公开(公告)号：EP2679378A4

公开(公告)日：2015-07-29

申请号：EP12749575

申请日：2012-02-17

Applicant: TORAY INDUSTRIES

Inventor： TAKAHASHI KENTA ,  HORIE MASATO ,  HIGASHIOJI TAKUJI ,  MACHIDA TETSUYA

IPC: B29C55/12 ,  B29K67/00 ,  B29L7/00 ,  H05K1/03

CPC classification number: G02B1/04 ,  B29C55/143 ,  B29K2067/003 ,  B29K2995/0032 ,  C08J5/18 ,  C08J2367/02 ,  H05K1/0393 ,  H05K2201/0145 ,  Y10T428/24942

公开(公告)号：EP2363891B1

公开(公告)日：2015-02-25

申请号：EP11168507.9

申请日：2006-08-14

Applicant: Cambrios Technologies Corporation

Inventor： Alden, Jonathan ,  Dai, Haixia ,  Knapp, Michael R ,  Na, Shuo ,  Pakbaz, Hash ,  Pschenitzka, Florian ,  Quan, Xina ,  Spaid, Michael, A ,  Winoto, Adrian ,  Wolk, Jeffrey

IPC: H01L31/0224 ,  H01B1/22 ,  G02B5/02 ,  G02F1/1333 ,  G02F1/1343 ,  C23F11/02 ,  C30B7/02 ,  C30B29/02 ,  C30B29/60 ,  B82Y30/00

CPC classification number: H01B1/22 ,  B22F2998/00 ,  B82Y20/00 ,  B82Y30/00 ,  C03C17/007 ,  C03C17/008 ,  C03C2217/445 ,  C03C2217/479 ,  C09D11/52 ,  C23F11/02 ,  C30B7/02 ,  C30B29/02 ,  C30B29/60 ,  C30B33/00 ,  G02F1/13439 ,  H01L27/14623 ,  H01L31/02164 ,  H01L31/022466 ,  H01L2224/45139 ,  H01L2224/49175 ,  H01L2924/00011 ,  H01L2924/12044 ,  H01L2924/3011 ,  H05K1/0269 ,  H05K1/097 ,  H05K3/048 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/026 ,  H05K2201/10128 ,  H05K2203/1545 ,  Y10S977/762 ,  B22F1/0025 ,  H01L2924/00 ,  H01L2924/01004 ,  H01L2924/0102 ,  H01L2924/01039

Abstract: A Transparent conductor including a conductive layer coated on a substrate is described. More specifically, the conductive layer comprises a network of nanowires which may be embedded in a matrix and one more corrosion inhibitors. The conductive layer is optically transparent and flexible. It can be coated or laminated onto a variety of substrates, including flexible and rigid substrates.

Abstract translation: 描述了包括涂覆在基板上的导电层的透明导体。 更具体地，导电层包括纳米线网络，其可以嵌入基质中，另外还有一个腐蚀抑制剂。 导电层是光学透明和柔性的。 它可以涂覆或层压在各种基材上，包括柔性和刚性基材。

公开(公告)号：EP2792483A1

公开(公告)日：2014-10-22

申请号：EP12865468.8

申请日：2012-01-13

Applicant: JX Nippon Mining & Metals Corporation

Inventor： TANAKA Koichiro ,  KAMMURI Kazuki

IPC: B32B15/08 ,  H05K1/02

CPC classification number: H05K1/0393 ,  B32B7/02 ,  B32B15/08 ,  B32B15/20 ,  B32B2307/712 ,  B32B2457/08 ,  H05K1/053 ,  H05K1/056 ,  H05K1/09 ,  H05K3/022 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/05 ,  H05K2201/06 ,  Y10T29/302 ,  Y10T428/12438 ,  Y10T428/273

Abstract: A copper foil composite comprising a copper foil and a resin layer laminated thereon, satisfying an equation 1: (f 3 x t 3 )/(f 2 x t 2 ) => 1 wherein t 2 (mm) is a thickness of the copper foil, f 2 (MPa) is a stress of the copper foil under tensile strain of 4%, t 3 (mm) is a thickness of the resin layer, f 3 (MPa) is a stress of the resin layer under tensile strain of 4%, and an equation 2:1 1 /(F x T) wherein f 1 (N/mm) is 180° peeling strength between the copper foil and the resin layer, F(MPa) is strength of the copper foil composite under tensile strain of 30%, and T (mm) is a thickness of the copper foil composite, wherein a Cr oxide layer is formed at an coating amount of 5 to 100 µg/dm 2 .is formed on a surface of the copper foil on which the resin layer is not laminated.

Abstract translation: （f3×t3）/（f2×t2）=> 1其中，t2（mm）是所述铜箔的厚度，f2（MPa）是包括铜箔和层压在其上的树脂层的铜箔复合物，满足等式1： ）为拉伸应变4％时铜箔的应力，t3（mm）为树脂层的厚度，f3（MPa）为拉伸应变4％时树脂层的应力，式2： 1 <= 33f1 /（F×T）其中，f1（N / mm）为铜箔与树脂层之间的180°剥离强度，F（MPa）为拉伸应变30％下的铜箔复合体的强度， T（mm）是铜箔复合体的厚度，其中在未层压树脂层的铜箔的表面上形成5至100μg/ dm 2的涂布量的Cr氧化物层。

公开(公告)号：EP2787796A1

公开(公告)日：2014-10-08

申请号：EP12862999.5

申请日：2012-08-13

Applicant: Ishihara Chemical Co., Ltd. ,  Applied Nanotech Holdings, Inc.

Inventor： KAWATO, Yuichi ,  MITA, Tomohiro ,  MAEDA, Yusuke ,  KUDO, Tomio

IPC: H05K3/12 ,  H05K3/18

CPC classification number: H05K1/092 ,  C09D11/52 ,  H05K1/0306 ,  H05K1/032 ,  H05K1/0346 ,  H05K1/0366 ,  H05K1/05 ,  H05K1/097 ,  H05K3/108 ,  H05K3/1283 ,  H05K3/185 ,  H05K3/241 ,  H05K3/246 ,  H05K3/381 ,  H05K2201/0129 ,  H05K2201/0145 ,  H05K2201/2072 ,  H05K2203/1105

Abstract: An object is to provide a conductive film forming method which can form a conductive film having low electric resistance on a base material by utilizing photo sintering even when the base material has low heat resistance. A conductive film forming method is a method in which a conductive film 2 is formed on a base material 1, and the method includes the steps of forming a film 3b composed of copper particulates 4 on a base material, subjecting the film 3b to photo sintering, and applying plating to the photo-sintered film 3c. Whereby, it is possible to form a conductive film 2 on a base material 1 by lowering irradiation energy of light in photo sintering even when the base material 1 has low heat resistance. Since the conductive film 2 includes a plated layer 21, electric resistance decreases.

Abstract translation: 目的在于提供一种导电膜形成方法，即使在基材的耐热性低的情况下，也能够利用光烧结在基材上形成电阻低的导电膜。 导电膜形成方法是在基材1上形成导电膜2的方法，该方法包括以下步骤：在基材上形成由铜微粒4构成的膜3b，对膜3b进行光烧结 并对光烧结膜3c进行电镀。 由此，即使在基材1的耐热性低的情况下，通过降低光烧结时的光的照射能量，也能够在基材1上形成导电膜2。 由于导电膜2包括镀层21，所以电阻降低。

公开(公告)号：EP2581220A4

公开(公告)日：2014-05-14

申请号：EP11806591

申请日：2011-06-16

Applicant: JX NIPPON MINING & METALS CORP

Inventor： KAMMURI KAZUKI

IPC: B32B15/08 ,  H05K1/02

CPC classification number: H05K3/022 ,  B32B15/08 ,  B32B15/085 ,  B32B15/09 ,  B32B15/20 ,  B32B2457/08 ,  H05K1/0393 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0358 ,  Y10T428/31678

公开(公告)号：EP1962348B1

公开(公告)日：2013-03-06

申请号：EP08103194.0

申请日：2006-08-14

Applicant: Cambrios Technologies Corporation

Inventor： Alden, Jonathan ,  Dai, Haixia ,  Knapp, Michael R ,  Na, Shuo ,  Pakbaz, Hash ,  Pschenitzka, Florian ,  Quan, Xina ,  Spaid, Michael, A ,  Wolf, Jeffrey ,  Winoto, Adrian

IPC: H01L31/0224 ,  H01B1/22 ,  G02F1/1343 ,  G02B5/02 ,  C23F11/02 ,  C30B7/02 ,  C30B29/02 ,  C30B29/60 ,  C30B33/00 ,  G02F1/13 ,  G02F1/1333

CPC classification number: H01B1/22 ,  B22F2998/00 ,  B82Y20/00 ,  B82Y30/00 ,  C03C17/007 ,  C03C17/008 ,  C03C2217/445 ,  C03C2217/479 ,  C09D11/52 ,  C23F11/02 ,  C30B7/02 ,  C30B29/02 ,  C30B29/60 ,  C30B33/00 ,  G02F1/13439 ,  H01L27/14623 ,  H01L31/02164 ,  H01L31/022466 ,  H01L2224/45139 ,  H01L2224/49175 ,  H01L2924/00011 ,  H01L2924/12044 ,  H01L2924/3011 ,  H05K1/0269 ,  H05K1/097 ,  H05K3/048 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/026 ,  H05K2201/10128 ,  H05K2203/1545 ,  Y10S977/762 ,  B22F1/0025 ,  H01L2924/00 ,  H01L2924/01004 ,  H01L2924/0102 ,  H01L2924/01039

Abstract: A Transparent conductor including a conductive layer coated on a substrate is described. More specifically, the conductive layer comprises a network of nanowires which may be embedded in a matrix and one more corrosion inhibitors. The conductive layer is optically transparent and flexible. It can be coated or laminated onto a variety of substrates, including flexible and rigid substrates.

公开(公告)号：EP2251389B8

公开(公告)日：2012-09-19

申请号：EP10174097.5

申请日：2006-08-14

Applicant: Cambrios Technologies Corporation

Inventor： Alden, Jonathan, S. ,  Dai, Haixia ,  Knapp, Michael, R. ,  Na, Shuo ,  Pakbaz, Hash ,  Pschenitzka, Florian ,  Quan, Xina ,  Spaid, Michael, A. ,  Winoto, Adrian ,  Wolk, Jeffrey

IPC: C09D11/00 ,  B22F1/00 ,  H01L31/0224 ,  H01B1/22 ,  G02F1/1343 ,  G02B5/02 ,  C23F11/02 ,  C30B7/02 ,  C30B29/02 ,  C30B29/60 ,  C30B33/00 ,  H01L21/768

CPC classification number: H01B1/22 ,  B22F2998/00 ,  B82Y20/00 ,  B82Y30/00 ,  C03C17/007 ,  C03C17/008 ,  C03C2217/445 ,  C03C2217/479 ,  C09D11/52 ,  C23F11/02 ,  C30B7/02 ,  C30B29/02 ,  C30B29/60 ,  C30B33/00 ,  G02F1/13439 ,  H01L27/14623 ,  H01L31/02164 ,  H01L31/022466 ,  H01L2224/45139 ,  H01L2224/49175 ,  H01L2924/00011 ,  H01L2924/12044 ,  H01L2924/3011 ,  H05K1/0269 ,  H05K1/097 ,  H05K3/048 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/026 ,  H05K2201/10128 ,  H05K2203/1545 ,  Y10S977/762 ,  B22F1/0025 ,  H01L2924/00 ,  H01L2924/01004 ,  H01L2924/0102 ,  H01L2924/01039

Abstract: A Transparent conductor including a conductive layer coated on a substrate is described. More specifically, the conductive layer comprises a network of nanowires which may be embedded in a matrix and one more corrosion inhibitors. The conductive layer is optically transparent and flexible. It can be coated or laminated onto a variety of substrates, including flexible and rigid substrates.

Abstract translation: 描述了包括涂覆在基板上的导电层的透明导体。 更具体地，导电层包括纳米线网络，其可以嵌入基质中，另外还有一个腐蚀抑制剂。 导电层是光学透明和柔性的。 它可以涂覆或层压在各种基材上，包括柔性和刚性基材。

公开(公告)号：EP2251389B1

公开(公告)日：2012-08-08

申请号：EP10174097.5

申请日：2006-08-14

Applicant: Cambrios Technologies Corporation

Inventor： Alden, Jonathan, S. ,  Dai, Haixia ,  Knapp, Michael, R. ,  Na, Shuo ,  Pakabaz, Hash ,  Pschenitzka, Florian ,  Quan, Xina ,  Spaid, Michael, A. ,  Winoto, Adrian ,  Wolk, Jeffrey

IPC: C09D11/00 ,  B22F1/00 ,  H01L31/0224 ,  H01B1/22 ,  G02F1/1343 ,  G02B5/02 ,  C23F11/02 ,  C30B7/02 ,  C30B29/02 ,  C30B29/60 ,  C30B33/00 ,  H01L21/768

CPC classification number: H01B1/22 ,  B22F2998/00 ,  B82Y20/00 ,  B82Y30/00 ,  C03C17/007 ,  C03C17/008 ,  C03C2217/445 ,  C03C2217/479 ,  C09D11/52 ,  C23F11/02 ,  C30B7/02 ,  C30B29/02 ,  C30B29/60 ,  C30B33/00 ,  G02F1/13439 ,  H01L27/14623 ,  H01L31/02164 ,  H01L31/022466 ,  H01L2224/45139 ,  H01L2224/49175 ,  H01L2924/00011 ,  H01L2924/12044 ,  H01L2924/3011 ,  H05K1/0269 ,  H05K1/097 ,  H05K3/048 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/026 ,  H05K2201/10128 ,  H05K2203/1545 ,  Y10S977/762 ,  B22F1/0025 ,  H01L2924/00 ,  H01L2924/01004 ,  H01L2924/0102 ,  H01L2924/01039

Abstract: A Transparent conductor including a conductive layer coated on a substrate is described. More specifically, the conductive layer comprises a network of nanowires which may be embedded in a matrix and one more corrosion inhibitors. The conductive layer is optically transparent and flexible. It can be coated or laminated onto a variety of substrates, including flexible and rigid substrates.

公开(公告)号：EP2422590A1

公开(公告)日：2012-02-29

申请号：EP10720123.8

申请日：2010-04-21

Applicant: Sefar Ag, Thal

Inventor： MEIER, Hanspeter ,  DEJEAN, Cédric

IPC: H05K1/02 ,  H05K1/03

CPC classification number: H05K1/0366 ,  H05K1/024 ,  H05K1/038 ,  H05K2201/0145 ,  H05K2201/015 ,  H05K2201/0158 ,  H05K2201/0278 ,  H05K2201/0281 ,  H05K2201/029

Abstract: The invention relates to circuit board base material (1) for high frequency applications, comprising a carrier (2) which on a first side (6) is provided with a first electrically conductive, preferably metal layer, particularly formed by a film, wherein the carrier (2) comprises at least one woven fabric (3) and/or is made of at least one woven fabric (3). According to the invention, the woven fabric (3) is woven from a monofilament made of PET. The invention further relates to a circuit board.

公开(公告)号：EP2076098B1

公开(公告)日：2011-05-11

申请号：EP08009523.5

申请日：2008-05-23

Applicant: LG Electronics Inc.

Inventor： Lee, Sang Gon ,  Kim, Dae Sung ,  Chang, Woo Hyuck

IPC: H05K1/00 ,  H05K1/02

CPC classification number: H05K3/38 ,  H01L2924/0002 ,  H05K1/0326 ,  H05K1/0346 ,  H05K1/0393 ,  H05K3/181 ,  H05K3/388 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0154 ,  Y10T428/10 ,  Y10T428/24273 ,  Y10T428/24355 ,  Y10T428/24917 ,  Y10T428/31678 ,  H01L2924/00