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253 条记录 (耗时 0.019 秒)

    Screen printing method and screen printing apparatus
    54.
    发明公开
    Screen printing method and screen printing apparatus 失效
    Siebdruckverfahren und Siebdruckvorrichtung

    公开(公告)号：EP1465469A2

    公开(公告)日：2004-10-06

    申请号：EP04011727.7

    申请日：1996-08-30

    申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

    发明人： Takahashi, Ken ,  Chikahisa, Naoichi ,  Nagasawa, Yousuke ,  Naito, Takao ,  Wachi, Akihiko ,  Yanachi, Seishiro ,  Nagafuku, Nobuyasu ,  Kakishima, Nobuyuki

    IPC分类号： H05K3/12 ,  B41F15/08

    CPC分类号： B41F15/0818 ,  H05K3/1233 ,  H05K3/3484 ,  H05K2201/09727 ,  H05K2203/0139 ,  H05K2203/0264 ,  H05K2203/0783 ,  H05K2203/163

    摘要： A screen printing method for printing, with use of a screen printing apparatus, solder paste (122) on an electrode (125) of a board (102) to be printed, by positioning a screen mask (101) onto the board and by printing the solder paste supplied onto the screen mask into the screen mask with a squeegee (123) of a print head (103) which moves parallel to the screen mask while being kept in contact with the screen mask, wherein
    the board is classified into a first area (121) where a value of each of opening sizes of the mask along a direction in which the squeegee moves is smaller than a specified threshold, and a second area (120) where a value of each of opening sizes of the mask is not smaller than the threshold, and a speed of the squeegee at the first area is made slower than a speed of the squeegee at the second area.

    摘要翻译： 一种丝网印刷方法，通过使用丝网印刷装置，通过将屏幕掩模（101）定位在印刷板上并通过印刷来印刷待印刷的印版（102）的电极（125）上的焊膏（122） 通过与屏幕掩模保持接触的与屏幕掩模平行移动的打印头（103）的刮板（123）将供给到屏幕上的焊膏掩模到屏幕掩模中，其中板被分类为第一 区域（121），其中沿着刮板移动的方向的掩模的每个开口尺寸的值小于指定的阈值;以及第二区域（120），其中每个开口尺寸的值不是 小于阈值，并且第一区域处的刮板的速度比第二区域处的刮板的速度慢。

    Screen printing method and screen printing apparatus
    55.
    发明公开
    Screen printing method and screen printing apparatus 失效
    丝网印刷方法和丝网印刷装置

    公开(公告)号：EP1448032A2

    公开(公告)日：2004-08-18

    申请号：EP04011726.9

    申请日：1996-08-30

    申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

    发明人： Takahashi, Ken ,  Chikahisa, Naoichi ,  Nagasawa, Yousuke ,  Naito, Takao ,  Wachi, Akihiko ,  Yanachi, Seishiro ,  Nagafuku, Nobuyasu ,  Kakishima, Nobuyuki

    IPC分类号： H05K3/12 ,  B41F15/08

    CPC分类号： B41F15/0818 ,  H05K3/1233 ,  H05K3/3484 ,  H05K2201/09727 ,  H05K2203/0139 ,  H05K2203/0264 ,  H05K2203/0783 ,  H05K2203/163

    摘要： A screen printing method for screen printing solder paste at a reference print speed by using a squeegee, the screen printing method comprising:

    a step for, upon an occurence of print standby time during a printing operation, measuring the print standby time; and
    a step for, at a resumption of printing with the print standby canceled, screen-printing the solder paste placed on a screen mask during the standby time, by moving the squeegee at an adjusted print speed lower than the reference print speed based on a relationship between the print standby time and a print time due to the adjusted print speed after the resumption of printing.

    摘要翻译： 1.一种丝网印刷方法，用于通过刮板以基准印刷速度丝网印刷焊膏，所述丝网印刷方法包括以下步骤：在印刷操作期间发生印刷待机时间时，测量印刷待机时间; 以及在通过取消所述打印待机而恢复打印的情况下，在所述待机时间期间通过以低于所述基准打印速度的调整后的打印速度移动所述刮板来对在所述待机时间期间放置在所述掩模掩模上的所述焊膏进行丝网印刷 在打印恢复之后由于调整后的打印速度而引起的打印待机时间和打印时间之间的关系。

    METHOD OF PRODUCING ELECTRONIC PARTS, AND MEMBER FOR PRODUCTION THEREOF
    56.
    发明公开
    METHOD OF PRODUCING ELECTRONIC PARTS, AND MEMBER FOR PRODUCTION THEREOF 审中-公开
    VERFAHREN ZUM HERSTELLEN ELEKTRONISCHER BAUTEILE

    公开(公告)号：EP1335393A1

    公开(公告)日：2003-08-13

    申请号：EP02718627.9

    申请日：2002-04-19

    申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

    发明人： NAKAO, Keiichi

    IPC分类号： H01G4/12

    CPC分类号： H01G4/12 ,  H01G4/0085 ,  H01L21/4867 ,  H05K1/0306 ,  H05K1/092 ,  H05K3/1208 ,  H05K3/125 ,  H05K3/386 ,  H05K2203/013 ,  H05K2203/0783 ,  H05K2203/1163 ,  Y10T29/49155 ,  Y10T29/49401

    摘要： A base layer, which is supposed to be burnt off by baking, is formed on an unbaked member such as ceramic green sheet or laminated ceramic green sheets. This base layer improves ink acceptability of the unbaked ceramic member particularly for low viscosity ink such as jet-ink, and prevents oozing, draining, uneven thickness. This structure thus allows the inkjet to form a precise pattern. The base layer is burnt off at the baking step in the manufacturing process of electronic components, thus it does not adversely affect the reliability of the electronic component.

    摘要翻译： 在陶瓷生片或层叠陶瓷生片等未烘烤部件上形成有被烧成的基底层。 该基层改善了未烘烤的陶瓷构件的油墨可接受性，特别是对于诸如喷墨油墨的低粘度油墨而言，可以防止渗出，排水，不均匀的厚度。 因此，该结构允许喷墨形成精确的图案。 在电子部件的制造工序中，在烘烤工序中烧掉基层，不会对电子部件的可靠性造成不良影响。

    Prepreg and process for manufacturing same
    57.
    发明公开
    Prepreg and process for manufacturing same 有权
    Verbundwerkstoff und Verfahren zu deren Herstellung

    公开(公告)号：EP1241207A1

    公开(公告)日：2002-09-18

    申请号：EP01127802.5

    申请日：2001-11-22

    申请人： SUMITOMO BAKELITE CO., LTD.

    发明人： Yamaji, Takashi ,  Komatsu, Mamoro

    IPC分类号： C08J5/24 ,  H05K1/03 ,  C08L63/00

    CPC分类号： C08J3/245 ,  B29B15/122 ,  B29B15/125 ,  B29K2063/00 ,  C08J5/24 ,  C08J2363/00 ,  H05K1/0366 ,  H05K2203/0783 ,  H05K2203/1476 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/31529 ,  Y10T428/31623

    摘要： A prepreg exhibiting excellent formability and producing laminated boards and multiple layer circuit boards exhibiting high thickness precision is disclosed. The prepreg comprises an inner layer made from a glass fiber substrate, having a weight of 40 g or more and less than 115 g per square meter and an air permeability or 20 cm 3 /cm 2 /sec or less, impregnated with an epoxy resin, and an outer layer of an epoxy resin coating provided on at least one side of the inner layer, wherein the epoxy resin reaction rate in the inner layer is 85% or more and the epoxy resin reaction rate in the outer layer is 60% or less.

    摘要翻译： 公开了一种具有优异成形性的预浸料，并且制造层叠板和显示出高厚度精度的多层电路板。 预浸料包括由玻璃纤维基材制成的内层，其重量为40g以上且小于115g每平方米，透气度为20cm 3 / cm 2 / sec以下，浸渍 和环氧树脂涂层的外层，设置在内层的至少一侧的环氧树脂涂层的外层，其中内层的环氧树脂反应率为85％以上，外层的环氧树脂反应率 为60％以下。