公开(公告)号：EP0556184B1

公开(公告)日：1996-02-28

申请号：EP91914556.5

申请日：1991-08-15

Applicant: HILLER, Peter

Inventor： HILLER, Peter

IPC: H05K1/18

CPC classification number: H05K1/184 ,  H05K3/3421 ,  H05K3/3442 ,  H05K3/4046 ,  H05K2201/10166 ,  H05K2201/10583 ,  H05K2201/10659

Abstract: The invention concerns a circuit board with electrical components which are inserted, together with their insulating elements (3), in throughbores (10) in the circuit board (9). The components project out slightly beyond the upper and lower surfaces of the circuit board. The projecting ends have contact surfaces which are soldered to conductions tracks on the circuit board. The lower ends of the components have hemispherically domed or rounded conical tips with contact surfaces which fit into conductor tracks designed as soldering eyes (7) on the circuit board (9) and are soldered to these soldering eyes . The upper ends of the components have several contact surfaces (1.1, 1.2) which are insulated from each other and which are joined to contact elements (2.1, 2.2) projecting out away from the insulating elements (3), the contact elements (2.1, 2.2) being joined by solder (5) at intervals round the bores (10) to conductor tracks (6) on the upper surface of the circuit board.

公开(公告)号：EP0249277A2

公开(公告)日：1987-12-16

申请号：EP87201033.5

申请日：1987-06-02

Applicant: Philips Patentverwaltung GmbH ,  Philips Electronics N.V.

Inventor： Düll, Helmut ,  Flunkert, Horst, Dr.

IPC: H05K3/34 ,  H01C1/148

CPC classification number: H01G2/065 ,  H01C1/148 ,  H01C17/006 ,  H01F27/292 ,  H05K3/3442 ,  H05K2201/10583 ,  H05K2201/10636 ,  H05K2201/10916 ,  Y02P70/611 ,  Y02P70/613

Abstract: Passives elektrisches, für SMD-Technik geeignetes Bauele­ment mit einem zylindrischen oder quaderförmigen Träger­körper und elektrischen Anschlußkontakten an seinen Enden, die den Trägerkörper rohrförmig umschließen und die Stirn­flächen des Trägerkörpers freilassen.

Abstract translation: 无源电器制品，适合于具有在其端部的圆筒形或平行六面体形承载体和电连接触点，包围支承体SMD技术组件是管状的，并且释放所述承载体的面。

公开(公告)号：EP2909876B1

公开(公告)日：2016-10-19

申请号：EP14701570.5

申请日：2014-01-28

Applicant: Alligator Ventilfabrik GmbH

Inventor： MARKERT, Christian

IPC: H01M2/02 ,  H01M2/10 ,  H05K3/32 ,  H01R13/24 ,  H01M2/20 ,  H01M2/04 ,  B60C23/04 ,  H05K3/34

CPC classification number: H01M2/0222 ,  B60C23/04 ,  B60C23/041 ,  B60C23/0494 ,  H01M2/026 ,  H01M2/0277 ,  H01M2/1044 ,  H01M2/20 ,  H01M2220/30 ,  H05K3/3426 ,  H05K2201/10151 ,  H05K2201/10583 ,  Y02P70/613

公开(公告)号：EP2204080A1

公开(公告)日：2010-07-07

申请号：EP08833375.2

申请日：2008-09-24

Applicant: Molex Incorporated

Inventor： MCNAMARA, Niall ,  MAGUIRE, Brendan ,  O'SULLIVAN, Denis ,  MCMAHON, SeanGearoid ,  REIDY, Colm ,  CRAMPTON, Michael

IPC: H05K3/30 ,  H05K7/12

CPC classification number: H05K3/301 ,  H05K3/308 ,  H05K7/12 ,  H05K2201/09827 ,  H05K2201/10015 ,  H05K2201/10325 ,  H05K2201/10583 ,  H05K2201/1059 ,  H05K2201/10606

Abstract: An electrical component mounting assembly is disclosed for attaching a cylindrical electrical component (Cl) such as capacitor, diode, or resistor to a mounting member such as a printed circuit board in a horizontal or vertical orientation. The mounting assembly can have a housing (12) and a sleeve (14) placed around the electrical component which cooperates with the housing to retain the electrical component to the housing. A substantially inner cylindrical wall (32) of the housing can taper inward from an entrance (34) end to a rear wall (18) to form a tapering or narrowing chamber (30). The sleeve can have a slit that runs along the entire length of the sleeve and a tapered outer surface (28) that cooperates with the tapered chamber to clamp or compress against the electrical component as the sleeve is inserted into the housing. The lack of appreciable expansion of the housing creates a tight friction fit to secure the sleeve to the housing. The sleeve can also include a plank that is received in an opening in the housing which can be heat staked to reinforce the friction fit taper lock between the housing and sleeve. The housing can be dimensioned to mount more than one electrical component diameter size by varying the dimensions of the sleeve, and in particular the thickness of sleeve.

公开(公告)号：EP1983810A3

公开(公告)日：2009-10-14

申请号：EP08153927.2

申请日：2008-04-01

Applicant: Delphi Technologies, Inc.

Inventor： Stillabower, Morris D. ,  Venkatesan, Sathur ,  Wittmer, Philip W.

IPC: H05K3/34

CPC classification number: H05K3/306 ,  H05K3/305 ,  H05K3/3447 ,  H05K2201/0129 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10037 ,  H05K2201/10454 ,  H05K2201/10462 ,  H05K2201/10583 ,  H05K2201/10977 ,  H05K2203/1105 ,  Y10T29/4913

Abstract: A process for stabilizing an electrical component having a body and electrical leads projecting from the body and received in through-holes defined in a substrate, while avoiding disadvantages associated with dispensing a hot-melt adhesive during assembly of an electrical package, involves steps of providing a circuit substrate having through-holes for receiving the leads of a leaded electrical component, providing an electrical component having a body and leads extending from the body, positioning a preformed hot-melt adhesive on the circuit substrate or on the electrical component, positioning the electrical component on the circuit substrate so that the leads extend into the through-holes and so that the preformed hot-melt adhesive is positioned between and fills the gap between the body of the electrical component and the substrate, and activating and solidifying the hot-melt adhesive to securely adhere the body of the electrical component to the substrate.

公开(公告)号：EP2068603A2

公开(公告)日：2009-06-10

申请号：EP08163498.2

申请日：2008-09-02

Applicant: Delphi Technologies, Inc.

Inventor： Kerr, Geoffrey Howard ,  Hogan, Michael P.

IPC: H05K1/18 ,  H05K3/30

CPC classification number: H05K3/301 ,  H05K3/3447 ,  H05K2201/0133 ,  H05K2201/10015 ,  H05K2201/10295 ,  H05K2201/10393 ,  H05K2201/10409 ,  H05K2201/10583 ,  H05K2201/10969 ,  H05K2201/2045

Abstract: An electronic assembly having a large or massive electronic component mounted to a circuit substrate is stabilized against movement due to shock and/or vibration by an elastic dampening member disposed between the large electronic component and a clamping member that compresses the dampening member between the clamping member and the electronic component and urges opposite end walls of the dampening member against opposite sidewalls of the electronic component to securely grip the electronic component between the opposite end walls of the dampening member. The arrangement is effective for reducing and/or eliminating damage and subsequent failure due to exposure of the electronic assembly to shock and/or vibration.

Abstract translation: 具有安装到电路基板上的大型或块状电子部件的电子组件被设置在大型电子部件与夹紧部件之间的弹性缓冲部件所引起的冲击和/或振动所阻止的运动稳定，所述夹紧部件将夹紧部件 和电子部件并且推动阻尼部件的相对端壁抵靠电子部件的相对侧壁以牢固地夹持阻尼部件的相对端壁之间的电子部件。 该布置对于减少和/或消除由于电子组件暴露于震动和/或振动而导致的损坏和随后的故障是有效的。

公开(公告)号：EP1755366A3

公开(公告)日：2007-10-10

申请号：EP06016674.1

申请日：2006-08-10

Applicant: POLYMATECH CO., LTD.

Inventor： Konno, Hideaki c/o R&D Center of Polymatech Co.Lt

IPC: H04M1/03 ,  H05K3/30

CPC classification number: H05K3/301 ,  H05K3/325 ,  H05K2201/0314 ,  H05K2201/10083 ,  H05K2201/10325 ,  H05K2201/10583 ,  H05K2201/10606

Abstract: According to the present invention, there is provided a holder having a pressure flange not to be easily disengaged from a small-sized electronic part in pressing and accommodating the holder having the small-sized electronic part in a mounting recess. A holder (10) includes a projecting portion (16) protruding from a pressing flange (13) toward a cylinder axis of a holding portion (11), formed in a portion having a predetermined length of an inner edge (13a) of the pressing flange (13). With this construction, when the holder (10) accommodating a small-sized electronic part (6) is mounted to a casing of an apparatus, even if the pressing flange (13) is rolled up and about to be disengaged from the small-sized electronic part (6), the projecting portion (16) engages with the small-sized electronic part (6), thereby preventing the pressing flange (13) from being rolled up.

公开(公告)号：EP1624736A3

公开(公告)日：2006-09-13

申请号：EP05106647.0

申请日：2005-07-20

Applicant: SIEMENS AKTIENGESELLSCHAFT

Inventor： Eßmann, Klaus ,  Gelbhaar, Ulrich ,  Hentschel, Matthias

IPC: H05K1/14

CPC classification number: H05K3/366 ,  H05K3/3442 ,  H05K2201/10583

Abstract: Die Erfindung betrifft ein Verfahren zur Herstellung einer elektrisch leitenden Verbindung bei T-förmigen oder L-förmigen Leiterplattenkonfiguration mit mindestens zwei rechtwinklig aufeinander stehenden Leiterplatten (4, 5). Eine hohe Packungsdichte elektronischer Bauelemente auf den Leiterplatten (4, 5) wird dadurch erreicht, dass in dem Winkelbereich zwischen den beiden Leiterplatten (4, 5) MELF (Metal Electro-de Face)-Connectoren (1) eingelötet werden, deren Metallkappen (3) jeweils mittels winkelförmig angeordneter Lötpads (6) beide Leiterplatten (4, 5) kontaktieren.

Abstract translation: 用T形或L形的电路板结构具有若干正交装配的电路板（4,5）的导电连接通过焊接MELF连接器（1）插入两个电路板之间的角部形成的。 连接器金属盖（3）由角焊垫（6）。优选地圆柱形的陶瓷体（2）连接器MELF的，与他们的金属焊盘，被插入到电路板的包被糊剂焊料焊盘接触两个电路板。 部件装配和焊接由传统的设备和标准焊膏开展。

公开(公告)号：EP0727841B1

公开(公告)日：2006-04-26

申请号：EP96400307.3

申请日：1996-02-14

Applicant: Sumitomo Wiring Systems, Ltd.

Inventor： Murakami, Koji, c/o Sumitomo Wiring Systems, Ltd.

IPC: H01R9/24 ,  B60R16/02 ,  H01R12/38

CPC classification number: H05K3/306 ,  H01R9/2466 ,  H01R12/59 ,  H01R31/08 ,  H05K1/0263 ,  H05K1/0284 ,  H05K1/0393 ,  H05K3/0058 ,  H05K3/202 ,  H05K3/4084 ,  H05K2201/0352 ,  H05K2201/09045 ,  H05K2201/091 ,  H05K2201/09118 ,  H05K2201/10272 ,  H05K2201/10583 ,  H05K2201/10651 ,  H05K2203/167

公开(公告)号：EP1459611A1

公开(公告)日：2004-09-22

申请号：EP02798283.4

申请日：2002-12-19

Applicant: ROBERT BOSCH GMBH

Inventor： SCHIEFER, Peter

IPC: H05K5/00

CPC classification number: H05K9/0026 ,  H05K1/181 ,  H05K3/301 ,  H05K5/0056 ,  H05K5/0069 ,  H05K9/0037 ,  H05K9/0049 ,  H05K2201/0999 ,  H05K2201/10189 ,  H05K2201/10371 ,  H05K2201/10583 ,  H05K2203/1572 ,  Y02P70/611

Abstract: The invention relates to a housing system for an electric device (1), which has at least two housing parts (2, 3) and an electronic circuit arranged on a circuit board (4) therein, provided with a conductive layer which is connected to the ground of at least one metallic housing part (2). The housing part (3) is made of a plastic part. At least the connecting device (9) for the voltage source of the device and/or the signal transmission to the electronic circuit is integrated therein. The circuit board (4) is covered on both sides. Perturbing-radiation-sensitive components (5) are arranged on the side thereof, and are continuously surrounded by the metallic housing part (2) and the conductive layer, and other components (6) and contacts of the connecting device (9) are arranged on the other side of the circuit board (4).