ,  F21V29/673 ,  F21Y2115/10 ,  H05K1/0206 ,  H05K1/0209 ,  H05K1/0272 ,  H05K2201/064 ,  H05K2201/066 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/10106 ,  H05K2201/10242 ,  H05K2201/10257 ,  H05K2201/10545

Abstract: A thermal management system for an electrical component includes a printed circuit board (PCB) capable of receiving the electrical component on a first side of the PCB. An elongate member has one end attached to a second side of the PCB, and another end disposed away from the PCB. The elongate member also has an open interior that facilitates fluid communication between the two ends. One of the ends defines an at least partially closed boundary on the PCB. The PCB includes an aperture disposed therethrough proximate the boundary such that fluid communication is facilitated between the first side of the PCB and the second side of the PCB, and along at least a portion of the elongate member.

公开(公告)号：EP3218957A1

公开(公告)日：2017-09-20

申请号：EP14882794.2

申请日：2014-12-15

Applicant: Siemens Aktiengesellschaft ,  Limited Liability Company "Siemens"

Inventor： KRASNOV, Andrey Aleksandrovich ,  ZERB, Marcus

IPC: H01P5/10

CPC classification number: H01F27/10 ,  H01F27/2804 ,  H01F27/2876 ,  H01F2027/2809 ,  H01L2924/0002 ,  H01P5/10 ,  H05K1/0265 ,  H05K1/0272 ,  H05K1/0306 ,  H05K1/165 ,  H05K2201/064 ,  H01L2924/00

Abstract: A fluid-cooled balun transformer that includes a substrate plate with a first and an opposite second face, a first and a second conductive element arranged on the first and the second face, respectively, wherein a first and a second signal port electrically is connected to the first and the second conductive element, respectively, and a cooling module, where the second conductive element is transformingly coupled to the first conductive element and electrically isolated therefrom, the cooling module includes a first tubular member, the first tubular member has a fluid inlet to receive a coolant fluid into the first tubular member, a flow channel to conduct a flow of coolant fluid within the first tubular member and a fluid outlet to release the coolant fluid from the first tubular member, and where the flow channel of the first tubular member is arranged in thermal contact with the first conductive element.

Abstract translation: 本技术提出了一种流体冷却平衡 - 不平衡变压器变压器，其包括具有第一面和相对的第二面的基板，分别布置在第一面和第二面上的第一导电元件和第二导电元件，电连接的第一信号端口和第二信号端口 分别连接到第一和第二导电元件，以及冷却模块。 第二导电元件可变形地耦合到第一导电元件并且与其电隔离。 冷却模块包括第一管状构件。 第一管状构件具有流体入口以接收冷却剂流体进入第一管状构件，流动通道在第一管状构件内引导冷却剂流体流动，流体出口从第一管状构件释放冷却剂流体。 第一管状构件的流动通道布置成与第一导电元件热接触。

公开(公告)号：EP2963343B1

公开(公告)日：2017-06-28

申请号：EP14175892.0

申请日：2014-07-05

Applicant: Swareflex GmbH

Inventor： Reisigl, Harald

IPC: F21V29/70 ,  F21K9/20 ,  F21V29/83 ,  H05K1/02 ,  F21V5/04 ,  F21V17/10 ,  F21V19/00 ,  F21V19/04 ,  F21V29/89 ,  F21V31/03 ,  F21V31/04 ,  F21W131/10 ,  F21W131/101 ,  F21W131/105 ,  F21Y101/00 ,  F21Y105/10 ,  F21Y115/10 ,  H05K3/00

CPC classification number: H05K1/0203 ,  F21K9/20 ,  F21K9/69 ,  F21V5/048 ,  F21V17/101 ,  F21V19/005 ,  F21V19/0055 ,  F21V19/045 ,  F21V29/70 ,  F21V29/83 ,  F21V29/89 ,  F21V31/03 ,  F21V31/04 ,  F21W2131/10 ,  F21W2131/101 ,  F21W2131/105 ,  F21Y2105/10 ,  F21Y2115/10 ,  H05K3/0061 ,  H05K2201/064 ,  H05K2201/09063 ,  H05K2201/10106 ,  H05K2201/10409

公开(公告)号：EP2727142B1

公开(公告)日：2017-03-15

申请号：EP12719527.9

申请日：2012-04-11

Applicant: Apple Inc.

Inventor： DEGNER, Brett W. ,  TICE, Gregory

IPC: G06F1/20 ,  H01L23/40 ,  H05K7/12 ,  H05K3/30 ,  H05K7/20 ,  H01L23/427 ,  H01L23/473

CPC classification number: G06F1/20 ,  H01L23/4006 ,  H01L23/427 ,  H01L23/473 ,  H01L2924/0002 ,  H05K3/301 ,  H05K7/12 ,  H05K7/20 ,  H05K7/20254 ,  H05K2201/064 ,  H05K2201/10265 ,  H05K2201/10325 ,  H05K2201/10393 ,  H05K2201/10704 ,  H05K2203/0278 ,  Y10T29/49124 ,  Y10T29/49826 ,  Y10T29/53113 ,  H01L2924/00

公开(公告)号：EP2985788A1

公开(公告)日：2016-02-17

申请号：EP14181005.1

申请日：2014-08-14

Applicant: ABB Technology Oy

Inventor： Kearney, Daniel ,  Agostini, Francesco ,  Cottet, Didier ,  Torresin, Daniele ,  Habert, Mathieu

IPC: H01L23/473 ,  H01L23/538 ,  H05K1/02

CPC classification number: H01L23/473 ,  H01L23/3121 ,  H01L23/5389 ,  H01L2924/0002 ,  H05K1/0272 ,  H05K1/185 ,  H05K3/4697 ,  H05K2201/0116 ,  H05K2201/064 ,  H01L2924/00

Abstract: The present disclosure relates to a power semiconductor module comprising a printed circuit board (PCB), and to method of cooling such a power semiconductor module. The module comprises a power semiconductor device and an island of thermally conducting foam embedded into the printed circuit board. The power semiconductor device and the island of thermally conducting foam are positioned on top of each other, and the island is arranged to form a path for a flowing coolant cooling the power semiconductor device.

Abstract translation: 本发明涉及包括印刷电路板（PCB）的功率半导体模块，以及冷却这种功率半导体模块的方法。 模块包括功率半导体器件和嵌入印刷电路板的导热泡沫岛。 功率半导体器件和导热泡沫岛位于彼此的顶部，并且岛被布置成形成冷却功率半导体器件的流动冷却剂的路径。