公开(公告)号：EP2273181A3

公开(公告)日：2011-05-11

申请号：EP10168269.8

申请日：2010-07-02

Applicant: Siteco Beleuchtungstechnik GmbH

Inventor： Metzeroth, Stefan ,  Meyer, Clemens ,  Härtl, Michael

IPC: F21K99/00 ,  H05K1/05

CPC classification number: H05K1/053 ,  F21V3/00 ,  F21V29/70 ,  F21W2131/10 ,  F21W2131/103 ,  F21W2131/107 ,  F21Y2107/00 ,  F21Y2115/10 ,  H05K1/0284 ,  H05K3/14 ,  H05K3/246 ,  H05K2201/0116 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/09018 ,  H05K2201/10106

Abstract: Die Erfindung betrifft ein LED-Trägerelement (1), das Folgendes umfasst: einen metallischen Kern, der auf zumindest einem Teilbereich seiner Oberfläche (21) eine Oxidkeramikschicht (22) aufweist, wobei die Oxidkeramikschicht (22) eine Porosität aufweist, welche von der Grenzfläche zum metallischen Kern (2) zur Oberfläche (21) des Trägerelements hin zunimmt, wenigstens eine Leiterbahn (3), die auf einem Teilbereich auf der von dem metallischen Kern (2) abgewandten Seite der Oxidkeramikschicht (22) angeordnet ist, und wenigstens eine LED (5), die in elektrischem Kontakt mit der Leiterbahn (3) steht.

Abstract translation: 元件（1）在上表面（21）的子区域上具有包含氧化物陶瓷层（22）的金属芯（2）。 氧化物陶瓷层是多孔的，并且导体路径在氧化物陶瓷层的一侧对准并且远离金属芯。 LED保持与导体路径接触，并且氧化物陶瓷层具有约5至400微米的厚度，其中元件在子区域中形成外表面。 氧化物陶瓷层在朝向金属芯的一侧限定非层上表面拓扑。 还包括用于制造LED用载体元件的方法的独立权利要求。

公开(公告)号：EP1983532B1

公开(公告)日：2010-12-22

申请号：EP08251275.7

申请日：2008-03-31

Applicant: Samsung Electro-Mechanics Co., Ltd

Inventor： Lim, Sung-Taek 1001, West Wing Hyundai I-Park ,  Chung, Yul-Kyo ,  Woon-Chun, Kim

IPC: H01G4/33 ,  H01G4/10 ,  H01G2/06

CPC classification number: H01G4/33 ,  H01G2/06 ,  H01G4/10 ,  H05K1/162 ,  H05K3/048 ,  H05K3/244 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2203/0315 ,  Y10T29/435

公开(公告)号：EP2187718A1

公开(公告)日：2010-05-19

申请号：EP09013390.1

申请日：2009-10-23

Applicant: Bühler Motor GmbH

Inventor： Kellermann, Helmut

IPC: H05K3/28

CPC classification number: H05K3/284 ,  H05K3/28 ,  H05K3/308 ,  H05K2201/0179 ,  H05K2201/09581 ,  H05K2201/1059 ,  Y10T29/49139

Abstract: Die Erfindung betrifft einen elektrischen Antrieb (1) mit einer Leiterplatte (2), die Leiterbahnen (3) und Kontaktdurchbrüche (4) mit Durchkontaktierungen (5) aufweist und mit elektronischen Bauteilen (6) bestückt ist, wobei die Leiterplatte (2) mit einer Schutzschicht (7) aus isolierendem Material beschichtet ist und Einpresskontakte (8) in die Kontaktdurchbrüche (4) eingepresst sind und in elektrischen Kontaktbereichen (9) innerhalb der Kontaktdurchbrüche (4) elektrischer Kontakt zwischen einem Einpresskontakt (8) und der Durchkontaktierung (5) des Kontaktdurchbruchs (4) besteht. Aufgabe der Erfindung ist es Leiterplatten von elektrischen Antrieben, die Feuchtigkeit und anderen chemischen Umwelteinflüssen ausgesetzt sind, zuverlässig zu schützen und dennoch wirtschaftlich zu kontaktieren. Diese Aufgabe wird erfindungsgemäß dadurch gelöst, dass die Schutzschicht (7) eine Parylene-Beschichtung ist, welche die Leiterplatte (2), die elektronischen Bauteile (6) und die unmittelbar an die Kontaktbereiche (9) zwischen zumindest einem Einpresskontakt (8) und zumindest einem Kontaktdurchbruch (4) anschließenden Oberflächenbereiche der Kontaktdurchbrüche (4) und der Leiterplatte (2) abdeckt.

Abstract translation: 驱动器具有形成在电路板（2）的安装表面上的一组导体轨迹（3）。 一组触点开口具有形成在板上的通孔（5）。 电子部件（6）安装在表面上，其中在安装表面上形成聚对二甲苯涂层（7），轨道，开口和板的表面直接连接在压配合触点之间的电接触区域（9） 8）和接触开口。 压配合触头插入到开口和接触区域中，使得在压配合触头和孔之间存在电接触。 电气元件是表面贴装元件（SMD）。 还包括用于制造电驱动组件的方法的独立权利要求。

公开(公告)号：EP2130417A2

公开(公告)日：2009-12-09

申请号：EP08709439.7

申请日：2008-02-18

Applicant: Crombie 123 Limited

Inventor： FERDINANDI, Frank ,  SMITH, Rodney, Edward ,  HUMPHRIES, Mark, Robson

IPC: H05K3/28

CPC classification number: H05K1/02 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45686 ,  H01L2224/4569 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48647 ,  H01L2224/48747 ,  H01L2224/48847 ,  H01L2224/81024 ,  H01L2224/81395 ,  H01L2224/81815 ,  H01L2224/83024 ,  H01L2224/83205 ,  H01L2224/83395 ,  H01L2224/83815 ,  H01L2224/85203 ,  H01L2224/85207 ,  H01L2224/85395 ,  H01L2224/85447 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/00 ,  H05K3/282 ,  H05K3/285 ,  H05K3/288 ,  H05K3/3484 ,  H05K3/3489 ,  H05K3/3494 ,  H05K2201/015 ,  H05K2201/0179 ,  H05K2203/092 ,  H05K2203/107 ,  H05K2203/1338 ,  H05K2203/1366 ,  H05K2203/1372 ,  H05K2203/1383 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A printed circuit board to which a localised solder connection is to be made, the surface of said printed circuit board having a continuous or non-continuous coating of a composition comprising a halo-hydrocarbon polymer at a thickness of from 1 nm to 10 mum.

Abstract translation: 印刷电路板，其上要形成局部焊接连接，所述印刷电路板的表面具有包含厚度为1nm至10μm的卤代烃聚合物的组合物的连续或不连续涂层。

公开(公告)号：EP1764810B1

公开(公告)日：2009-01-14

申请号：EP06012013.6

申请日：2006-06-12

Applicant: E.I. DU PONT DE NEMOURS AND COMPANY

Inventor： Suh, Seigi ,  Borland, William, J.

IPC: H01G4/12 ,  H05K1/16

CPC classification number: H01L21/02197 ,  H01G4/1227 ,  H01L21/02282 ,  H01L21/02337 ,  H01L21/31691 ,  H01L28/55 ,  H05K1/162 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0355

Abstract: The present invention is directed to a dielectric thin film composition comprising: (1) one or more barium/titanium-containing additives selected from (a) barium titanate, (b) any composition that can form barium titanate during firing, and (c) mixtures thereof; dissolved in (2) organic medium; and wherein said thin film composition is doped with 0.002 - 0.05 atom percent of a dopant comprising an element selected from Sc, Cr, Fe, Co, Ni, Ca, Zn, Al, Ga, Y, Nd, Sm, Eu, Gd, Dy, Ho, Er, Yb, Lu and mixtures thereof and to capacitors comprising such compositions.

公开(公告)号：EP1699275A3

公开(公告)日：2008-10-29

申请号：EP06004062.3

申请日：2006-02-28

Applicant: Samsung Electro-Mechanics Co., Ltd

Inventor： Ahn, Jin Yong ,  Hwang, Cheol Seong ,  Kim, Sung Kun ,  Ryu, Chang Sup ,  Cho, Suk Hyeon ,  Jeon, Ho Sik

IPC: H05K1/16

CPC classification number: H05K1/162 ,  H01L2924/0002 ,  H05K1/095 ,  H05K3/108 ,  H05K3/244 ,  H05K3/4652 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/09509 ,  H05K2201/09881 ,  Y10S438/957 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/4913 ,  Y10T29/49155 ,  H01L2924/00

Abstract: Disclosed is a printed circuit board (101) having embedded capacitors therein, comprising: a double-sided copper-clad laminate including first circuit layers formed in the outer layers (102) thereof, the first circuit layers including bottom electrodes and circuit patterns; dielectric layers (105) formed by depositing alumina films on the first circuit layers by atomic layer deposition; second circuit layers (106) formed on the dielectric layers and including top electrodes and circuit patterns; one-sided copper-clad laminates (108;109) formed on the second circuit layers; blind via-holes (111) and through-holes (110) formed in predetermined portions of the one-sided copper-clad laminates; and plating layers formed in the blind via-holes (111) and the through-holes (110). The manufacturing method of the printed circuit board is also disclosed.

公开(公告)号：EP1976349A2

公开(公告)日：2008-10-01

申请号：EP08012912.5

申请日：2005-07-20

Applicant: Endicott Interconnect Technologies, Inc.

Inventor： Desai, Subahu D. ,  Lin, How T. ,  Lauffer, John M. ,  Markovich, Voya R. ,  Thomas, David L.

IPC: H05K1/16 ,  G11C11/22

CPC classification number: G11C11/22 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/3011 ,  H05K1/16 ,  H05K2201/0166 ,  H05K2201/0179 ,  H05K2201/09763 ,  H05K2201/10159 ,  H01L2224/0401

Abstract: A circuitized substrate (11) comprised of at least one dielectric material (13) having an electrically conductive pattern thereon. At least part of the pattern is used as the first layer of an organic memory device (35) which further includes at least a second dielectric layer over the pattern and a second pattern aligned with respect to the lower part for achieving several points of contact to thus form the device. The substrate (11) is preferably combined with other dielectric-circuit layered assemblies to form a multilayered substrate on which can be positioned discrete electronic components (e.g., a logic chip) coupled to the internal memory device to work in combination therewith. An electrical assembly (71) capable of using the substrate is also provided, as is an information handling system (101) adapted for using one or more such electrical assemblies as part thereof.

Abstract translation: 甲电路化衬底（11），包括具有在其上在导电图案的至少一个电介质材料（13）的。 在图案的至少一部分被用作有机存储器装置（35），其还包括至少在相对于对准下部用于向实现联系的几个点的图案和第二图案的第二介电层的第一层 因此形成该设备。 基板（11）优选地与其他介电电路层状组件组合，以形成耦合到内部存储器装置上可定位的分立电子元件的多层基板（E. G.，逻辑芯片）结合在那里工作。 因此，为了电气组件（71）能够使用设置在基材上，如用于使用一个或多个搜索电气组件作为其一部分的信息处理系统（101）。

公开(公告)号：EP1956872A2

公开(公告)日：2008-08-13

申请号：EP08250440.8

申请日：2008-02-06

Applicant: Raytheon Company

Inventor： Moore, Michael A. ,  Bedinger, John M.

IPC: H05K1/00

CPC classification number: H05K3/284 ,  H01L23/3192 ,  H01L23/4821 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/83851 ,  H01L2224/8592 ,  H01L2924/00011 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/0781 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/19041 ,  H05K2201/0179 ,  H05K2201/0195 ,  H05K2203/1322 ,  Y10T29/49124 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49982 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/29075 ,  H01L2924/00014

Abstract: According to one embodiment of the disclosure, an environmental protection coating comprises a circuit assembly (10;40;140) having a first protective dielectric layer (22;50;150) and a second dielectric layer (24;56;156). The circuit assembly has an outer surface (14;44) on which a plurality of discrete electrical components (16;46;216) are attached. The first protective dielectric layer (22;50;150) overlays the circuit assembly (10;40;140). The second dielectric layer (24;56;156) overlays the first protective dielectric layer and is made of a dielectric material having modulus of elasticity less than 3.5 Giga-Pascal (GPa), dielectric constant less than 2.7, dielectric loss less than 0.008, breakdown voltage strength in excess of 2 million volts/centimeter (MV/cm), temperature stability to 300° Celsius, defect densities less than 0.5/centimeter, pinhole free in films greater than 50 Angstroms, capable of being deposited conformally over and under 3D structures with thickness uniformity less than or equal to 10%.

Abstract translation: 根据本公开的一个实施例，环境保护涂层包括具有第一保护介电层（22; 50; 150）和第二介电层（24; 56; 156）的电路组件（10; 40; 140）。 电路组件具有外表面（14; 44），多个分立的电气部件（16; 46; 216）附接在该外表面上。 第一保护介电层（22; 50; 150）覆盖电路组件（10; 40; 140）。 第二电介质层（24; 56; 156）覆盖第一保护介电层，并由弹性模量小于3.5千兆帕（GPa），介电常数小于2.7，介电损耗小于0.008的介电材料制成， 击穿电压强度超过200万伏/厘米（MV /厘米），温度稳定在300摄氏度，缺陷密度小于0.5厘米，薄膜中无针孔大于50埃，能够平滑地沉积在3D和3D之下 厚度均匀度小于或等于10％的结构。

公开(公告)号：EP1951011A2

公开(公告)日：2008-07-30

申请号：EP08000848.5

申请日：2008-01-17

Applicant: Hitachi, Ltd.

Inventor： Abe, Hiroyuki c/o Hitachi, Ltd., Intell. Property Group ,  Igarashi, Shinya c/o Hitachi Car Engineering Co., Ltd.

IPC: H05K3/24 ,  H05K3/28

CPC classification number: H05K3/24 ,  H01L24/16 ,  H01L25/165 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K3/244 ,  H05K3/28 ,  H05K3/3463 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2203/1322 ,  H01L2224/0401

Abstract: According to the present invention an electronic device, which is to be installed in an engine room, comprises a circuit board 11, electronic elements, which are carried by the circuit board 11 and function when electricity is applied from the circuit board 11 to them, a case 3 that accommodates the circuit board 11 on which the electronic elements are disposed, and a cover 6 that covers an opening of the case 3, the entire surface of a conductor pattern formed of a conductive material on the circuit board is covered with a barrier metallic film made of a metal other than the metal of the conductive material having a property of mutual diffusion with a solder material, and the barrier metallic film is further covered with a protective insulating film.

Abstract translation: 根据本发明，要安装在发动机室中的电子设备包括电路板11，由电路板11承载的电子元件，以及当从电路板11向其施加电力时的功能， 容纳设置有电子元件的电路板11的壳体3和覆盖壳体3的开口的盖6，由电路板上的导电材料形成的导体图案的整个表面覆盖有 由具有与焊料材料相互扩散的性质的导电材料的金属以外的金属制成的阻挡金属膜，并且阻挡金属膜进一步被保护绝缘膜覆盖。

公开(公告)号：EP1861867A1

公开(公告)日：2007-12-05

申请号：EP06738282.0

申请日：2006-03-14

Applicant: Medtronic MiniMed, Inc.

Inventor： SHAH, Rajiv ,  PENDO, Shaun

IPC: H01L21/288 ,  H01L21/48

CPC classification number: H05K1/162 ,  H01L21/4857 ,  H01L21/4867 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/19105 ,  H05K3/048 ,  H05K3/06 ,  H05K3/4053 ,  H05K3/4061 ,  H05K3/4664 ,  H05K3/467 ,  H05K2201/0179 ,  H05K2203/0278 ,  H05K2203/085 ,  H05K2203/1476 ,  H05K2203/308 ,  H01L2924/00

Abstract: A multilayer circuit includes a dielectric base substrate, conductors formed on the base substrate and a vacuum deposited dielectric thin film formed over the conductors and the base substrate. The vacuum deposited dielectric thin film is patterned using sacrificial structures formed by electroplating techniques. Substrates formed in this manner enable significant increases in circuit pattern miniaturization, circuit pattern reliability, interconnect density and significant reduction of over-all substrate thickness.