公开(公告)号：EP0520195B1

公开(公告)日：1995-12-06

申请号：EP92108801.9

申请日：1992-05-25

Applicant: SHIPLEY COMPANY INC.

Inventor： Bladon, John J.

IPC: C25D5/54

CPC classification number: C25D5/54 ,  H05K3/424 ,  H05K3/427 ,  H05K2203/0716

公开(公告)号：EP0568827A3

公开(公告)日：1995-08-09

申请号：EP93105753.3

申请日：1993-04-07

Applicant: SHIPLEY COMPANY INC.

Inventor： Pai, Daniel Y. ,  Rodriguez, Stephen S. ,  Sinta, Roger F.

IPC: G03F7/16 ,  G03F7/004 ,  G03F7/039

CPC classification number: G03F7/039 ,  G03F7/164 ,  Y10S430/106 ,  Y10S430/111 ,  Y10S524/901

Abstract: The present invention provides photoimageable compositions, processes and articles of manufacture. In particular, the invention provides a process comprising electrophoretically applying a coating layer of a photoimageable composition onto a conductive surface, the composition comprising a material that contains one or more photoacid labile groups. The photoimageable compositions of the invention preferably comprise a photoacid generator, a material that contains one or more acid-cleavable functional groups, and a carrier resin that contains one or more functional groups that are, or can be treated to be, at least partially ionized.

Abstract translation: 本发明提供可光成像组合物，工艺和制造物品。 特别地，本发明提供了一种方法，该方法包括将电子成像组合物的涂层电泳施加到导电表面上，该组合物包含含有一个或多个光酸不稳定基团的材料。 本发明的可光成像组合物优选包含光酸产生剂，含有一个或多个酸可分解官能团的材料和含有一种或多种官能团的载体树脂，所述官能团是或可被处理为至少部分电离 。

公开(公告)号：EP0525282A2

公开(公告)日：1993-02-03

申请号：EP92102667.0

申请日：1992-02-18

Applicant: SHIPLEY COMPANY INC.

Inventor： Sricharoenchaikit, Prasit ,  Calabrese, Gary S. ,  Gulla, Michael

IPC: C23C18/52 ,  C23C18/34 ,  C23C18/40

CPC classification number: C23C18/52

Abstract: A composition for electrolessly depositing thin metal coatings in selective patterns of fine dimension. The electroless plating solutions of the invention are characterized by a low metal content and preferably, freedom from alkali or alkaline earth metal ions.

Abstract translation: 用于以优选尺寸的选择性图案无电沉积薄金属涂层的组合物。 本发明的化学镀溶液的特征在于金属含量低，优选不含碱金属或碱土金属离子。

公开(公告)号：EP0524422A2

公开(公告)日：1993-01-27

申请号：EP92110053.3

申请日：1992-06-15

Applicant: SHIPLEY COMPANY INC.

Inventor： Shipley, Charles R. ,  Staniunas, Richard

IPC: C23C18/48 ,  C23C18/52

CPC classification number: C23C18/52 ,  C23C18/48 ,  H05K3/3473 ,  H05K2201/0116 ,  H05K2203/043 ,  H05K2203/072 ,  H05K2203/073

Abstract: A process for increasing the reflow capability of a tin lead alloy deposit and increasing its adhesion to an underlying substrate, said process comprising impregnating a tin lead immersion deposit with tin prior to reflow. The process is useful in the manufacture of printed circuit boards.

Abstract translation: 一种用于增加锡铅合金沉积物的回流能力并增加其对下面的基底的粘附性的方法，所述方法包括在回流之前用锡浸渍锡铅浸渍沉积物。 该方法在印刷电路板的制造中是有用的。

公开(公告)号：EP0490118A1

公开(公告)日：1992-06-17

申请号：EP91119515.4

申请日：1991-11-15

Applicant: SHIPLEY COMPANY INC.

Inventor： Shipley, Charles R.

IPC: G03F7/033 ,  G03F7/32 ,  H05K3/34

CPC classification number: G03F7/32 ,  G03F7/033 ,  H05K3/0023 ,  H05K3/064 ,  H05K3/184 ,  H05K3/287 ,  H05K2203/0793

Abstract: An aqueous developable light sensitive composition comprising an organic solution of at least one polymer having polar group substitution, a photoinitiator and an unsaturated cross linking or polymerizable monomer. The composition is developable with an aqueous solution of a weak organic acid following exposure to activating radiation and baking. A cured photoimaged mask from said composition has properties suitable for use of the composition as a photoimagable solder mask for printed circuit boards and for serving as a permanent dielectric mask in the manufacture of full additive printed circuit boards. Alternatively, the photoimaged mask can be utilized as a temporary mask for many applications due to its unexpected resistance to harsh chemical solutions including both strong acid and strong alkali solutions, and due to its adhesion to copper and other metals as well as to many nonconductive substrate materials.

Abstract translation: 一种水性可显影光敏组合物，其包含至少一种具有极性取代基的聚合物的有机溶液，光引发剂和不饱和交联或可聚合单体。 在暴露于活化辐射和烘烤之后，组合物可用弱有机酸的水溶液显影。 来自所述组合物的固化的光刻掩模具有适合于将该组合物用作印刷电路板的光可光刻焊接掩模并用作制造全部添加剂印刷电路板中的永久介电掩模的性质。 或者，由于其对包括强酸和强碱溶液在内的苛刻化学溶液的意想不到的耐受性以及由于其对铜和其它金属的粘附以及许多非导电基材而导致的，对于许多应用，可以将光刻掩模用作临时掩模 材料。

公开(公告)号：EP0462391A2

公开(公告)日：1991-12-27

申请号：EP91107484.7

申请日：1991-05-08

Applicant: SHIPLEY COMPANY INC.

Inventor： Thackeray, James W. ,  Orsula, George W. ,  Canistro, Dianne ,  McIlnay, Susan E.

IPC: G03F7/038 ,  G03F7/029

CPC classification number: G03F7/0295 ,  G03F7/038

Abstract: The invention is for a negative-acting, acid hardenable, deep UV photoresist comprising a phenolic resin having ring bonded hydroxyl sites, a thermally activated crosslinking agent that is an etherified aminoplast and a photoacid generator. The invention is characterized by control of the molar ratio of the ring bonded hydroxyl groups of the phenolic resin to the ether groups of the aminoplast which permits optimization of the properties such as optical absorbance, dissolution rate, photospeed, contrast, resolution and sidewall angle.

Abstract translation: 本发明涉及一种负性，酸可硬化的深UV光致抗蚀剂，其包含具有环键羟基位点的酚醛树脂，作为醚化氨基塑料的热活化交联剂和光酸产生剂。 本发明的特征在于控制酚醛树脂的环键羟基与氨基塑料的醚基团的摩尔比，其允许优化诸如光吸收率，溶解速率，感光速度，对比度，分辨率和侧壁角度的性质。

公开(公告)号：EP0460397A1

公开(公告)日：1991-12-11

申请号：EP91107013.4

申请日：1991-04-30

Applicant: SHIPLEY COMPANY INC.

Inventor： Iantosca, Richard, A.

IPC: C23C18/48

CPC classification number: C23C18/48 ,  H05K3/3473

Abstract: An acid solution for displacement plating of a reflowable tin lead alloy having a melting point not exceeding 500 o F over a cupreous surface. The displacement plating solution contains stannous ions in an amount of from 0.05 to 0.50 moles per liter, plumbous ions in an amount of from 0.01 to 0.15 moles per liter, a total content of stannous ions and plumbous ions in an amount of from 0.05 to 0.60 moles per liter and a ratio of stannous ions to plumbous ions varying from about 1.0:3.0 to 50.0:1.0. The solution is characterized by an ability to plate the tin lead alloy at a plating rate of at least 100 microinches per 15 minutes. The deposit obtained is capable of reflow and is useful in the manufacture of printed circuit boards.

Abstract translation: 在铜表面上具有熔点不超过500°F的可回流锡铅合金的位移镀的酸溶液。 位移镀溶液含有0.05至0.50摩尔/升的亚锡离子，每升0.01至0.15摩尔/升的铅离子，亚锡离子和铅离子的总含量为0.05至0.60 摩尔每升，亚锡离子与铅离子的比例从约1.0：3.0至50.0：1.0变化。 该溶液的特征在于以每15分钟至少100微英寸的电镀速率镀锡锡铅合金的能力。 获得的沉积物能够回流，并且可用于制造印刷电路板。

公开(公告)号：EP0456982A1

公开(公告)日：1991-11-21

申请号：EP91103686.1

申请日：1991-03-11

Applicant: SHIPLEY COMPANY INC.

Inventor： Gulla, Michael ,  Sricharoenchaikit, Prasit

IPC: C23C18/28

CPC classification number: C23C18/28

Abstract: A process for metal plating characterized by use of an accelerator solution of a metal reducible by stannous tin between a step of catalysis and metal deposition.

Abstract translation: 一种用于金属电镀的方法，其特征在于在催化步骤和金属沉积之间使用可由亚锡锡还原的金属促进剂溶液。

公开(公告)号：EP0440027A2

公开(公告)日：1991-08-07

申请号：EP91100240.0

申请日：1991-01-09

Applicant: SHIPLEY COMPANY INC.

Inventor： Bernards, Roger F. ,  Fisher, Gordon ,  Sonnenberg, Wade ,  Cerwonka, Edward J. ,  Fisher, Stewart

IPC: C25D3/38

CPC classification number: H05K3/42 ,  C25D3/38 ,  H05K3/423 ,  H05K2203/162

Abstract: The invention discloses the use of an additive for acid copper plating bath which is chosen based on criteria of creating a shift in the charge transfer overpotential of the bath; or alternatively, creating a differential overpotential between the surface of a high aspect ratio circuit board and the recesses of such boards. The additive may be a single or multi-component additive.

Abstract translation: 本发明公开了一种用于酸性电镀浴的添加剂的使用，其基于产生电镀液的电荷转移超电势的偏移的标准来选择; 或者替代地，在高宽比电路板的表面和这种板的凹部之间产生差分超电势。 添加剂可以是单组分或多组分添加剂。

公开(公告)号：EP0355804A3

公开(公告)日：1991-07-17

申请号：EP89115521.0

申请日：1989-08-23

Applicant: SHIPLEY COMPANY INC.

Inventor： Bernards, Roger F. ,  Fischer, Gordon ,  Sonnenberg, Wade

IPC: C25D3/38

CPC classification number: C25D3/38 ,  H05K3/42 ,  H05K3/423 ,  H05K2203/162

Abstract: A composition for electroplating copper onto a conductive surface comprising a solution soluble copper salt and an acid electrolyte, said copper salt being present in a concentration of from about 1 to 10 grams per liter of solution and said acid being present in a concentration whereby the acid to copper ratio preferably varies between about 30 to 1 and 50 to 1. The composition is especially useful for the plating of walls of cylindrical openings having a ratio of height to diameter of at least 10 to 1 and a length of at least 0.100 inches.