公开(公告)号：EP2272115A1

公开(公告)日：2011-01-12

申请号：EP09737780.8

申请日：2009-03-28

申请人： Saint-Gobain Glass France

发明人： MELCHER, Martin ,  TCHAKAROV, Svetoslav

IPC分类号： H01L51/52 ,  H01L51/44

CPC分类号： H01L51/5203 ,  H01L51/445 ,  H01L51/5271 ,  H05K1/0274 ,  H05K3/244 ,  H05K2201/0108 ,  H05K2201/2054 ,  Y02E10/549

摘要： The invention relates to a substrate comprising a conductive mesh of metallic conductor traces (102) deposited on the substrate, wherein the conductor traces have a first side (104), facing the substrate, and a second side (106), remote from the substrate, wherein the second side is at least partly provided with a reflective layer (110) and wherein the substrate is transmissive.

公开(公告)号：EP2230889A1

公开(公告)日：2010-09-22

申请号：EP08792292.8

申请日：2008-08-07

申请人： Ain Co., Ltd.

发明人： TAKEUCHI, Koji ,  MATSUDA, Masami ,  ONO, Kaoru ,  HOSODA, Makoto

IPC分类号： H05K1/05 ,  H01L33/00

CPC分类号： H05K1/056 ,  H01L2924/0002 ,  H05K1/0274 ,  H05K2201/0162 ,  H05K2201/0209 ,  H05K2201/0281 ,  H05K2201/10106 ,  H05K2201/2054 ,  Y10T428/24917 ,  Y10T428/249994 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/254 ,  Y10T428/31663 ,  H01L2924/00

摘要： The present invention provides a wiring board giving good heat dissipation over a long period of use. The present invention also provides a method for producing a wiring board, including coating a surface of a metal substrate 2, which is made of an aluminium plate, with a composition 3 containing a substance having a polysiloxane structure and inorganic particles having insulating and heat-dissipating properties ( Fig. 1(B) ), curing the composition 3, then bonding a copper foil 4 to the cured composition 3A ( Fig. 1(C) ), and partially removing the copper foil 4, thereby forming a wiring layer 5 ( Fig. 1(D) ).

摘要翻译： 本发明提供了一种在长期使用中提供良好散热的接线板。 本发明还提供了一种制造布线板的方法，包括用含有聚硅氧烷结构的物质的组合物3和由铝板制成的金属基板2的表面涂覆绝缘和耐热的无机颗粒， 消耗性能（图1（B）），固化组合物3，然后将铜箔4粘合到固化组合物3A（图1（C）），并部分除去铜箔4，从而形成布线层5 （图1（D））。

公开(公告)号：EP2045635A4

公开(公告)日：2010-07-21

申请号：EP07828160

申请日：2007-07-19

申请人： HITACHI CHEMICAL CO LTD

发明人： SHIBATA TOMOAKI ,  MIYATAKE MASATO ,  TAKAHASHI ATSUSHI ,  YAMAGUCHI MASATOSHI

IPC分类号： G02B6/12 ,  H05K1/02 ,  H05K1/03

CPC分类号： H05K1/0274 ,  H05K3/0023 ,  H05K2201/0112 ,  H05K2201/0209

公开(公告)号：EP2182783A2

公开(公告)日：2010-05-05

申请号：EP09013540.1

申请日：2009-10-27

申请人： Toshiba Lighting & Technology Corporation

发明人： Oyaizu, Tsuyoshi ,  Kawashima, Seiko ,  Takei, Haruki ,  Matsui, Naoko

IPC分类号： H05K1/02 ,  H05K1/05 ,  H01L25/075 ,  F21K99/00

CPC分类号： F21V29/70 ,  F21K9/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/0203 ,  H05K1/0274 ,  H05K1/053 ,  H05K2201/0195 ,  H05K2201/10106 ,  H05K2201/2054 ,  H05K2203/1476 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light-emitting module (2) includes a substrate (8), a wiring pattern (9), and a light-emitting device (10) that generates heat. The substrate (8) includes a metal base (13) and an insulating base (14) that is stacked on the metal base (13) and has a mount surface (19) on the opposite side of the metal base (13). The insulating base (14) has a plurality of insulating layers (17a, 17b, 17c, 17d) stacked on one another.
The wiring pattern (9) is provided on the mount surface (19) of the substrate (8). The light-emitting device (10) is mounted on the mount surface (19) of the substrate (8) and is electrically connected to the wiring pattern (9).

摘要翻译： 发光模块（2）包括基板（8），配线图案（9）以及发热的发光装置（10）。 基板8包括金属基座13和层叠在该金属基座13上的绝缘基座14，该绝缘基座14在金属基座13的相反侧具有安装面19。 绝缘基底（14）具有彼此堆叠的多个绝缘层（17a，17b，17c，17d）。 布线图案（9）设置在基板（8）的安装面（19）上。 发光装置（10）安装在基板（8）的安装面（19）上，并与配线图案（9）电连接。

公开(公告)号：EP2000833A4

公开(公告)日：2010-03-31

申请号：EP07739408

申请日：2007-03-23

申请人： IBIDEN CO LTD

发明人： KODAMA HIROAKI ,  CHEN LIYI ,  NAKASHIMA KENSAKU

IPC分类号： G02B6/122 ,  G02B6/42 ,  H05K1/02 ,  H05K3/46

CPC分类号： G02B6/43 ,  G02B6/3608 ,  G02B6/4212 ,  G02B6/4214 ,  G02B2006/12069 ,  H05K1/0274 ,  H05K3/4652 ,  H05K3/4691 ,  H05K2203/063 ,  Y10T29/49117 ,  Y10T29/49128

公开(公告)号：EP2042983A3

公开(公告)日：2010-02-03

申请号：EP08014481.9

申请日：2008-08-14

申请人： RGB Technology Spolka Cywilna

发明人： Nowakowski, Krysztof ,  Malyszewicz, Wojciech ,  Strozyna, Piotr

IPC分类号： G06F3/14 ,  G09G3/32 ,  H01L25/075 ,  G06F3/147 ,  G06F11/00 ,  H01L27/32 ,  H05K3/28 ,  G06F1/16

CPC分类号： G09G3/32 ,  G06F3/14 ,  G06F3/1431 ,  G06F3/147 ,  G09F9/33 ,  G09G3/2088 ,  G09G2300/026 ,  G09G2330/04 ,  H05K1/0274 ,  H05K3/284 ,  H05K2201/0112 ,  H05K2201/10106

摘要： The subject matter of the invention is a modular image display intended for presentation of text images, text and graphic images or graphic images of an information and advertising character, especially in public utility places.
The modular image display possesses, in each module (1), luminous elements (3) configured into triangular pixels (2), which, together with an electronic matrix board (4), are tightly sealed in a strengthening protective layer (5) of plastic. The surface of the protective layer (5) on the display side, among the tops of the luminous elements (3) sticking out of it, is covered by an antireflex film (6).
The control system of each module (1) is equipped with a microprocessor (8). The microprocessors of all modules (1) of the display are connected, through at least one branched power and control node (10), with a data bus (11) led from an external specialised controller (12).

公开(公告)号：EP1968362A3

公开(公告)日：2009-12-23

申请号：EP08151809.4

申请日：2008-02-22

申请人： Delphi Technologies, Inc.

发明人： Burns, Jeffrey H. ,  Delheimer, Charles I.

IPC分类号： H05K1/14 ,  H05K1/02 ,  H05K3/30 ,  H05K3/36

CPC分类号： H05K1/145 ,  H05K1/023 ,  H05K1/0274 ,  H05K1/141 ,  H05K3/303 ,  H05K3/3436 ,  H05K3/368 ,  H05K2201/09072 ,  H05K2201/10121 ,  H05K2201/10636 ,  H05K2201/10727 ,  H05K2201/10734 ,  H05K2201/2036 ,  Y02P70/611

摘要： A passive surface mount part (30,32,44) such as a capacitor or a resistor is employed to attach a first substrate (10) to a second substrate (12), or a semiconductor device (18) to a substrate (12), for an electrical circuit assembly. Applicable forms of substrates (10,12) include a printed circuit board such as a motherboard and a daughterboard, and applicable forms of semiconductor devices (18) include an integrated circuit. In an aspect, a low profile attachment is provided forming a planar structure. Space is conserved, signal transmission is provided, and electrical performance is increased. In another aspect, a standoff is defined between the substrates (10,12) setting the substrates apart a desired distance, compensating for any surface irregularities, increasing thermal separation, and increasing interconnect flexibility. As an application, the standoff defined between the substrates (10,12) can be utilized for a structure such as optical glass structure (28) to be situated between the substrates for use with an optical circuit assembly (26).

公开(公告)号：EP2101996A1

公开(公告)日：2009-09-23

申请号：EP07857761.6

申请日：2007-12-18

申请人： AGC Flat Glass Europe SA

发明人： LUIJKX, Antoine ,  HEVESI, Kadosa

IPC分类号： B32B17/06 ,  H05K3/00

CPC分类号： H05K3/24 ,  C03C17/36 ,  C03C17/3652 ,  C03C17/3668 ,  C03C2218/34 ,  H05K1/0274 ,  H05K3/28 ,  H05K2201/0108 ,  H05K2201/0326 ,  H05K2201/10106 ,  H05K2203/0582

摘要： A method for manufacturing a translucent panel for connecting electronic components consisting of a first step of deposition, on a translucent substrate, of a base electroconducting translucent layer, followed by a sequence of steps with the alternating depositions of isolating layers and conducting layers. A translucent panel for connecting electronic components comprising a translucent glass substrate coated with a base electroconducting layer, and on top thereof a stack of translucent layers with alternating translucent isolating layers and layers comprising conducting translucent zones. Use of the panel to build an electronic translucent circuit comprising electronic components.

公开(公告)号：EP2100722A2

公开(公告)日：2009-09-16

申请号：EP09155253.9

申请日：2009-03-16

申请人： Guardian Industries Corp.

发明人： Veerasamy, Vijayen S.

IPC分类号： B32B17/10 ,  G01D5/00 ,  G01N27/22 ,  B60S1/08

CPC分类号： B60S1/087 ,  B32B17/10036 ,  B32B17/10174 ,  B32B17/10761 ,  B32B17/10788 ,  B60S1/0822 ,  B60S1/0825 ,  G01D5/2405 ,  G01N21/25 ,  G01N2021/435 ,  H05K1/0274 ,  H05K1/189 ,  H05K3/0058 ,  H05K2201/0108 ,  H05K2201/09072 ,  H05K2201/10121

摘要： A system and/or method for sensing the presence of moisture (e.g., rain) and/or other material(s) on a window such as a vehicle window (e.g., vehicle windshield, sunroof or backlite). Such techniques may be used in connection with a light sensor. In certain example embodiments, a flexible printed circuit board (PCB) includes a light sensor comprising a light sensor flip-chip, with the light sensor flip-chip including at least two light sensor arrays, and with each said sensor array being configured to sense light of a predetermined wavelength. An adhesive bonds the light sensor to the PCB. A hole is formed in the PCB and the opaque layer so as to allow the light sensor arrays to see through the hole formed in the PCB and the opaque layer. A state of the vehicle lights is settable in dependence on the light sensor. The PCB is located in or is supported by the vehicle windshield.

摘要翻译： 用于感测诸如车辆窗口（例如，车辆挡风玻璃，天窗或背衬）的窗户上的湿气（例如雨）和/或其他材料的存在的系统和/或方法。 这种技术可以与光传感器结合使用。 在某些示例性实施例中，柔性印刷电路板（PCB）包括光传感器，其包括光传感器倒装芯片，光传感器倒装芯片包括至少两个光传感器阵列，并且每个所述传感器阵列被配置为感测 预定波长的光。 粘合剂将光传感器粘合到PCB上。 在PCB和不透明层中形成孔，以便允许光传感器阵列通过形成在PCB中的孔和不透明层来观察。 车灯的状态可以根据光传感器设定。 PCB位于车辆挡风玻璃上或由车辆挡风玻璃支撑。

公开(公告)号：EP2083609A3

公开(公告)日：2009-08-26

申请号：EP09000801.2

申请日：2009-01-21

申请人： Sony Corporation

发明人： Kishima, Koichiro

IPC分类号： H05K1/02 ,  H01P5/08 ,  H04B10/12

CPC分类号： G02B6/43 ,  G02B6/4204 ,  H01S5/02248 ,  H01S5/02284 ,  H05K1/0274 ,  H05K1/181 ,  H05K2201/10098 ,  H05K2201/10121 ,  H05K2201/10515 ,  Y02P70/611

摘要： An optical communication device contains a semiconductor chip that performs wireless communication and a wireless-signal-and-optical-signal conversion chip substrate that mounts the semiconductor chip. The semiconductor chip (10) includes a first wireless communication circuit element and a first antenna element (12,13). The first wireless communication circuit element is connected to the first antenna element. The wireless-signal-and-optical-signal conversion chip substrate (20) includes a second wireless communication circuit element, a second antenna element (27,22) and an optical communication element. The second wireless communication circuit element is connected to the second antenna element. The optical communication element is connected to the second wireless communication circuit element. The wireless-signal-and-optical-signal conversion chip substrate mounts the semiconductor chip with the first antenna element of the semiconductor chip and the second antenna element of the wireless-signal-and-optical-signal conversion chip substrate being faced with each other.