公开(公告)号：EP2661777A4

公开(公告)日：2016-10-19

申请号：EP12732251

申请日：2012-01-09

Applicant: BRIDGELUX INC

Inventor： WEST R SCOTT

IPC: H01L33/62 ,  H01L25/075 ,  H01L33/48 ,  H01L33/64 ,  H05K1/02 ,  H05K3/34

CPC classification number: H01L33/62 ,  H01L24/29 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/644 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83447 ,  H01L2224/85447 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2933/0066 ,  H05K1/021 ,  H05K3/0061 ,  H05K2201/09145 ,  H05K2201/09845 ,  H05K2201/10106 ,  H05K2201/10409 ,  H01L2924/0665 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

公开(公告)号：EP2792221B1

公开(公告)日：2015-08-26

申请号：EP11805771.0

申请日：2011-12-14

Applicant: Dula-Werke Dustmann & Co. GmbH

Inventor： MEIS, Alfons

IPC: H05K1/11 ,  A47B97/00 ,  A47F5/08 ,  A47F11/10

CPC classification number: H01R25/14 ,  A47B57/40 ,  A47B97/00 ,  A47B2220/0077 ,  A47F5/103 ,  H01R25/16 ,  H05K1/118 ,  H05K2201/09145 ,  H05K2201/10189 ,  H05K2201/2009

公开(公告)号：EP2572561A2

公开(公告)日：2013-03-27

申请号：EP11725894.7

申请日：2011-06-03

Applicant: Plastic Logic Limited

Inventor： RIEDEL, David ,  LIEHR, Stefan ,  CORTEGA-CAGARA, Rina

IPC: H05K3/00 ,  H05K1/02 ,  H05K3/28 ,  H01L21/67 ,  H01L23/31 ,  H01L23/495 ,  H05K1/18 ,  H05K3/32

CPC classification number: H05K3/0011 ,  H01L23/544 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/5446 ,  H01L2223/5448 ,  H01L2924/0002 ,  H05K1/0269 ,  H05K1/189 ,  H05K3/0052 ,  H05K3/06 ,  H05K3/28 ,  H05K3/323 ,  H05K2201/0108 ,  H05K2201/09145 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2201/10681 ,  H05K2203/0126 ,  H05K2203/0228 ,  H05K2203/1147 ,  H05K2203/166 ,  Y10T29/49155 ,  Y10T29/49789 ,  H01L2924/00

Abstract: A technique comprising: forming a plurality of smaller substrates from one or more larger substrates by a reduction process according to which there is some possible variation size between the smaller substrates within a variation range; and, in advance of said reduction process, providing said one or more larger substrates with one or more detection marks whose size and location are selected such that after the reduction process each smaller substrate includes a portion of at least one of said one or more detection marks, said portion having one or more edges that coincide with at least a part of one or more edges of the smaller substrate whatever actual size the smaller substrate has within said variation range.

公开(公告)号：EP2275857B1

公开(公告)日：2012-11-14

申请号：EP10006979.8

申请日：2010-07-06

Applicant: Hitachi Displays, Ltd. ,  Panasonic Liquid Crystal Display Co., Ltd.

Inventor： Miyazaki, Hiroyuki

IPC: G02F1/13 ,  H05K1/18

CPC classification number: G02F1/13452 ,  G02F1/133308 ,  G02F2201/503 ,  H05K1/118 ,  H05K2201/09145

公开(公告)号：EP2275857A1

公开(公告)日：2011-01-19

申请号：EP10006979.8

申请日：2010-07-06

Applicant: Hitachi Displays, Ltd.

Inventor： Miyazaki, Hiroyuki

IPC: G02F1/13 ,  H05K1/18

CPC classification number: G02F1/13452 ,  G02F1/133308 ,  G02F2201/503 ,  H05K1/118 ,  H05K2201/09145

Abstract: Provided is a display device including: a display panel 10; a circuit board 14; a connector 16 mounted on the circuit board; a flexible wiring board 18 attached to the connector; and a housing 20 which accommodates the display panel, the circuit board, and one part of the flexible wiring board, and includes a slit 28 formed therein, from which another part of the flexible wiring board is pulled out. The flexible wiring board includes, in the one part of the flexible wiring board, a first region extending in directions which intersect a pull-out direction from the slit, and having a width which is larger than a width of the flexible wiring board at a position overlapping the slit.

Abstract translation: 提供了一种显示装置，包括：显示面板10; 一个电路板14; 安装在电路板上的连接器16; 连接到连接器的柔性布线板18; 以及容纳显示面板，电路板和柔性布线板的一部分的壳体20，并且包括形成在其中的狭缝28，柔性布线板的另一部分从所述狭缝28拔出。 柔性布线板在柔性布线板的一部分中包括第一区域和第二区域，第一区域在与狭缝的拉出方向交叉的方向上延伸，并且宽度大于柔性布线板的宽度 与狭缝重叠的位置。

公开(公告)号：EP2070159B1

公开(公告)日：2010-12-22

申请号：EP07813572.0

申请日：2007-07-31

Applicant: Raytheon Company

Inventor： PUZELLA, Angelo M. ,  CROWDER, Joseph M. ,  DUPUIS, Patricia S. ,  FALLICA, Michael C. ,  FRANCIS, John B. ,  LICCIARDELLO, Joseph A.

IPC: H01Q21/00

CPC classification number: H01Q21/0087 ,  H03H7/38 ,  H05K1/0251 ,  H05K1/116 ,  H05K3/429 ,  H05K3/4623 ,  H05K2201/09145 ,  H05K2201/09454 ,  H05K2201/09536 ,  H05K2201/09718 ,  H05K2201/09727 ,  H05K2201/209 ,  H05K2203/061 ,  Y10T29/49165

Abstract: A tile subarray includes an upper multi-layer assembly (UMLA) provided from a first plurality of printed circuit boards and a lower multi-layer assembly (LMLA) provided from a second plurality of printed circuit boards. Each of the UMLA and LMLA includes one or more radio frequency (RF) interconnects between different circuit layers on different circuit boards which make up the UMLA and LMLA. The RF interconnects can include one or more RF matching pads which provide a mechanism for matching impedance characteristics of RF stubs to provide the RF interconnects having desired insertion loss and impedance characteristics over a desired RF operating frequency band. The RF matching pads allow the manufacture of circuit boards having RF interconnects without the need to perform any back drill and back fill operation to remove stub portions of the RF interconnects in the UMLA and LMLA.

公开(公告)号：EP2223580A1

公开(公告)日：2010-09-01

申请号：EP08855005.8

申请日：2008-11-25

Applicant: Paananen, Kimmo

Inventor： Paananen, Kimmo

IPC: H05K3/36 ,  H05K3/00

CPC classification number: H05K3/0097 ,  H05K1/0269 ,  H05K2201/09145 ,  H05K2201/09918 ,  H05K2201/209 ,  H05K2203/0165 ,  H05K2203/166 ,  H05K2203/167 ,  Y10T29/49124

Abstract: The invention relates to a method for connecting at least two printed circuit board modules to form a printed circuit board panel by means of a virtual panel. The method for connecting printed circuit board modules uses positioning tags and counterparts thereof, which align the printed circuit board modules to a target location on the printed circuit board panel.

公开(公告)号：EP1965614B1

公开(公告)日：2010-04-28

申请号：EP05819643.7

申请日：2005-12-22

Applicant: Panasonic Corporation

Inventor： FUJIWARA, Yoshihito c/o Matsushita Electric Ind. Co., Ltd. ,  KAWABATA, Masahito c/o Matsushita Electric Ind. Co., Ltd.

IPC: H05K1/14 ,  H05K3/36 ,  H05K3/30 ,  H05K3/32

CPC classification number: H05K3/361 ,  H05K3/3494 ,  H05K2201/062 ,  H05K2201/09145 ,  H05K2203/0278

公开(公告)号：EP1254592B1

公开(公告)日：2009-01-07

申请号：EP01902582.4

申请日：2001-02-09

Applicant: Tyco Electronics Belgium EC N.V.

Inventor： LONGUEVILLE, Jacques ,  OCKET, Tom ,  HOOLHORST, Albert ,  BAERTSOEN, Peter

IPC: H05K3/30 ,  H05K1/11 ,  H01R12/18

CPC classification number: H01R12/721 ,  H05K1/117 ,  H05K3/303 ,  H05K2201/09145 ,  H05K2203/0195 ,  H05K2203/167 ,  Y02P70/613 ,  Y10S439/951

Abstract: A printed circuit board (1) provided with an attachement (3) which surrounds surface contacts (11) of the printed circuit board (1) that are to be contacted by a printed circuit board connector that covers the portion of the printed circuit board (1) and edges of the printed circuit board (1) around the surface contacts (11) and includes recesses (31) corresponding to the surface contacts (11) assuring proper connection with contacts (21) of a printed circuit board connector.

Abstract translation: 一种印刷电路板（1），该印刷电路板设有围绕印刷电路板（1）的表面触点（11）的附件（3），所述附件将被印刷电路板连接器接触，所述印刷电路板连接器覆盖印刷电路板 1）和印刷电路板（1）的边缘围绕表面触点（11）并且包括对应于表面触点（11）的凹槽（31），以确保与印刷电路板连接器的触点（21）的适当连接。

公开(公告)号：EP1681910B1

公开(公告)日：2008-06-18

申请号：EP05026961.2

申请日：2005-12-09

Applicant: Epson Imaging Devices Corporation

Inventor： Idenishi, Naohiro c/o Sanyo Epson Imaging Dev. Corp.

IPC: H05K1/11 ,  H01R13/02

CPC classification number: H01R12/721 ,  H01R12/774 ,  H01R12/775 ,  H01R12/79 ,  H01R13/025 ,  H05K1/118 ,  H05K3/0058 ,  H05K2201/09145 ,  H05K2201/2009 ,  H05K2203/167