公开(公告)号：EP2196514A4

公开(公告)日：2011-11-16

申请号：EP08835881

申请日：2008-10-02

Applicant: HITACHI CHEMICAL CO LTD

Inventor： KONNO KAORU ,  HAYASHI HIROKI ,  KAWAMORI TAKASHI

IPC: H05K3/32 ,  C09J9/02 ,  C09J11/04 ,  H01B1/22 ,  H01L21/60

CPC classification number: H01L24/16 ,  B22F1/0059 ,  B22F2001/0066 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/262 ,  B23K35/264 ,  B23K35/302 ,  B23K35/3613 ,  B23K35/3618 ,  B23K35/362 ,  B23K35/365 ,  C08K3/0066 ,  C08K3/017 ,  C08K3/08 ,  C09J9/02 ,  C09J11/04 ,  H01B1/22 ,  H01L24/12 ,  H01L2224/05568 ,  H01L2224/13099 ,  H01L2224/1329 ,  H01L2224/13347 ,  H01L2224/13439 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/19043 ,  H01L2924/20107 ,  H05K1/141 ,  H05K3/321 ,  H05K2201/0272 ,  H05K2203/0425 ,  Y10T428/31511 ,  Y10T428/31678 ,  H01L2924/00 ,  H01L2224/05599

Abstract: There are provided are an adhesive composition that keeps storage stability and further gives a cured product wherein metallic bonds are formed in the state that the cured product wets its components and is satisfactorily spread between the components (or parts), thereby turning excellent in adhesive property, electroconductivity, and reliability for mounting such as TCT resistance or high-temperature standing resistance; an electronic-component-mounted substrate using the same; and a semiconductor device. The adhesive composition comprises electroconductive particles (A) and a binder component (B), wherein the electroconductive particles (A) include a metal (a1) having a melting point equal to or higher than the reflow temperature and containing no lead, and a metal (a2) having a melting point lower than the reflow temperature and containing no lead, and the binder component (B) includes a thermosetting resin composition (b1) and an aliphatic dihydroxycarboxylic acid (b2).

公开(公告)号：EP2291471A1

公开(公告)日：2011-03-09

申请号：EP09763676.5

申请日：2009-06-11

Applicant: NanoMas Technologies, Inc.

Inventor： DU, Yu ,  XU, Zhiyong ,  YANG, Zhihao

IPC: C09D11/00 ,  H01B1/22

CPC classification number: H01B1/22 ,  C08K3/08 ,  C09D7/67 ,  C09D7/69 ,  C09D7/70 ,  C09D11/037 ,  C09D11/52 ,  C09D17/006 ,  H05K1/097 ,  H05K2201/0266 ,  H05K2201/0272

Abstract: A composition comprises at least one silver nanoparticulate material, at least one conductive microparticulate material, and less than about 3% wt of an organic or polymeric resin. The composition provides a low curing temperature and upon cure good film properties. Also provided herein is a method of using an ink or paste, comprising: (i) providing the ink or paste comprising at least one silver nanoparticulate material, at least one conductive microparticulate material, and less than about 3% wt of an organic or polymeric resin; and (ii) curing the ink or paste at a temperature at lower than about 200° C. to decompose the organic resin.

公开(公告)号：EP1981320A4

公开(公告)日：2011-03-02

申请号：EP07713685

申请日：2007-01-23

Applicant: HITACHI METALS LTD

Inventor： IKEDA HATSUO ,  ICHIKAWA KOJI

IPC: H05K1/09 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K1/092 ,  H05K3/4061 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/0272 ,  Y10T428/24273 ,  Y10T428/24322 ,  Y10T428/24331 ,  Y10T428/24339 ,  Y10T428/24347 ,  Y10T428/24893 ,  Y10T428/24909

公开(公告)号：EP1876604B1

公开(公告)日：2011-02-09

申请号：EP06729264.9

申请日：2006-03-16

Applicant: ASAHI GLASS COMPANY LTD.

Inventor： HIRAKOSO, Hideyuki Asahi Glass Company, Ltd. ,  ABE, Keisuke c/o Asahi Glass Company, Ltd. ,  SANADA, Yasuhiro c/o Asahi Glass Company, Ltd.

IPC: H01B1/22 ,  C09D5/24 ,  H01L21/60

CPC classification number: H01L23/49883 ,  C09D11/30 ,  C09D11/52 ,  H01B1/22 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/097 ,  H05K3/125 ,  H05K2201/0272 ,  Y10T428/24355 ,  H01L2924/00

Abstract: Disclosed is an ink composition which enables to form a metallic material exhibiting excellent adhesion to a base while being free from ion migration. Specifically disclosed is an ink composition obtained by dispersing fine particles of metallic copper and/or copper hydride and fine particles of silver oxide or metallic silver in a water-insoluble organic liquid. This ink composition has a solid content concentration of 10-80% by mass, and contains 5-90 parts by mass of the metallic copper and/or copper hydride fine particles and 10-95 parts by mass of the silver oxide or metallic silver fine particles per 100 parts by mass of the total solid content in the ink composition.

公开(公告)号：EP2216790A1

公开(公告)日：2010-08-11

申请号：EP08853410.2

申请日：2008-11-21

Applicant: Panasonic Corporation

Inventor： HIGUCHI, Takayuki ,  MIYAKAWA, Hidenori ,  YAMAGUCHI, Atsushi ,  KISHI, Arata ,  OHASHI, Naomichi

IPC: H01B1/22 ,  H01B1/00 ,  H05K3/32

CPC classification number: H05K3/321 ,  H01B1/22 ,  H05K2201/0272 ,  H05K2203/0425 ,  Y10T29/49128 ,  Y10T29/4913

Abstract: Disclosed is an electrically conductive paste which enables to reduce the level of void growth in a conducting pathway formed in a joint part produced after curing the electrically conductive paste in the implementation of an electronic component on a circuit board by using the electrically conductive paste, and which contains a reduced amount of a viscosity-adjusting/thixotropy-imparting additive. Two Sn-containing low-melting-point alloy particles having different melting points and different average particle diameters are selected as electrically conductive filler components to be used in an electrically conductive paste, and the two alloy particles are mixed at a predetermined ratio for use.

Abstract translation: 公开了一种导电性糊剂，其能够通过使用导电性糊料来降低在电路板上实施电子部件固化导电性糊料后所形成的接合部中形成的导电路径中的空隙生长水平， 其含有减少量的粘度调节/触变性添加剂。 选择具有不同熔点和不同平均粒径的两种含Sn的低熔点合金颗粒作为用于导电浆料的导电填料组分，并将两种合金颗粒以预定比例混合使用。

公开(公告)号：EP2159805A1

公开(公告)日：2010-03-03

申请号：EP09173628.0

申请日：2006-08-31

Applicant: BASF SE

Inventor： Schneider, Norbert ,  Lippert, Gerald ,  Lochtman, Rene ,  Maas, Heiko ,  Pfister, Jürgen ,  Sobotka, Bettina ,  Wagner, Norbert

IPC: H01B1/22 ,  C08K3/08 ,  C08K7/06

CPC classification number: H01B1/22 ,  C09D5/24 ,  H05K1/095 ,  H05K3/246 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/0272 ,  H05K2201/0347 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/258

Abstract: Die vorliegende Erfindung betrifft eine Dispersion zum Aufbringen einer Metallschicht auf einem elektrisch nicht leitfähigen Substrat enthaltend eine organischen Bindemittelkomponente, eine Metallkomponente mit unterschiedlichen Metallen und/oder Metallteilchenformen sowie einer Lösemittelkomponente. Weiterhin betrifft die Erfindung Verfahren zur Herstellung der Dispersion, Verfahren zur Herstellung einer gegebenenfalls strukturierten Metallschicht mit Hilfe der Dispersion sowie die erhaltenen Substratoberflächen und deren Verwendung.

Abstract translation: 分散体在上电等非导电基底包括有机粘合剂成分的施加金属层（0.01-30重量％）; （0.01-99.99％（重量）），其包含第一金属具有第一金属粒子和具有第二金属粒子的第二金属的金属组分（30-89.99重量％。）（99.99-0.01重量％）; 和溶剂组分（10-69.99重量％。）; 其中，所述第一金属和 - 粒子和第二金属和 - 粒子是从海誓山盟不同。 独立权利要求中包括了：（1）用于制备分散体，包括有机粘合剂成分的混合的方法中，金属成分包含具有第一金属粒子和具有第二金属粒子的第二金属，溶剂组分的第一种金属，分散剂 ，填料组分和另外的组分，和所获得的混合物分散; （2）金属层的制备上的至少一个电其他非导电基底包括将所述分散体在基板上的一部分，干燥在基材上和该分散体中的应用层OPTIONALLY去激励和/或电气上的干燥的分离金属 分散层; 和（3）的表面的衬底，其包含至少一个部分导电金属层。

公开(公告)号：EP1926784B1

公开(公告)日：2010-01-13

申请号：EP06793112.1

申请日：2006-08-31

Applicant: BASF SE

Inventor： SCHNEIDER, Norbert ,  LIPPERT, Gerald ,  LOCHTMAN, Rene ,  MAAS, Heiko ,  PFISTER, Jürgen ,  SOBOTKA, Bettina ,  WAGNER, Norbert

IPC: C09D5/24

CPC classification number: H01B1/22 ,  C09D5/24 ,  H05K1/095 ,  H05K3/246 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/0272 ,  H05K2201/0347 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/258

Abstract: The invention relates to a dispersion for applying a metal layer to an electrically non-conductive substrate containing an organic binder component, a metal component with different metals and/or metal particle shapes, and a solvent component. The invention further relates to methods for producing said dispersion, methods for creating an optionally structured metal layer with the aid of the dispersion, the obtained substrate surfaces, and the use thereof.

公开(公告)号：EP1981320A1

公开(公告)日：2008-10-15

申请号：EP07713685.1

申请日：2007-01-23

Applicant: Hitachi Metals Precision, Ltd.

Inventor： IKEDA, Hatsuo ,  ICHIKAWA, Koji

IPC: H05K3/46

CPC classification number: H05K1/092 ,  H05K3/4061 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/0272 ,  Y10T428/24273 ,  Y10T428/24322 ,  Y10T428/24331 ,  Y10T428/24339 ,  Y10T428/24347 ,  Y10T428/24893 ,  Y10T428/24909

Abstract: A conductive paste comprising 88-94% by mass of Ag powder having an average particle size of 3 µm or less and 0.1-3% by mass of Pd powder, the total amount of the Ag powder and the Pd powder being 88.1-95% by mass. A multilayer ceramic substrate obtained by laminating and sintering pluralities of ceramic green sheets, and having conductor patterns and via-conductors inside, the via-conductors being formed in via-holes having diameters of 150 µm or less after sintering, containing Ag crystal particles having a particle size of 25 µm or more, and having a porosity of 10% or less.

Abstract translation: 包含平均粒径为3μm以下的Ag粉末88〜94质量％，Pd粉末为0.1〜3质量％的导电性糊剂，Ag粉末和Pd粉末的总量为88.1〜95质量％ 的。 一种多层陶瓷基板，其通过在多个陶瓷生片层叠并烧结多个陶瓷生片，并且在其内部具有导体图案和通孔导体，所述通孔导体形成在烧结后的直径为150μm以下的通孔中，该通孔导体包含具有 粒径为25μm以上，孔隙率为10％以下。

公开(公告)号：EP1541654A4

公开(公告)日：2008-07-09

申请号：EP02765410

申请日：2002-09-04

Applicant: NAMICS CORP ,  SUGANUMA KATSUAKI

Inventor： KOMAGATA MICHINORI ,  SHIRAI YUKIO ,  SUZUKI KENICHI ,  SUGANUMA KATSUAKI

IPC: C08K3/08 ,  C09J9/02 ,  C09J11/04 ,  H01B1/22 ,  H05K3/32

CPC classification number: H01B1/22 ,  C08K3/08 ,  C09J9/02 ,  C09J2205/102 ,  H05K3/321 ,  H05K2201/0218 ,  H05K2201/0272

Abstract: The present invention provides a conductive adhesive comprising conductive particles and a resin wherein 30% by weight or more of the conductive particles substantially comprise silver and tin, and a molar ratio of silver and tin in the metal components of the conductive adhesive is in the range of 77.5 : 22.5 to 0 : 100; and a circuit connected by using the conductive adhesive.

公开(公告)号：EP1614500A4

公开(公告)日：2006-05-10

申请号：EP04724798

申请日：2004-03-31

Applicant: SENJU METAL INDUSTRY CO ,  MATSUSHITA ELECTRIC IND CO LTD

Inventor： HIRATA MASAHIKO ,  TAGUCHI TOSHIHIKO ,  OKUYAMA MASANOBU ,  TOYODA YOSHITAKA

IPC: B23K35/02 ,  B23K35/14 ,  B23K35/26 ,  H05K3/34 ,  B23K35/22

CPC classification number: H05K3/3484 ,  B23K35/0244 ,  B23K35/262 ,  H05K3/3463 ,  H05K2201/0272

Abstract: A solder paste prepared by kneading an alloy powder and a flux, wherein the alloy powder is a mixed powder of at least one Sn-Zn based alloy powder and at least one Sn-Ag based alloy powder which optionally contains one or more of Bi, In, Cu and Sb, wherein the mixed powder contains 5 to 10 mass % of Zn, 0.005 to 1.5 mass % of Ag, and optionally contains one or more of 0.002 to 1.0 mass % of Cu, 0.005 to 15 mass % of Bi, 0.005 to 15 mass % of In, 0.005 to 1.0 mass % of Sb, and contains the balanced amount of Sn.